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Hard IP port effort estimator

Estimate what porting a hard macro to another process or metal stack involves, from its mix of custom, compiled and digital content and the change.

Digital and physical designFree to useHow it worksSourcesWhere it helps

Fills the inputs below with typical figures. Replace any of them with your own.

The macro

Size and content decide the base effort of building the macro from scratch.

Or the area of a representative set of instances for a compiler.

For a cell library. When above 0, the standard cell share is costed per cell instead of per mm2.

The change

Device models, rules and parasitics all change, so most of the work is redone.

How closely the target devices and rules match the source.

Maps schematics and devices between process kits; it helps circuit and layout work only.

Process, voltage, temperature and extraction corners.

Team and cost

Share of a perfectly parallel schedule a real team achieves.

Salary, overhead and facilities.

Change and similarity factors

Hub editorial estimates. The share of a from-scratch activity that is repeated for the kind of change chosen, and the multipliers for similarity and experience. Replace them with your own history.

0.75 high, 1 medium, 1.2 low.

Used when a migration tool is available.

Base effort of a new design

Engineer-weeks to build each content type from scratch, and how that effort splits between activities. Hub editorial estimates.

Characterisation rates

Per corner. Hub editorial estimates; memory and cell libraries cost the most because of the number of configurations and cells.

Test chip and qualification

Used when the choices above are yes.

Leading nodes cost far more than mature ones.

Total effort
1,141 engineer-weeks
About 24.8 engineer-years
Schedule
24.5 months
106 weeks with a team of 20
Total cost
$6,453,837
$5,133,453 labour, $570,384 EDA, $750,000 shuttle and qualification
Design effort against a new design
100%
A new design of 2.5 mm2 is 801 engineer-weeks

Check these

  • The port costs about as much as a new design. Published accounts say analog circuits below about 180 nm often need redesign rather than migration.
Effort by activity
  • Circuit migration and re-optimisation215.4 engineer-weeks19%
  • Layout migration or redesign326.9 engineer-weeks29%
  • Verification, views and documentation261.5 engineer-weeks23%
  • Characterisation49.88 engineer-weeks4%
  • Test chip design10 engineer-weeks1%
  • Test chip bring-up and measurement14 engineer-weeks1%
  • Qualification8 engineer-weeks1%
  • Project management106.3 engineer-weeks9%
  • Contingency148.8 engineer-weeks13%
Show the data as a table
Effort by activity
ItemEngineer-weeks
Circuit migration and re-optimisation215.4 engineer-weeks
Layout migration or redesign326.9 engineer-weeks
Verification, views and documentation261.5 engineer-weeks
Characterisation49.88 engineer-weeks
Test chip design10 engineer-weeks
Test chip bring-up and measurement14 engineer-weeks
Qualification8 engineer-weeks
Project management106.3 engineer-weeks
Contingency148.8 engineer-weeks
Schedule by phase
PhaseWeeksHow it is set
Design56.97Circuit, layout, verification, tool set-up and test chip design, shared across the team
Characterisation3.491Runs while the test chip is in fabrication
Test chip fabrication16Fixed lead time
Bring-up and measurement5.227Limited to three people
Qualification14Fixed duration

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Sensitivity to design rule similarity
SimilarityMultiplierEffort (engineer-weeks)Schedule (months)Cost (USD)Design effort against a new design
High0.7575318.9$4,512,62663%
Medium196822$5,591,07784%
Low1.21,14124.5$6,453,837100%
Total effort against the similarity multiplier
Line chart of Effort (engineer-weeks) against Similarity multiplier (1 is medium), one line. The same numbers are in the table under the chart.05001,0001,5000.511.52Similarity multiplier (1 is medium)Effort (engineer-weeks)
Show the data as a table
Total effort against the similarity multiplier
Similarity multiplier (1 is medium)Effort (engineer-weeks)
0.5537
0.75753
1968
1.251,184
1.51,400
21,831
Effort at similarity multipliers of 0.5, 0.75, 1, 1.25, 1.5, 2
MultiplierEffort (engineer-weeks)
0.5537
0.75753
1968
1.251,184
1.51,400
21,831

How it works

Porting a hard macro (an analog block, a PHY, a memory, a standard cell library) to another process or metal stack costs anything from a small fraction of a new design to as much as one. This tool prices it with a parametric effort model: a base effort from the macro's size and content mix, scaled by the kind of change, how similar the design rules are, the team's experience and whether a migration tool is available, plus the fixed costs of characterisation, a test chip and qualification. Every factor is a Hub editorial estimate that you should replace with your own project history.

  1. Set the base effort of a new design. Each content type has an effort rate in engineer-weeks per mm2 for building it from scratch: custom analog, custom digital, compiled memory and standard cell digital. The base is the size times the mix-weighted rate. A library priced by cell count uses engineer-weeks per cell instead of the standard cell area share.base = area x (analog share x analog rate + custom digital share x custom digital rate + memory share x memory rate + standard cell share x standard cell rate) + cells x rate per cell
  2. Split it into activities. The base is divided between circuit work (schematic and pre-layout simulation), layout, and verification with views and documentation. The default split is 28%, 40% and 32%.activity base = base x activity split
  3. Scale for the change. The kind of change decides how much of each activity is repeated: a new node repeats most of it, a metal stack change or a PDK version change very little. The design rule similarity, the team's experience and the migration tool then scale it. A migration tool helps the circuit and layout activities only; it does not help verification.activity effort = activity base x change factor x similarity factor x skill factor x tool factor (circuit and layout only)
  4. Add characterisation. Characterisation scales with the number of corners. Each corner has a fixed cost plus a cost per mm2 for each content type, or per cell for a library, then the change-type factor.characterisation = corners x (fixed + area x sum of share x rate per mm2 + cells x rate per cell) x change factor
  5. Add the fixed items. A test chip adds design and bring-up effort, and its shuttle cost. Qualification adds effort and a cost. A migration tool adds set-up effort. Project management is a percentage of everything, and contingency a percentage of that.total = (activities + characterisation + test chip + qualification + tool set-up) x (1 + project management) x (1 + contingency)
  6. Make the schedule and cost. The design and characterisation phases are shared across the team at the stated efficiency. Characterisation runs while the test chip is in fabrication, bring-up is limited to three people, and qualification takes a fixed time. Cost is engineer-weeks times the loaded rate plus the EDA and compute rate, plus the shuttle and qualification costs.design weeks = effort / (team x efficiency); schedule = design + max(characterisation, fabrication) + bring-up + qualification, all x (1 + contingency)
  7. Test the similarity. The sensitivity view repeats the whole estimate at high, medium and low design rule similarity, and the chart sweeps the similarity factor, because similarity is the least certain input at the start of a port.same model with the similarity factor set to 0.75, 1 and 1.2

Assumptions

  • Every rate and factor is a Hub editorial estimate. The public sources describe what is hard about porting, not how many engineer-weeks it takes. Calibrate the rates on a past port of your own before relying on the result.
  • Effort is in engineer-weeks; a loaded rate covers salary, overhead and facilities, and a separate rate covers EDA licences and compute.
  • Size is the area of the finished macro or a representative set of instances. A device count is converted to an area with an average devices-per-mm2 figure.
  • The kinds of change are from the same foundry family or different foundries; the model does not separate a licensed re-use of IP from a clean re-implementation.

Limits and warnings

  • A parametric model is a first estimate to within a factor of two. It cannot see an unusual specification, a new circuit topology or a missing model.
  • Below about 180 nm and at FinFET nodes, analog circuits often need redesign rather than migration; a low similarity setting moves the estimate toward a redesign but cannot replace a design review.
  • Migration tool factors are kept modest (circuit work at 0.7 and layout work at 0.85 of the unaided effort) because the published accounts say tool set-up and manual layout and simulation work remove much of the gain. Tool vendors claim more.
  • Licence fees for the target process IP, foundry NRE, reticle sets beyond the shuttle cost, customer qualification and a production test programme are not included.

Sources

The methods and default figures rest on these public sources. The wording here is our own; read the source for its full text.

Where it helps

The lifecycle stages this tool serves: 1 stage in 1 lifecycle.

Method notev1Formula, ranges, sources and limits

Estimates the engineer-weeks, schedule and cost of porting a hard macro to another process or metal stack from its size and content mix, the kind of change, design rule similarity, team experience, tooling, characterisation corners, test chip and qualification.

Formula

base = area x (analog share x analog rate + custom digital share x custom digital rate + memory share x memory rate + standard cell share x standard cell rate) + cells x rate per cell; activity base = base x activity split; activity effort = activity base x change factor x similarity factor x skill factor x tool factor (circuit and layout only); characterisation = corners x (fixed + area x sum of share x rate per mm2 + cells x rate per cell) x change factor; total = (activities + characterisation + test chip + qualification + tool set-up) x (1 + project management) x (1 + contingency); design weeks = effort / (team x efficiency); schedule = design + max(characterisation, fabrication) + bring-up + qualification, all x (1 + contingency); same model with the similarity factor set to 0.75, 1 and 1.2

Inputs
InputUnitRange it holds forComes from
Size given aschoicearea, devicesYour figure
Macro areamm2from 0Your figure
Device countdevicesfrom 0Your figure
Average devices per mm2devices/mm2from 1000Your figure
Custom analog share%0 to 100Your figure
Custom digital share%0 to 100Your figure
Compiled memory share%0 to 100Your figure
Standard cell digital share%0 to 100Your figure
Library cells to port, 0 to use the area sharecellsfrom 0Your figure
Kind of changechoicenew-node, other-foundry, shrink, metal-stack, pdk-versionYour figure
Circuit work repeatedfraction0 to 1.5Your figure
Layout work repeatedfraction0 to 1.5Your figure
Verification work repeatedfraction0 to 1.5Your figure
Characterisation repeatedfraction0 to 1.5Your figure
Design rule similaritychoicehigh, medium, lowYour figure
Similarity factorx0.3 to 3Your figure
Migration tool availablechoiceyes, noYour figure
Tool factor on circuit workx0.2 to 1Your figure
Tool factor on layout workx0.2 to 1Your figure
Tool set-upengineer-weeksfrom 0Your figure
Team experience on the target processchoiceexperienced, mixed, newYour figure
Experience factorx0.5 to 2Your figure
Characterisation cornerscorners1 to 300Your figure
Test chipchoiceyes, noYour figure
Test chip designengineer-weeksfrom 0Your figure
Test chip bring-up and measurementengineer-weeksfrom 0Your figure
Shuttle or mask costUSDfrom 0Your figure
Test chip fabrication timeweeksfrom 0Your figure
Qualificationchoiceyes, noYour figure
Qualification effortengineer-weeksfrom 0Your figure
Qualification costUSDfrom 0Your figure
Qualification durationweeksfrom 0Your figure
Circuit share of the base%0 to 100Your figure
Layout share of the base%0 to 100Your figure
Verification share of the base%0 to 100Your figure
Custom analog rateengineer-weeks/mm2from 0Your figure
Custom digital rateengineer-weeks/mm2from 0Your figure
Compiled memory rateengineer-weeks/mm2from 0Your figure
Standard cell rateengineer-weeks/mm2from 0Your figure
Rate per library cellengineer-weeks/cellfrom 0Your figure
Fixed cost per cornerengineer-weeksfrom 0Your figure
Analog cost per cornerengineer-weeks/mm2from 0Your figure
Custom digital cost per cornerengineer-weeks/mm2from 0Your figure
Memory cost per cornerengineer-weeks/mm2from 0Your figure
Standard cell cost per cornerengineer-weeks/mm2from 0Your figure
Cost per cell per cornerengineer-weeksfrom 0Your figure
Team sizeengineers1 to 200Your figure
Team efficiency%30 to 100Your figure
Loaded cost per engineer-weekUSDfrom 0Your figure
EDA and compute cost per engineer-weekUSDfrom 0Your figure
Project management%0 to 50Your figure
Contingency%0 to 100Your figure

Outputs: Total effort (engineer-weeks); Schedule (months); Total cost (USD); Design effort as a share of a new design (fraction).

Assumptions

  • Every rate and factor is a Hub editorial estimate. The public sources describe what is hard about porting, not how many engineer-weeks it takes. Calibrate the rates on a past port of your own before relying on the result.
  • Effort is in engineer-weeks; a loaded rate covers salary, overhead and facilities, and a separate rate covers EDA licences and compute.
  • Size is the area of the finished macro or a representative set of instances. A device count is converted to an area with an average devices-per-mm2 figure.
  • The kinds of change are from the same foundry family or different foundries; the model does not separate a licensed re-use of IP from a clean re-implementation.

Uncertainty: The arithmetic is exact, but every factor is a Hub editorial estimate. Expect the real effort to differ by a factor of two either way until the rates are calibrated on one of your own ports.

Known limits

  • A parametric model is a first estimate to within a factor of two. It cannot see an unusual specification, a new circuit topology or a missing model.
  • Below about 180 nm and at FinFET nodes, analog circuits often need redesign rather than migration; a low similarity setting moves the estimate toward a redesign but cannot replace a design review.
  • Migration tool factors are kept modest (circuit work at 0.7 and layout work at 0.85 of the unaided effort) because the published accounts say tool set-up and manual layout and simulation work remove much of the gain. Tool vendors claim more.
  • Licence fees for the target process IP, foundry NRE, reticle sets beyond the shuttle cost, customer qualification and a production test programme are not included.

Where the method comes from

The Hub's own parametric effort model. Its factors follow the shape described in the sources (schematic mapping is the cheap part; layout, simulation and verification are not) but are editorial; no public source gives engineer-weeks for a port.

Reference example, checked by test: Worked example in this method note: the LDO and bandgap preset (0.15 mm2, 85% analog and 15% custom digital, another foundry, medium similarity, a migration tool, 12 corners, a test chip, no qualification, a team of 3), hand-worked in the tool's unit test. Total effort 65.8652; Schedule 8.59898; Total cost 409,326; Design effort as a share of a new design 0.5208.

Versions

  • v1 (2026-10-25): First version, built from the tool idea.

All models in the register

Terms on this page

Hard IP
IP delivered as a fixed physical layout for one specific process, such as a PHY, PLL or memory compiler instance.
Metal stack
The set of metal and via layers a process offers for wiring, with their number, thicknesses, pitches and materials.
PHY
The block that converts digital data into signals on the medium and back, comprising the PCS, PMA and PMD sublayers plus clocking and analogue front end.
Standard cell library
A characterised collection of small fixed-height logic cells, flip-flops and buffers designed to abut in rows and be assembled automatically by synthesis and place and route.
Design rule
A geometric constraint a layout must meet to be manufacturable with good yield on a given process, such as minimum width, spacing, enclosure or density.
Characterisation
Systematic measurement of a device's real electrical and functional behaviour across voltage, temperature, frequency and process corners to establish the limits published in the datasheet.
Test chip
A chip made to prove designs, IP blocks or process features in silicon rather than to be sold.
Standard cell
A small, pre-designed logic cell, such as a gate, flip-flop or buffer, with a fixed height so that cells can be placed in rows and connected automatically.
PDK
The foundry-supplied package that makes a process usable by EDA tools.
Bring-up
The first phase of post-silicon work, in which a new part is powered on for the first time and taken step by step through power sequencing, clocking, reset, boot ROM execution and basic interface t...
Shuttle
A scheduled multi-project wafer run that a foundry or broker offers on a fixed calendar, with hard data submission deadlines.
EDA
The software industry and tool category used to design, simulate, verify and lay out integrated circuits.

The full glossary

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