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Tools

All tools in one place: the Hub's own calculators and utilities, and an index of the tools engineers use across the industry. Usable without sign-in. Sign in to save your inputs and subscribe to MPW shuttle alerts.

Hub utilities

Die per wafer

Gross-die yield off wafer size, die size and edge exclusion.

SoC Specification & ArchitectureFoundry & MaskProduction Ramp & Yield
Yield estimate

Poisson-model gross-die yield from defect density.

SoC Specification & ArchitectureProduction Ramp & Yield
Package / ASIC cost

Parametric per-unit cost: silicon, package, test, NRE.

SoC Specification & ArchitecturePackaging & Test
Chip cost calculator

Full AI-accelerator cost bridge: logic die, HBM, packaging and test.

SoC Specification & Architecture
Packaging model

Compare CoWoS-S, CoWoS-L, EMIB, SoIC and flip-chip cost and HBM-stack support.

Packaging & TestInterposer & Substrate Design
Cost bridge chart

Side-by-side manufacturing cost comparison across AI accelerators.

SoC Specification & Architecture
Price / performance frontier

Compare accelerators on cost, throughput and TCO.

SoC Specification & Architecture
Allocation dashboard

Foundry, CoWoS and HBM allocation status across fabs and process nodes.

Foundry & MaskProduction Ramp & Yield
Tapeout decision workspace

Guided workflow for fabless teams evaluating a tapeout: definition through go/no-go.

Physical Design & Sign-offTape-out
Unit converter

mm, mil, µm, inch, cm: the ones you actually convert between.

Chat with Datasheets

Upload a PDF, ask questions with page citations, extract and compare parameters. Paid plans.

SoC Specification & ArchitectureIP Specification & Architecture
Product type classifier

Classify a change into one of the Hub's ten product types and see its obligations, deliverables and gates.

SoC Specification & Architecture
Design review assistant

Upload a schematic or BOM PDF for a general sanity check: not a substitute for real DRC/ERC tooling. Paid plans.

Bring-up & Silicon Validation
EBITDA calculator

Net income plus interest, taxes, depreciation and amortization, with margin.

ROI calculator

Return on investment, plus an annualized rate over a holding period.

CAGR calculator

Compound annual growth rate between a beginning and ending value.

Business case calculator

COGS, ASP, margin, breakeven, NRE payback, NPV/IRR and TAM/SAM/SOM for a semiconductor product: savable, with an AI viability narrative.

SoC Specification & Architecture
Product and project planner

Plan, schedule and track a programme on any Hub lifecycle: Gantt chart with critical path, baselines, RAID log, change control, gate reviews, role reports and MS Project XML export. Paid plans.

SoC Specification & ArchitectureTape-out

Where along the chip lifecycle the utilities help

How many Hub utilities are tagged to each lifecycle stage, in the order the stages run. Select a stage to see its utilities.

Engineering tools

Calculators, worksheets and planners for the work along the chip lifecycles, each on its own page with its method, assumptions and sources. Calculators are free to use; worksheets, checklists, trackers and planners are for members.

Cost and business

Mask, wafer, test and bill of materials costs, sourcing choices and end-of-life buys.

Reliability

Failure rates, stress tests, qualification plans and radiation effects.

Quality statistics

Process capability, measurement systems, control charts and test limits.

Quality worksheets

FMEA, control plans, 8D, traceability and the other records audits ask for.

Safety and security

Functional safety metrics, integrity levels, threat and vulnerability ratings.

Digital and physical design

Power, thermal, area, interconnect and the design records engineers keep.

Analog, RF, photonics and packaging

Converters, RF chains, matching, links and package electrical limits.

Manufacturing, fab and supply

Capacity, equipment, cleanrooms, spares and supply decisions.

AI, systems and startup

AI compute sizing, certification, schedules, pipelines and company finance.

Industry tools index

120 of 4,606 tools, ranked by how many roles use each one. Category and company are a best-effort match on the tool's name, not a hand-curated taxonomy.

Open source only 135Includes the open-source chip-design tools from IIC-OSIC-TOOLS (JKU Linz) and Efabless, each with a description.
Advantest V93000 33· AdvantestTeradyne UltraFLEX 24· TeradyneAdvantest V93000 SmarTest 4· AdvantestKeysight B1500A parametric analyzer 3· KeysightArticulate Storyline 3Aehr Test Systems Burn-In 3· Aehr Test SystemsAdvantest V93000 / Teradyne UltraFLEX 3· AdvantestFormFactor probe cards 2· FormFactorNordson DAGE bond tester 2· NordsonArticulate 360 2DISCO grinders and dicing saws 2· DISCOSNIA solid state storage test suites 2Cascade Microtech probe stations 2· Cascade MicrotechTeradyne TestStation 2· TeradyneKeysight B1500 parametric analyser 1· KeysightNordson DAGE 4000 shear tester 1· NordsonAdvantest V93000 with WaveScale RF / MX 1· Advantestgem5 or in-house cycle-approximate simulators 1ASMPT AD830 and Besi Datacon die bonders 1· BesiAdvantest / Keysight WAT testers 1· KeysightAdvantest V93000 SmarTest 8 / EXA Scale 1· AdvantestQDevil QDAC Gate Voltage Sources 1LinkedIn / X corporate channels 1Advantest/Teradyne test data systems 1· AdvantestInstron and Nordson DAGE mechanical testers 1· NordsonAdvantest / Teradyne memory testers for bitmaps 1· AdvantestAnaqua / Clarivate IPfolio 1· AnaquaCohu Matrix / Rasco handlers 1· CohuAdvantest V93000 and T2000 1· AdvantestAdvantest and Teradyne tester fleets 1· AdvantestAdvantest and Teradyne ATE for interim electrical test 1· AdvantestDISCO grinders and dicers 1· DISCOFormFactor mmWave Probe Station 1· FormFactorChroma and Aehr burn-in systems 1· ChromaTeradyne UltraFLEX and J750 1· TeradyneAdvantest V93000 and Teradyne UltraFLEX 1· AdvantestBench probe stations 1Smaract / Cascade Probe Stations 1Cohu / Advantest handlers, TEL / Accretech probers 1· AdvantestAWS IoT Device Management and Azure Device Update 1· MicrosoftCascade/FormFactor probe stations 1· FormFactorTeradyne UltraFLEXplus with UltraWave 1· TeradyneAdvantest V93000 for pre/post-stress test 1· AdvantestKeysight parametric test systems 1· KeysightAdvantest and Teradyne ATE provisioning plug-ins 1· AdvantestYocto Project with shared state cache 1Micro Control Company burn-in systems 1Articulate 360 for course authoring 1Advantest and Teradyne pattern conversion utilities 1· AdvantestASMPT TCB bonders 1· ASMPTAdvantest V93000 with high-parallelism DUT interfaces 1· AdvantestDISCO dicing saws and laser dicers 1· DISCOFormFactor and Technoprobe probe card tooling 1· FormFactoriThenticate Plagiarism Screening 1Instron Mechanical Test Frames 1· InstronModel N pricing and rebate management 1Thermal Chuck Probe Stations (up to 250C) 1EVG GEMINI and SUSS MicroTec bonders 1· EV GroupCohu Diamondx / Eagle Test 1· CohuModel N or Vistex pricing and rebate management 1
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MPW shuttle calendar

Full calendar →
UMC · 28N Logic/Mixed-Mode – HPC · EUROPRACTICE
TSMC · 22nm CMOS Logic or RF ULL (w/ or wo/ ReRam) · EUROPRACTICE
ams OSRAM · 0.35µ CMOS C35B4C3 4M/2P/HR/5V IO · EUROPRACTICE