News from November 2026

Alphabet’s TPU inventory, Intel’s manufacturing tradeoffs, and equipment suppliers’ balance sheets show how capital builds up along the path to usable AI computing capacity. The post AI Hardware’s Hidden Cost: Between Orders and Output appeared first on EE Times.

New WiseGuard Smart Sensor Delivers Always-On, Ultralow Power Edge AI Vision For Security, Monitoring and IoT applications IRVINE, Calif., Nov. 3, 2026 /PRNewswire/ -- Himax Technologies Inc. (Nasdaq: HIMX) ("Himax" or the "Company"), a global supplier of smart sensor and edge AI...

The acquisition adds Ferric's integrated voltage regulator technology to onsemi's portfolio, targeting higher power density for AI processors. The post onsemi Expands AI Power Portfolio with Ferric Acquisition appeared first on Power Electronics News.

In a deal valued at 115 billion dollars, US chipmaker Marvell Technology has agreed to acquire compatriot optics firm Lumentum.

The 4TB Corsair MP 700 Pro SE is $180 off, the cheapest 4TB Gen 5 SSD you can buy right now.

Nvidia has told cloud providers who use its data center products that they must sell less than half of their services to Chinese companies as part of a new policy that will further impact China's ability to keep up with the global AI surge.

CPO may be a photonics breakthrough, but commercial success hinges equally on advanced packaging that integrates, connects and protects components at scale. The post Five Things You Didn’t Know About Co-Packaged Optics appeared first on EE Times.

In the news release, Verda and Compal Expand Global AI Infrastructure Collaboration at GTC Berlin 2026, issued 21-Oct-2026 by Compal Electronics, Inc. over PR Newswire, we are advised by the company that changes have been made. The complete, corrected release follows, with additional...

With an “insanely fast” production schedule to meet, Musk is reportedly softening on who should be in charge.

Customs authorities only check the performance specifications of a server's processors, allowing smugglers to attach high-end memory chips to low-end processors and ship them into China.

Joining the FPGA console trend is the SGBC, a Game Boy console that natively supports a Game Boy cartridge slot and copying cartridge ROMs to a microSD card.

Firm says it has completed the world’s first commercial data center deployment of an integrated 800-volt DC power system.

Fraunhofer IPMS will showcase new semiconductor technologies at SEMICON Europa 2026 in Munich, highlighting advances in chiplet integration, photonics and energy-efficient memory. The developments aim to improve system performance while reducing power consumption and supporting more flexible chip manufacturing.

For European semiconductor companies, the work offers new opportunities to combine specialized chip technologies and access […] The post Fraunhofer IPMS advances chiplet integration and …

Bosch will spin off its semiconductor division ‌in January 2028, it said today. The move comes as part of a strategy to run semis as a foundry business as well […] The post Bosch to spin off semis appeared first on Electronics Weekly.

BluGlass Ltd of Silverwater, Australia, a vertically integrated developer and manufacturer of visible gallium nitride (GaN) lasers, has given the following update on its activities in fiscal first-quarter 2027 (to end-September 2026)...

Taipei, Nov. 3 (CNA) Taiwan-based GlobalWafers Co., the world's third-largest silicon wafer supplier, said Tuesday it plans to issue unsecured convertible bonds worth up to US$500 million in a private placement, with U.S. memory chipmaker Micron Technology Inc. as the sole subscriber.

// // Entegris addresses critical industry need through strategic acquisition, Taiwan manufacturing investment, and partnership with Element Six BILLERICA, Mass.--(BUSINESS WIRE)-- Entegris, Inc. (Nasdaq: ENTG), a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-technology industries, today announced two important milestones in its strategic expansion …

As AI data centers and renewables push aging grids to their limits, SiC-based SSTs move from development to hyperscale deployment. The post Solid-State Transformers: How SiC Is Rewiring the Grid for the AI Era appeared first on Power Electronics News.

EU court's confidentiality ruling clears a procedural hurdle, not the merits of CISPE's case against Commission approval

Nick Saraev says Amazon closed his account after canceling Nvidia DGX Spark orders; Tim Sweeney reports canceled orders after a GPU buy.

Even silicon starts behaving like rubber on a microscopic level. As hybrid bonding moves toward pitches of 1 micrometer and below, tiny deformations become a major obstacle.

Research by Besi and Imec shows why mastering the process is just as important as building a highly accurate bonding machine.

Taipei, Nov. 3 (CNA) MediaTek Inc., Taiwan's largest integrated circuit designer, has generated solid returns for investors over the past 25 years, as the company has diversified its product portfolio to boost revenue and pay good dividends, MediaTek's CEO said Tuesday.

Europe is scrambling to develop infrastructure to support the rollout of AI amid high energy and land costs.

Deep learning (DL) models for real-time wearable sleep staging often rely on long-kernel temporal convolutions, a requirement that current accelerators struggle to support efficiently.

To overcome this, we present an FPGA-based CNN-BiLSTM accelerator that incorporates several algorithm-hardware co-design techniques to enable efficient edge inference. Central to this design is an FFT-based non-unit stride fast convolution, which performs accumulation in the frequency domain to enable a single IF…

This letter presents a mixed-precision CNN-LSTM accelerator for EEG-based sleep staging.

To efficiently execute long temporal convolutions, a serpentine dataflow propagates activations between neighboring processing elements, reducing memory accesses by 6.2 times and 2.25 times compared with output- and weight-stationary dataflows, respectively.

A hybrid quantization scheme applies runtime dynamic quantization to the LSTM and MLP layers and assigns mixed precision on a layer-by-layer basis, red…

The rapid scaling of large language models (LLMs) has unlocked remarkable capabilities across various domains. However, deploying LLMs on mobile devices remains challenging because of their high computational and memory requirements.

Low-bit quantization (e.g., 4-bit weights, 8-bit activations) can reduce model size while preserving accuracy, but its practical efficacy on mobile GPUs has been limited so far. In this paper, we identify that the performance gap stems primarily from frequent data …

The growing computational demands of deep learning (DL) have driven AI-optimized reconfigurable devices, such as the AMD Versal AI Engines (AIEs), the Intel Stratix 10 NX Tensor Blocks (TBs), and the AMD Ryzen AI NPUs.

Their heterogeneous resources and novel dataflow models make efficient exploitation nontrivial, and FPGAs lack native support for structured sparsity. This dissertation optimizes dense general matrix multiplication (GEMM), the dominant DL kernel, on these devices, proposes FPGA a…

Geometric perception on edge must simultaneously achieve two goals that are rarely addressed together: preserve accurate spatial understanding for object localization and operate within stringent latency, memory, energy, and precision constraints.

This coupling is particularly evident in oriented bird's-eye-view (BEV) detection, where global context, multi-scale interactions, and geometric fusion affect both prediction quality and hardware dataflow. Conventional deployment flows first compress …

Deep neural network (DNN) accelerators for edge inference must meet tight energy, latency, and area (EDP) constraints, and their optimal hardware architecture and dataflow configuration is typically identified through design space exploration (DSE).

However, on-chip memory technology including cell type, bank organization, and process node, is rarely treated as a first-class citizen in DSE. For example, increasing memory capacity can reduce memory accesses through greater data reuse, but at the…

Randomized caches protect against side-channel attacks by obfuscating the mapping of memory addresses to cache locations. Existing proposals typically describe architectural behavior, leaving practical hardware implementation challenges largely unexplored.

We implement four prominent designs, CEASER-S, ScatterCache, SassCache, and MIRAGE, and integrate them as the last-level cache (LLC) of a multi-core out-of-order RISC-V system-on-chip (SoC). We identify common and design-specific implementati…

Large language models (LLMs) are increasingly used to generate analog circuits, yet every netlist must also be verified. We propose LLMs as verification assistants for analog circuits that flag unmet specifications and reliability issues that appear under process, voltage, and temperature (PVT) variation.

These issues emerge from how circuit stages combine, a structure that generic parameter-efficient fine-tuning (PEFT) methods such as LoRA do not capture. To this end, we introduce CAPER, a cir…

Residual-stream caching can reconstruct transformer key-value (KV) caches losslessly, but its memory advantage depends on architecture. We present AnchorKV, a storage-replay spectrum connecting per-layer residual caching and full recomputation through configurable residual anchors.

An architecture-dependent break-even rule identifies the first storage-saving spacing, while deployment selects an operating point from the spectrum and cascade replay reduces reconstruction from O(Ls) to O(L), with …

The $115 billion deal aims to create a category leader in AI connectivity by co-designing network processors and lasers for optical transceivers. The post Marvell Snaps Photonics Chipmaker Lumentum to Bolster AI Connectivity appeared first on EE Times.

Wi-Fi, Bluetooth LE, Thread, and on-device AI on a single chip, with existing software and tools, built for billions of intelligent devices that run for years on a battery OSLO, Norway, Nov. 3, 2026 /PRNewswire/ -- Nordic Semiconductor, a global leader in low-power wireless solutions,...

MUNICH, Nov. 3, 2026 /PRNewswire/ -- electronica 2026 will take place November 10–13 in Munich, Germany. As AI moves from the cloud to edge devices, Longsys(301308.SZ/09976.HK) will showcase new products and edge AI storage solutions under the theme "Integrated Storage Empowering Edge...

Cities generate enormous amounts of data from cameras, sensors and operational systems, but turning it into useful action — for planning, maintenance and public services — remains a challenge.

Physical and agentic AI offer new ways to close that gap, from digital twins for infrastructure planning to vision and service agents, while keeping local governments […]

Blackstone President Jon Gray says AI infrastructure needs more equity as debt investors face concentration risks amid massive spending plans.

Infineon and Qualcomm are working together to accelerate the development and deployment of central car computers in software-defined vehicles (SDVs). The companies have signed a technology agreement to have a […] The post Infineon and Qualcomm hook up for in-car computing appeared first on Electronics Weekly.

Noak, a spin-off of imec and UHasselt, has raised €5 million to scale and industrialize the development of the next generation of solar: perovskite–silicon tandem PV. The seed investment, provided […] The post Imec spin-off Noak raises €5m appeared first on Electronics Weekly.

Greece has opened a draft national strategy for semiconductors and microelectronics for public consultation, setting out how the country hopes to build a larger role in chip design, research and […] The post Greece unveils semiconductor strategy appeared first on Electronics Weekly.

Marvell is to buy photonics specialist Lumentum for $115 billion in what is being seen as a bet on the continuation of the datacentre build out. “AI infrastructure is undergoing […] The post Marvell buys Lumentum appeared first on Electronics Weekly.

Accessing external memory puts the brakes on physical AI, so carmaker has found an economical and speedy shortcut

The European Union's Cyber Resilience Act (CRA), which becomes mandatory in December 2027, is raising the bar for cybersecurity in connected devices. Rather than relying on software patches to address vulnerabilities after they emerge, manufacturers are under growing pressure to build security into products from the outset.

For connected devices, that shift puts flash memory in a new role: alongside storing code and data, it must help protect device identity, data integrity and software updates…

World’s biggest chipmaker tells cloud computing providers a majority of their clients must be non-Chinese

Amazon Relational Database Service (Amazon RDS) for Oracle now supports M8i and R8i instances in additional AWS Regions. Both M8i and R8i instances are now available in Asia Pacific (New Zealand) and Canada West (Calgary), and R8i instances are now available in Europe (Milan, Stockholm, and Zurich) and Israel (Tel Aviv).

These instances are powered by custom Intel Xeon 6 processors, available only on AWS, delivering the highest performance and fastest memory bandwidth among comparable Intel pro…

Outlook examines how AI-driven demand is reshaping supply, technology investment, sustainability and the products that reach consumers. The post TechInsights Identifies Five Trends Reshaping the Semiconductor Market appeared first on Semiconductor Digest.

Researchers investigate how ultrashort laser pulses can be used to slice diamond, with potential applications in optics, semiconductors, and power electronics. The post Laser Slicing of Large-Area Diamond Substrates appeared first on Semiconductor Digest.

2026 Excellence in Achievement Award honors the company's leadership in expanding apprenticeships, investing in employee advancement, and strengthening the semiconductor workforce. The post SEMI Foundation Recognizes FM Industries for Advancing Semiconductor Workforce Development appeared first on Semiconductor Digest.

Marvell announced its intention to acquire Lumentum in a $115B acquisition to further optical connectivity in the AI era The post Marvell Proposes Acquiring Lumentum to Combine Optical Circuit Switching with AI Connectivity Silicon appeared first on ServeTheHome.

Building cloud solutions with autonomous AI agents should feel fast, safe, and reliable. Without cloud-specific context, coding agents often struggle.

They might invent deprecated SDK syntax, guess invalid command flags, or attempt operations without the required Identity and Access Management (IAM) permissions. Even worse, an unguided agent can enable billable APIs or provision cloud resources without your explicit permission.

Starting today, you can install the google-cloud-developer plugin d…