MPW shuttle cost planner
Plan a multi-project wafer run: block area, price per square millimetre, die delivered and extra runs, and the point where a dedicated mask set pays off.
Cost and businessFree to useHow it worksSourcesWhere it helps
Fills the inputs below with typical figures. Replace any of them with your own.
- Cost of one MPW run
- $18,818
- 2.25 mm2 billed, area charge $18,068
- Total over 2 runs
- $37,635
- $940.88 per delivered die
- Dedicated total, same runs
- $637,500
- $4.57 per die (69,696 die a run)
- Break-even number of runs
- None
- Each dedicated run costs more than an MPW run, so the MPW stays cheaper however many runs you plan.
- Break-even area
- 39.6 mm2
- Over 2 runs, a dedicated set is cheaper once the submission passes about 39.6 mm2.
- Block after rounding
- 1.5 by 1.5 mm
- 2.25 mm2 each, 2.25 mm2 in all
- Area charge$18,06896%
- Packaging$250.001%
- Test$200.001%
- Shipping$300.002%
Show the data as a table
| Item | Cost (USD) |
|---|---|
| Area charge | $18,068 |
| Packaging | $250.00 |
| Test | $200.00 |
| Shipping | $300.00 |
Sign in to save your inputs and come back to them later.
- MPW (solid line, circles)
- Dedicated mask set (dashed line, squares)
Show the data as a table
| Runs | MPW | Dedicated mask set |
|---|---|---|
| 1 | $18,818 | $318,750 |
| 2 | $37,635 | $637,500 |
| 3 | $56,453 | $956,250 |
| 4 | $75,270 | $1.27 m |
| 5 | $94,088 | $1.59 m |
| 6 | $112,905 | $1.91 m |
| Runs | MPW total (USD) | Dedicated total (USD) | Cheaper |
|---|---|---|---|
| 1 | $18,818 | $318,750 | MPW |
| 2 | $37,635 | $637,500 | MPW |
| 3 | $56,453 | $956,250 | MPW |
| 4 | $75,270 | $1,275,000 | MPW |
| 5 | $94,088 | $1,593,750 | MPW |
| 6 | $112,905 | $1,912,500 | MPW |
How it works
A multi-project wafer (MPW) shuttle shares one mask set and one wafer lot between many customers, so a small prototype is billed by the area it occupies. This tool prices a block from the provider's price per square millimetre, its minimum area and its grid, adds samples, packaging, test and shipping, repeats it over your planned runs and finds where a dedicated mask set becomes cheaper.
- Round the block to the provider's grid. Providers place blocks on a grid, so each side is rounded up to the next grid step. Several designs on one submission add their areas; designs submitted apart are billed one by one, each with its own minimum.
side = ceiling(side / grid) x grid; block area = width x height; submission area = designs x block area (one submission) or block area (each design apart) - Find the billed area and the area charge. The provider bills at least its minimum area, and some bill in whole steps or blocks. Some price lists give a first square millimetre at one price and further area at a lower one; the tool supports that tier. The price is in euros and is converted at the rate you enter.
billed area = max(minimum area, ceiling(area / step) x step); area charge = (min(area, tier) x price + max(0, area − tier) x price beyond) x USD per EUR - Add samples, packaging, test and shipping. A run delivers a standard number of unpackaged die. Wanting more means buying extra samples. Packaging and test apply to the die you package. Shipping and any extras you pay for each run are added.
extra samples = max(0, wanted − delivered); cost per run = area charge + extra samples x extra price + packaged x (packaging + test) + shipping + extras per run - Repeat over the planned runs. Prototype work usually takes several iterations. The one-off costs (design kit, set-up) are paid once.
MPW total = runs x cost per run + one-off costs; cost per delivered die = MPW total / (runs x die delivered per run) - Cost the dedicated alternative. A dedicated run buys a mask set and a lot of wafers. A later iteration repeats the wafers and a share of the mask cost (100% for a full new set, less for a metal-only fix; enter a multi-layer reticle price as the mask set if you use one). The die area gives the die on each wafer and so the die you receive.
dedicated total = mask set x (1 + (runs − 1) x re-spin share) + runs x wafers per run x wafer cost + the same packaging, test, shipping and extras as MPW; die per wafer = pi x (d / 2)^2 / A − pi x d / sqrt(2 x A) - Find the break-even. Both totals are straight lines in the number of runs. Let A be the MPW fabrication cost of a run (area charge plus extra samples) and D the dedicated cost of a later run (re-spin share of the mask plus wafers). The break-even number of runs follows. The break-even area is the area for which the MPW area charge equals the dedicated cost over your planned runs.
break-even runs = mask set x (1 − re-spin share) / (A − D); break-even charge = (dedicated fabrication over the runs − runs x extra samples) / runs, converted back to area through the price
Assumptions
- The provider price presets are published standard list prices in euros for 2026 and change often; they are starting points to be replaced by a quote. Academic and discounted prices are lower and depend on eligibility.
- Samples delivered, extra sample price, packaging, test, shipping and the mask and wafer figures for the dedicated run are editorial estimates; replace them with your own quotes.
- A dedicated run places all your blocks on one die whose area is the sum of the blocks; if the designs are separate products, each needs its own mask set.
- Packaging, test, shipping and extras are the same for MPW and dedicated, so the comparison turns on fabrication cost only.
- The exchange rate is a single editorial figure; set it to the rate you will really pay.
Limits and warnings
- Lead time, schedule and the number of shuttles a year are not priced; a dedicated run may start sooner than the next shuttle date, or later.
- Volume discounts, repeat-customer pricing, design kit and IP licence fees, and the cost of a seal ring or fill rules change real invoices; add them to the extras.
- Community shuttles that bill by tile, and shuttles with a fixed price per block, are modelled only through an equivalent price per square millimetre and a billing step.
- Dedicated mask prices depend on layer count and node; use the mask set cost estimator for a layer by layer figure.
- A multi-layer reticle or a shared reticle service is a middle path that is not modelled separately; enter its price as the mask set cost to compare it.
Sources
The methods and default figures rest on these public sources. The wording here is our own; read the source for its full text.
- Prototyping & Fabrication Services: MPW schedules and prices 2026 (opens in a new tab), Europractice IC service, 2026. Standard and discounted prices per square millimetre or per block, with minimum areas, for the provider presets.
- Tiny Tapeout sees industrial boost as it recovers from eFabless closure (opens in a new tab), eeNews Europe (Nick Flaherty), 16 May 2025. Community shuttle pricing by tile and by 100 chips, as context for small prototypes.
- The Dark Side Of The Semiconductor Design Renaissance: Fixed Costs Soaring Due To Photomask Sets, Verification, and Validation (opens in a new tab), SemiAnalysis (Dylan Patel), 24 July 2022. Published mask set cost ranges by node, which set the scale of the dedicated alternative.
Where it helps
The lifecycle stages this tool serves: 8 stages in 8 lifecycles.
More cost and business tools
- Mask set cost estimator
- Wafer cost model
- Test time and cost estimator
- Die area estimator
- Last-time buy calculator
- IP make or buy comparison
- FPGA, structured ASIC or ASIC crossover calculator
- Memory bit cost estimator
- Bill of materials cost roll-up
- Equipment cost of ownership calculator
- Platform reuse savings calculator
Method notev1Formula, ranges, sources and limits
Estimates the cost of a multi-project wafer run from block size, the provider's price per square millimetre, minimum area and grid, adds samples, packaging, test and shipping, repeats it over the planned runs and finds when a dedicated mask set costs less.
Formula
side = ceiling(side / grid) x grid; block area = width x height; submission area = designs x block area (one submission) or block area (each design apart); billed area = max(minimum area, ceiling(area / step) x step); area charge = (min(area, tier) x price + max(0, area − tier) x price beyond) x USD per EUR; extra samples = max(0, wanted − delivered); cost per run = area charge + extra samples x extra price + packaged x (packaging + test) + shipping + extras per run; MPW total = runs x cost per run + one-off costs; cost per delivered die = MPW total / (runs x die delivered per run); dedicated total = mask set x (1 + (runs − 1) x re-spin share) + runs x wafers per run x wafer cost + the same packaging, test, shipping and extras as MPW; die per wafer = pi x (d / 2)^2 / A − pi x d / sqrt(2 x A); break-even runs = mask set x (1 − re-spin share) / (A − D); break-even charge = (dedicated fabrication over the runs − runs x extra samples) / runs, converted back to area through the price
| Input | Unit | Range it holds for | Comes from |
|---|---|---|---|
| Provider and node | choice | ihp-sg13g2, gf-130-bcdlite, gf-28-slpe, gf-22-fdsoi, xfab-xh018, ams-c35, tsmc-65-mini, tsmc-28-mini, umc-180-block | Your figure |
| Provider price per square millimetre | EUR per mm2 | 0 to 50000 | Europractice standard list price 2026 for the chosen provider, converted at an editorial exchange rate. Reported, as of 2026. You can replace it with your own figure. |
| Area priced at the first price (0 for none) | mm2 | 0 to 100 | Your figure |
| Price beyond the first tier (0 for none) | EUR per mm2 | 0 to 50000 | Your figure |
| Minimum billed area | mm2 | 0 to 100 | Europractice standard list price 2026 for the chosen provider, converted at an editorial exchange rate. Reported, as of 2026. You can replace it with your own figure. |
| Grid for block sides (0 for none) | mm | 0 to 5 | Your figure |
| Billing step (0 for none) | mm2 | 0 to 100 | Your figure |
| Exchange rate | USD per EUR | 0.1 to 5 | Your figure |
| Block width | mm | 0 to 50 | Your figure |
| Block height | mm | 0 to 50 | Your figure |
| Designs or blocks | count | 1 to 100 | Your figure |
| Several designs are submitted | choice | one, separate | Your figure |
| Die delivered per submission | die | from 0 | Your figure |
| Die wanted per run | die | from 0 | Your figure |
| Price of each extra die | USD | from 0 | Your figure |
| Die packaged and tested per run | die | from 0 | Your figure |
| Packaging per die | USD | from 0 | Your figure |
| Test per die | USD | from 0 | Your figure |
| Runs planned | runs | 1 to 40 | Your figure |
| Shipping per run | USD | from 0 | Your figure |
| Other extras per run | USD | from 0 | Your figure |
| One-off extras | USD | from 0 | Your figure |
| Dedicated mask set (or multi-layer reticle) | USD | 0 to 100000000 | Editorial estimate, to be replaced by a quote. Editorial, as of 2026-10. You can replace it with your own figure. |
| Mask cost of each later run, share of the first set | % | 0 to 100 | Your figure |
| Wafer cost | USD | 0 to 50000 | Editorial estimate, to be replaced by a quote. Editorial, as of 2026-10. You can replace it with your own figure. |
| Wafers per dedicated run | wafers | 1 to 50 | Your figure |
| Wafer diameter | mm | 50 to 450 | Your figure |
| Die yield on the dedicated wafers | % | 0 to 100 | Your figure |
Outputs: Billed area per run (mm2); Cost of one run (USD); Total over the planned runs (USD); Cost per delivered die (USD); Dedicated total over the same runs (USD); Break-even number of runs (runs); Break-even area (mm2).
Assumptions
- The provider price presets are published standard list prices in euros for 2026 and change often; they are starting points to be replaced by a quote. Academic and discounted prices are lower and depend on eligibility.
- Samples delivered, extra sample price, packaging, test, shipping and the mask and wafer figures for the dedicated run are editorial estimates; replace them with your own quotes.
- A dedicated run places all your blocks on one die whose area is the sum of the blocks; if the designs are separate products, each needs its own mask set.
- Packaging, test, shipping and extras are the same for MPW and dedicated, so the comparison turns on fabrication cost only.
- The exchange rate is a single editorial figure; set it to the rate you will really pay.
Uncertainty: The arithmetic is exact; the result is as good as the prices entered. Published list prices change and real quotes differ with eligibility, volume and schedule, so treat the result as a budget and confirm it with a quote.
Known limits
- Lead time, schedule and the number of shuttles a year are not priced; a dedicated run may start sooner than the next shuttle date, or later.
- Volume discounts, repeat-customer pricing, design kit and IP licence fees, and the cost of a seal ring or fill rules change real invoices; add them to the extras.
- Community shuttles that bill by tile, and shuttles with a fixed price per block, are modelled only through an equivalent price per square millimetre and a billing step.
- Dedicated mask prices depend on layer count and node; use the mask set cost estimator for a layer by layer figure.
- A multi-layer reticle or a shared reticle service is a middle path that is not modelled separately; enter its price as the mask set cost to compare it.
Where the method comes from
The Hub's own arithmetic for a shared-wafer run billed by area, built on the way published MPW price lists are structured (a price per square millimetre, a minimum area, whole blocks or a first-tier price) and compared with a dedicated mask set and wafer lot.
Reference example, checked by test: Worked example in this method note and its unit test: the IHP SG13G2 preset (7,300 euros per mm2, minimum 0.8 mm2), a 1.5 by 1.5 mm block, two runs, USD 1.10 per euro. Billed area per run 2.25; Cost of one run 18,817.5; Total over the planned runs 37,635; Cost per delivered die 940.875; Dedicated total over the same runs 637,500; Break-even number of runs no result; Break-even area 39.6015.
Versions
- v1 (2026-10-25): First version, built from the tool idea.
Terms on this page
- MPW
- A shared mask set and wafer run carrying designs from several unrelated customers, splitting mask and wafer costs between them.
- Die
- A single rectangular block of processed silicon cut from a finished wafer, carrying one complete circuit.
- Mask set
- The complete set of photomasks needed to build a design on a process, one or more for each patterned layer.
- Shuttle
- A scheduled multi-project wafer run that a foundry or broker offers on a fixed calendar, with hard data submission deadlines.
- Wafer lot
- A group of wafers, classically twenty-five, that travels through the fab together and shares a common process history.
- Bare die
- An unpackaged die sold or shipped as-is for direct attach onto a board, module or another die.
- PDK
- The foundry-supplied package that makes a process usable by EDA tools.
- Lot
- The unit of material movement in a fab: a group of wafers, conventionally up to 25, that travel together through the process flow and share a lot number, run card and dispatch priority.
- Wafer
- A thin, polished disc of single-crystal silicon on which hundreds or thousands of identical circuits are built at the same time.
- Mask cost
- The cost of the photomask set for a design, rising steeply with node because of more layers, multi-patterning and tighter specifications.
- Photomask
- The patterned master plate, normally a quartz substrate with a chrome or molybdenum silicide absorber, whose image is projected onto the wafer.
- Die size
- The physical area of a single chip on the wafer, set by whichever dominates: total logic and memory area, IO and bump count, or analogue and power structures.
Tell us what you're after and leave your email: we'll connect you with the right person on the Hub.