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Modules / Tools

Tools

All tools in one place: the Hub's own calculators and utilities, and an index of the tools engineers use across the industry. Usable without sign-in. Sign in to save your inputs and subscribe to MPW shuttle alerts.

Hub utilities

Die per wafer

Gross-die yield off wafer size, die size and edge exclusion.

SoC Specification & ArchitectureFoundry & MaskProduction Ramp & Yield
Yield estimate

Poisson-model gross-die yield from defect density.

SoC Specification & ArchitectureProduction Ramp & Yield
Package / ASIC cost

Parametric per-unit cost: silicon, package, test, NRE.

SoC Specification & ArchitecturePackaging & Test
Chip cost calculator

Full AI-accelerator cost bridge: logic die, HBM, packaging and test.

SoC Specification & Architecture
Packaging model

Compare CoWoS-S, CoWoS-L, EMIB, SoIC and flip-chip cost and HBM-stack support.

Packaging & TestInterposer & Substrate Design
Cost bridge chart

Side-by-side manufacturing cost comparison across AI accelerators.

SoC Specification & Architecture
Price / performance frontier

Compare accelerators on cost, throughput and TCO.

SoC Specification & Architecture
Allocation dashboard

Foundry, CoWoS and HBM allocation status across fabs and process nodes.

Foundry & MaskProduction Ramp & Yield
Tapeout decision workspace

Guided workflow for fabless teams evaluating a tapeout: definition through go/no-go.

Physical Design & Sign-offTape-out
Unit converter

mm, mil, µm, inch, cm: the ones you actually convert between.

Chat with Datasheets

Upload a PDF, ask questions with page citations, extract and compare parameters. Paid plans.

SoC Specification & ArchitectureIP Specification & Architecture
Product type classifier

Classify a change into one of the Hub's ten product types and see its obligations, deliverables and gates.

SoC Specification & Architecture
Design review assistant

Upload a schematic or BOM PDF for a general sanity check: not a substitute for real DRC/ERC tooling. Paid plans.

Bring-up & Silicon Validation
EBITDA calculator

Net income plus interest, taxes, depreciation and amortization, with margin.

ROI calculator

Return on investment, plus an annualized rate over a holding period.

CAGR calculator

Compound annual growth rate between a beginning and ending value.

Business case calculator

COGS, ASP, margin, breakeven, NRE payback, NPV/IRR and TAM/SAM/SOM for a semiconductor product: savable, with an AI viability narrative.

SoC Specification & Architecture
Product and project planner

Plan, schedule and track a programme on any Hub lifecycle: Gantt chart with critical path, baselines, RAID log, change control, gate reviews, role reports and MS Project XML export. Paid plans.

SoC Specification & ArchitectureTape-out

Where along the chip lifecycle the utilities help

How many Hub utilities are tagged to each lifecycle stage, in the order the stages run. Select a stage to see its utilities.

Engineering tools

Calculators, worksheets and planners for the work along the chip lifecycles, each on its own page with its method, assumptions and sources. Calculators are free to use; worksheets, checklists, trackers and planners are for members.

Cost and business

Mask, wafer, test and bill of materials costs, sourcing choices and end-of-life buys.

Reliability

Failure rates, stress tests, qualification plans and radiation effects.

Quality statistics

Process capability, measurement systems, control charts and test limits.

Quality worksheets

FMEA, control plans, 8D, traceability and the other records audits ask for.

Safety and security

Functional safety metrics, integrity levels, threat and vulnerability ratings.

Digital and physical design

Power, thermal, area, interconnect and the design records engineers keep.

Analog, RF, photonics and packaging

Converters, RF chains, matching, links and package electrical limits.

Manufacturing, fab and supply

Capacity, equipment, cleanrooms, spares and supply decisions.

AI, systems and startup

AI compute sizing, certification, schedules, pipelines and company finance.

Industry tools index

90 of 4,606 tools, ranked by how many roles use each one. Category and company are a best-effort match on the tool's name, not a hand-curated taxonomy.

Open source only 135Includes the open-source chip-design tools from IIC-OSIC-TOOLS (JKU Linz) and Efabless, each with a description.
ASML YieldStar 3· ASMLLam Research Etch Platforms 1· Lam ResearchASML NXE and NXT exposure tools (via consortia) 1· ASMLLam Research Flex and Vantex HAR etch 1· Lam ResearchApplied Materials Reflexion CMP platform 1· Applied MaterialsApplied Materials SmartFactory Rx / AutoSched 1· Applied MaterialsEV Group wafer bonders 1· EV GroupUltratech / Veeco and Canon steppers for RDL lithography 1· VeecoApplied Materials SmartFactory 1· Applied MaterialsNuFlare EBM-9500 and EBM-10000 variable-shaped-beam writers 1Axcelis Purion H/XE/M 1· AxcelisApplied Materials Centura epi reactors 1· Applied MaterialsTokyo Electron CLEAN TRACK LITHIUS 1· Tokyo ElectronEbara F-REX CMP systems 1· EbaraApplied Materials SmartFactory reporting 1· Applied MaterialsAutomated pellicle mount and demount systems from Mitsui Chemicals and ASML 1· ASMLEdwards iXH and Ebara dry vacuum pumps 1· EbaraApplied Materials Reflexion and Ebara CMP 1· Applied MaterialsApplied Materials AutoSched AP simulation 1· Applied MaterialsLam Research ALTUS, VECTOR and SABRE 1· Lam ResearchTokyo Electron Triase and NT333 1· Tokyo ElectronIMS Nanofabrication MBMW-201 and MBMW-301 multi-beam writers 1Lam Research Kiyo and Flex etch systems 1· Lam ResearchKokusai Electric vertical diffusion furnaces 1Besi Datacon and ASMPT die-to-wafer bonders 1· BesiASML scanner reticle stage and library management interfaces 1· ASMLApplied Materials SmartFactory FDC 1· Applied MaterialsASML YieldStar and Litho InSight 1· ASMLLam Research DV-Prime / Coronus 1· Lam ResearchApplied Materials SEMVision G7 review SEM 1· Applied MaterialsTokyo Electron CLEAN TRACK LITHIUS and SCREEN coater-developer tracks 1· Tokyo ElectronCzochralski pullers and hot-zone simulation (CGSim) 1ASML scanner reticle management and RMS 1· ASMLASML TWINSCAN NXE:3600D/3800E 1· ASMLApplied Materials Reflexion and lab-scale CMP polishers 1· Applied MaterialsASM / Veeco ALD Reactors 1· VeecoApplied Materials and Lam etch research platforms 1· Applied MaterialsApplied Materials VIISta Trident and PLAD 1· Applied MaterialsApplied Materials Producer / Endura platforms 1· Applied MaterialsApplied Materials Endura PVD and ALD platforms 1· Applied MaterialsEdwards Atlas, Alpha and Zenith abatement systems 1· EdwardsTokyo Electron Telius and Vigus 1· Tokyo ElectronApplied Materials, Lam, TEL and ASML tool platforms 1· Applied MaterialsHitachi and Applied Materials CD-SEM data systems 1· Applied MaterialsASML Scanners (DUV immersion) 1· ASMLLam SABRE and Applied Raider electroplating 1· Lam ResearchApplied Materials and Ebara CMP platforms 1· Applied MaterialsApplied Materials Producer and Endura 1· Applied MaterialsTokyo Electron CLEAN TRACK coater-developer 1· Tokyo ElectronApplied Materials Vantage RTP and Radiance 1· Applied MaterialsApplied Materials Reflexion LK Prime 1· Applied MaterialsApplied Materials Centura Epi and Selectra 1· Applied MaterialsTokyo Electron TELINDY and Triase vertical furnaces 1· Tokyo ElectronEbara CMP polishers 1· EbaraTokyo Electron CLEAN TRACK LITHIUS Pro Z 1· Tokyo ElectronApplied Materials Centura / Sym3 etch 1· Applied MaterialsLam Research and Applied Materials plating platforms 1· Applied MaterialsASM International Eagle and XP8 ALD 1· ASM InternationalASML TWINSCAN EXE High-NA 1· ASMLEdwards and Ebara pump diagnostics tools 1· Ebara
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MPW shuttle calendar

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UMC · 28N Logic/Mixed-Mode – HPC · EUROPRACTICE
TSMC · 22nm CMOS Logic or RF ULL (w/ or wo/ ReRam) · EUROPRACTICE
ams OSRAM · 0.35µ CMOS C35B4C3 4M/2P/HR/5V IO · EUROPRACTICE