News from November 2026

Applied Brain Research (ABR) has announced the general availability of its speech AI software development kit (SDK) for Zephyr RTOS on the Alif Semiconductor Ensemble family of edge AI processors.

The software enables streaming automatic speech recognition and text-to-speech synthesis to run entirely on-device, without requiring a cloud connection. It is designed for low-power embedded [...] The post ABR Launches Speech AI SDK for Alif Processors appeared first on Embedded.

Researchers at Materials Center Leoben, PVA TePla, and Advanced Semiconductor Engineering (ASE) published “AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging.”

Abstract Excerpt: “Traditional failure-analysis (FA) methods face growing challenges due to the increasing miniaturization and complexity of modern semiconductor devices. In particular, the detection of cracks in the extreme low K... » read more The post AI Image Enhancement Improves Detect…

IP house believes optics demand is going to explode as Nvidia and others eye bigger systems

Intel’s turnaround now hinges on proving its foundry strategy can deliver, as customers look for signs the company will add fab capacity and catch TSMC

How far can GPU CFD scale? Convergent Science ran 536 million cells on two NVIDIA HGX B200 instances in 3.62 hours.

Here is how to size and scale your own simulations.

Sweta Gupta is the Vice President of Engineering at Analog Bits, where she leads development and execution of mixed-signal IP’s, managing circuit and layout teams.

Ms. Gupta has been a part of the Analog Bits team since 2004 and she has successfully managed and delivered high quality IP’s including low jitter PLL’s, low power crystal… Read More The post Interview with Sweta Gupta, VP of Engineering of Analog Bits appeared first on SemiWiki.

Researchers at KU Leuven and EURECOM published “SecDMP: Provably Secure Data Memory-Dependent Prefetching.” Abstract Excerpt: “In this work, we address this gap by designing a defense that is both secure and efficient.

First, we propose a classification of DMP leakage, categorize existing and novel attacks, and analyze which leakage classes are mitigated by existing defenses.... » read more The post Hardware Defense Blocks Memory-Dependent Prefetcher Leakage (KU Leuven) appeared first on Semico…

Researchers at IBM Research published “Meter-scale quantum interconnects between large quantum processors.” Abstract Excerpt: “Modular quantum architecture requires long-distance quantum interconnects to stitch together individual processor modules.

Such interconnects, long-distance couplers or L-couplers, must support coherent quantum operation over meter-scale distances and scale to multiple connections between any two modules. Here we demonstrate four L-couplers... » read more The post Quant…

Researchers at imec and Vrije Universiteit Brussels published “Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI.” Abstract “GPU compute resources are scaling to support growing AI workloads, leading to further rises in the climate change impact of hyperscale data centers that rely on high-performance GPUs.

To model how packaging decisions... » read more The post 3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB) appeared first on Semicondu…

Tachyum files for bankruptcy, the court in Bratislava initiates bankruptcy proceedings.

Ben Bajarin and Jay Goldberg unpack a packed week for AI and semiconductors, starting with Anthropic’s S-1 and what it reveals about the cost of staying at the frontier.

We discuss why enterprise AI adoption still has room to grow, what our latest CIO survey says about ROI, and why Anthropic wants more control over its compute infrastructure. Hyperscaler earnings raise a broader question: how much of that AI investment is improving the rest of their businesses?

Then we turn to Intel’s disappoin…

Modern AI models are opening up new possibilities at the edge. Turning those possibilities into responsive, efficient applications, however, requires more than choosing hardware with an impressive TOPS figure.

Developers need to understand how models behave on their target devices, where performance is lost, and which optimisations… Read More The post WEBINAR: Porting, Analysing & Optimising AI Models onto Edge GPUs appeared first on SemiWiki.

Researchers at the University of Texas at Austin published “APPlace: Co-Optimizing Device Locations and Access Points for Routing-Aware Analog Placement.”

Abstract “Analog layout automation remains challenging in Analog/Mixed-Signal circuit design, because parasitics and mismatches introduced during layout strongly affect circuit performance.

Placement is especially critical among the layout stages, as it constrains the routing solution... » read more The post Co-Optimizing Access Points Improv…

Dive into the fundamentals of system technology co-optimization (STCO) and how it helps streamline chiplet-based designs.

Data infrastructure semiconductor solutions provider Marvell Technology Inc of Santa Clara, CA, USA has agreed to acquire Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes optical and photonic products for optical networks and lasers) in an all-stock transaction that has been unanimously approved by the boards of directors of both companies...

US intelligence agencies reportedly concluded that a Chinese businesswoman with access to Nvidia CEO Jensen Huang was passing information to Beijing, raising questions about the security of the company’s commercial relationships and the enforcement of US semiconductor export controls.

The alleged Jensen Huang spy plot was reported by The New York Times on 29 October […] The post Alleged Jensen Huang spy plot highlights Nvidia export concerns appeared first on eeNews Europe.

I’ve been working with AMIQ EDA for almost nine years now, writing about their cool technologies and interviewing users about their experiences. I’ve read through more user guides and release notes than I can count.

I’ve watched many dozens of video clips showing how to use their products. I’ve even visited their headquarters … Read More The post Using for AI for Root Cause Analysis of Simulation Failures appeared first on SemiWiki.

Written by: Christopher Romano, Codi Starks, Garrett Mahoney, John Wolfram, Josh Murchie, K Singh, Mathew Potaczek, Mike Lombardi, Rik Dolfing Introduction Mandiant responded to multiple incidents in 2026 in which threat actors hijacked enterprise access to Large Language Models (LLMs), a tactic known as "LLMJacking."

Spanning a variety of cloud and LLM providers, these intrusions impacted organizations in North America, South America, and Asia Pacific across the financial services, retail, tec…

Imec and Belgium’s Ministry of Defense have announced a strategic partnership to accelerate the development of sensors, AI and secure connectivity for defense and security applications.

Cardiff University and Swansea University are to work together to explore the development of the UK's first multi-institution approach to industry-connected national compound semiconductor pilot foundry capabilities...

Nordic Semiconductor is celebrating its 10 years of involvement in the BBC micro:bit with its “micro:bit class kit” programme. Nordic is offering BBC micro:bit Club kits to classrooms around the […] The post Nordic Semi celebrates with micro:bit class kit programme appeared first on Electronics Weekly.

The AI infrastructure deal is expected to close during the first half of 2028.

NVIDIA is investigating a security incident involving its Brev cloud development platform after detecting unauthorized activity between October 4 and October 20. The incident may have exposed SSH keys used to access customer virtual machines.

NVIDIA has rotated the affected keys and updated customer instances, but says it is unaware of any improper use

Demcon Photonics is developing a manufacturing approach that uses laser-written optical waveguides to connect fiber arrays to photonic chips.

Altera’s Agilex 2x family delivers improved performance with a new network-on-chip

Qualcomm today is announcing that they have completed initial validation on their High Bandwidth Compute technology.

The DRAM-stacked-upon-compute architecture moves on to commercialization, with Dragonfly AI250 set to sample in the first half of 2027 The post Qualcomm Validates HBC Stacked Memory Ahead of 2027 Dragonfly AI250 Sampling appeared first on ServeTheHome.

Anthropic's S-1 puts frontier AI economics on the public record, Oracle adds TPUs and Cerebras to a compute stack that was mostly NVIDIA, and hyperscaler earnings show cloud growth is exceeding free cash flow. Together they make capital structure, more than demand, the constraint on who can scale.

Patrick Moorhead and Daniel Newman work through what the filings, the earnings, and a neocloud financing debate say about who can afford the build-out. The handpicked topics for this week are: 🔹 Anth…

Ever since the Silicon Catalyst 2023 Semiconductor Industry Forum (“Welcome to our AI Wonderland”), I’ve been convinced that the Nobel Prize committee needs to consider a posthumous award for Sir Arthur. As a reminder, Sir Arthur’s movie “2001: A Space Odyssey” was released in 1968.

At that time, the smallest commercially available transistor geometry was […] The post Sir Arthur C. Clarke Deserves a Nobel Prize appeared first on EE Times.

On-device streaming speech recognition and text-to-speech for low-power edge devices; Niagara ASR to be demonstrated in the Alif Semiconductor booth at electronica 2026 in Munich WATERLOO, ON, Nov. 2, 2026 /PRNewswire/ -- Applied Brain Research (ABR) today announced the general...

Empyrean Technology, China’s top provider of electronic design automation (EDA) tools, plans to acquire a majority stake in a domestic start-up, reinforcing Beijing’s drive for tech self-sufficiency and bolstering support for Huawei Technologies’ semiconductor ambitions.

The Beijing-based firm said in a Shenzhen Stock Exchange filing on Sunday that it would acquire a 50.38 per cent stake in Easy-Logic Technology for 218.8 million yuan (US$33 million). Once completed, the start-up would be...

Qwenputer is an experimental blend of the stock Qwen 3.5 4B LLM with a 32-bit RISC-V CPU compiled and inserted directly into its weights.

Introduction Last week, Google and industry partners dismantled the XCPE backdoor which enrolled more than 1.3 million set-top boxes into a botnet.

We assess with high confidence that the backdoor and botnet were intentionally developed, deployed, and operated for financial gain by Videostrong Technology Co., an Android Original Equipment Manufacturer (OEM) and Original Device Manufacturer (ODM).

Videostrong monetized the backdoor by selling access to criminal affiliates and loading those affil…

What if you could completely rethink what an EDA workflow looks like for the increasingly complex 3D ICs powering the next generation of AI factories? Siemens’ expanded agentic AI portfolio is automating the hardest parts of 3D IC engineering.

At NVIDIA GTC Berlin 2026, Siemens announced an expansion of its EDA agentic AI portfolio,… Read More The post Agentic AI accelerates 3D IC engineering for the AI factory era appeared first on SemiWiki.

Gear up for the AI era. From 122.88 TB enterprise SSDs to integrated embedded memory and Mini SSDs, BIWIN will showcase storage solutions built specifically for a new generation of electronic systems.

BIWIN, a leading provider of memory and storage solutions, will exhibit at electronica 2026, November 10-13 at Trade Fair Center Messe München in […] The post BIWIN to Show Storage Solutions for AI and the Edge at electronica 2026 appeared first on EE Times.

Merger now expected to close by the end of the first quarter of 2027 BEVERLY, Mass., and PLAINVIEW, N.Y., Nov. 2, 2026 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS) ("Axcelis") and Veeco Instruments Inc. (NASDAQ: VECO) ("Veeco") today provided an update on the expected timing...

REHOVOT, Israel, Nov. 2, 2026 /PRNewswire/ -- Nova (Nasdaq: NVMI), a leading innovator and a key provider of advanced metrology and process control solutions used in semiconductor manufacturing, today announced that it will host an Investor Day on March 9, 2027, at the Nasdaq MarketSite...

Olaf van der Sluis has succeeded Bart Smolders as scientific director of the Casimir Institute, Eindhoven University of Technology’s research institute for chips and high-tech systems.

Lubis EDA has released FormalOs, a verification infrastructure platform which is designed to be a tool-agnostic orchestration layer for verification for SoC, asic and IP sign-off projects. According to the […] The post FormalOS adds structure to RTL verification and sign-off appeared first on Electronics Weekly.

Silicon Valley companies said all-stock deal would create a ‘leader in AI connectivity’

Chinese memory chip giant ChangXin Memory Technologies (CXMT) is pressing ahead with an alternative chip architecture that US rival Micron Technology has chosen to bypass, highlighting an industry divide over how best to pack more data onto silicon under cost and geopolitical constraints.

The Hefei-based company planned to send customers samples of its first server-grade dynamic random-access memory (DRAM) product built on the 4F² architecture by the end of this year, according to a summary of.…

This ABS Stratos II Aqua gaming PC has dropped to $2,549.99 at Newegg right now, giving you a rig with a 24-core Intel Core i9-14900KF CPU, an Nvidia GeForce RTX 5070 Ti GPU, a 2TB SSD, and 32GB of DDR5 RAM.

STMicroelectronics is introducing its first automotive safety combination sensors aimed at mass-market applications, following the integration of NXP’s sensors division.

They enable advanced safety and driver-assistance features across categories from […] The post STMicroelectronics introduces integrated angular rate sensors for ADAS appeared first on Electronics Weekly.

Andes CTO Charlie Su said the company put its high-end RISC-V CPU on the back burner for commercial reasons. The post Andes Waits For Market Momentum For Cuzco CPU appeared first on EE Times.

Substrate selection tradeoffs in thermal conductance, isolation, and CTE matching shape WBG power module reliability and density. The post Thin Dielectric Substrates for WBG Module Packaging appeared first on Power Electronics News.

Global smartphone shipments fell 20% year-on-year (YoY) to 254.7 million units in Q3/2026, according to Omdia, marking the lowest third-quarter shipment volume since 2013. Rising smartphone prices continued to weigh on consumer demand, particularly in emerging markets.

Distributors and retailers also remained cautious about replenishing inventory ahead of the holiday season, as higher device costs increased working capital requirements and limited stocking volumes...

GPU supply tightens as the Rubin transition begins, while MLCC lead times extend.

Taipei, Nov. 2 (CNA) Shares in Taiwan closed down Monday but recovered from the day's low as the market remained concerned about volatility in the United States amid questions over massive spending on AI infrastructure, dealers said.

Avnet Silica is expanding its support for industrial connectivity following a distribution agreement with Teltonika Networks. It covers, for example, modems, routers, gateways and switches.

And also Teltonika’s remote management […] The post Avnet Silica signs Teltonika Networks for industrial connectivity appeared first on Electronics Weekly.

Who verifies the verifier? This is the age-old question for anyone involved in the verification of semiconductor systems.

Who verifies AI? The post Putting AI To The Test appeared first on Semiconductor Engineering.

Rise in complexity is pushing engineers to validate hardware, software, and physical constraints earlier in the design flow, but fragmented workflows make that difficult. The post Shift Left Is Becoming A System-Level Problem appeared first on Semiconductor Engineering.