News from November 2026
678 stories of semiconductor news published on the Hub in November 2026, newest first and grouped by day (UTC). Each headline opens the story's page on the Hub, with a summary and a link to the original report.
Showing 451 to 500 of 678 stories.
Wednesday 4 November 202680 stories
Eulitha ramps up deliveries of lithography systems for AI data-center lasersEquipment & Materials · Semiconductor Today · Summary
Eulitha AG of Würenlos, Switzerland (which provides lithography equipment and services for the nanotechnology, photonics and optoelectronic markets) has delivered multiple automated tools to foundries for the production of indium phosphide (InP) distributed feedback (DFB) lasers to be used in AI data centers.
The firm has also reported an order backlog that will fully occupy its production capacity until mid-2028. The DUV photolithography tools are based on the proprietary DTL technology develo…
Silicon Photonics Hits the Big TimeMarkets & Policy · EE Times · Summary

Image: EE Times (opens in a new tab) The land grab for silicon photonics aims to beat the power wall associated with copper interconnects. We also interviewed Salience Labs about its $125 million funding for optical circuit switching.
The post Silicon Photonics Hits the Big Time appeared first on EE Times.
Applied Materials to Increase its Strategic Investment in BE Semiconductor IndustriesEquipment & Materials · 3D InCites · Summary
Applied enters into agreement to increase its investment to approximately 20 percent of outstanding shares, reinforcing the companies’ long-term strategic partnership in advanced packaging Applied Materials, Inc. (Nasdaq: AMAT) today announced it is increasing its investment in BE Semiconductor Industries N.V. (Besi) (Euronext Amsterdam: BESI), a leading manufacturer of assembly equipment for the semiconductor industry, […] The post Applied Materials to Increase its Strategic Investment in BE S…
Generating Chip Subsystems Automatically: A New Answer to Manage Chip Design ComplexityDesign & IP · SemiWiki Forums · Summary
By Defacto Staff Today’s chips are no longer just processors, they are entire systems. A System-on-Chip (SoC) brings together CPU clusters, accelerators, memories, interconnects and dozens of peripherals, often coming from many different teams and vendors.
With AI, high-performance computing and IoT driving demand for … Read More The post Generating Chip Subsystems Automatically: A New Answer to Manage Chip Design Complexity appeared first on SemiWiki.
Nintendo ROM chip supplier Macronix quits to focus on chips for AI data centers, reports indicateMarkets & Policy · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) Macronix, one of Nintendo's ROM chip manufacturers, is shutting down the business to reallocate manufacturing for NOR and NAND flash chips that the AI industry demands.
Public Preview: Multi-disk crash-consistent VM restore points for Premium SSD v2 and Ultra Disks on VMs with SCSI disk controllerMarkets & Policy · Microsoft Azure pricing · Summary
Multi-disk crash-consistent restore points for Azure virtual machines with Premium SSD v2 and Ultra data disks are now available in public preview on VMs with SCSI disk controllers. You can use this to capture the agent-less crash consistent restore point
ABLIC’s Small, Smart, and Simple Strategy for High-Value Analog SemicondutorsMarkets & Policy · EE Times · Summary

Image: EE Times (opens in a new tab) ABLIC’s Satoshi Hanazawa discusses its low-power analog semiconductor strategy, target markets, product innovation and development approach. The post ABLIC’s Small, Smart, and Simple Strategy for High-Value Analog Semicondutors appeared first on EE Times.
Introducing Compute Engine API multi-versioning: Predictable evolution without breaking productionMarkets & Policy · Google Cloud pricing (GPU / TPU) · Summary

Image: Google Cloud pricing (GPU / TPU) (opens in a new tab) Ready to modernize your infrastructure without risking production stability? API multi-versioning for Compute Engine, now in general availability, helps you do just that.
With date-based API versions, Compute Engine can now regularly deliver modern API semantics, stronger resilience defaults, and improved developer experience while preserving the rock-solid stability of the /v1 API. For more than a decade, the Google Compute Engine /v1 API has served as the foundational control plane for millio…
How to Make Embedded Computer Vision Work in the Real WorldMarkets & Policy · Embedded.com · Summary
What it takes to turn an embedded computer vision demo into a device that makes reliable decisions, shown through four real edge AI projects. The post How to Make Embedded Computer Vision Work in the Real World appeared first on Embedded.
GSA Honors Sanjay Mehrotra as Memory Takes Center Stage in ComputingMarkets & Policy · SemiWiki Forums · Summary
The Global Semiconductor Alliance will present Micron Technology Chairman and CEO Sanjay Mehrotra with its 2026 Dr. Morris Chang Exemplary Leadership Award, recognizing a career that connects foundational flash memory innovation with the demands of modern computing.
The presentation is scheduled for GSA’s Annual Awards… Read More The post GSA Honors Sanjay Mehrotra as Memory Takes Center Stage in Computing appeared first on SemiWiki.
Reimagining 3D IC Design: From Architecture to SignoffEDA & Tools · SemiWiki Forums · Summary
By Keith Felton, Andras Vass-Varnai and Todd Burkholder, Siemens EDA The semiconductor industry is undergoing a fundamental transformation.
Heterogeneous integration, the practice of combining multiple chiplets and specialized components into a single advanced packaging platform, has emerged as a powerful alternative… Read More The post Reimagining 3D IC Design: From Architecture to Signoff appeared first on SemiWiki.
Samtec VITA 90 VNX+ for RF backplane, optical, and power connectivityMarkets & Policy · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) Mouser Electronics is stocking Samtec’s VITA 90 VNX+, which combines RF backplane, optical, and power connectivity. It is for harsh or space‑constrained applications.
The interconnect product family supports small-form-factor, modular, […] The post Samtec VITA 90 VNX+ for RF backplane, optical, and power connectivity appeared first on Electronics Weekly.
Logitech G Pro X3 Superstrike Review: $200 for the illusion of a clickDesign & IP · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) Logitech's G Pro X3 Superstrike is a minor but noticeable update to its revolutionary mouse — there's a new chipset and the weight has been rebalanced, so it lasts longer and feels better. And it costs $200.
Worldwide Silicon Wafer Shipments Increase 13.4% Year-on-Year in Q3 2026, SEMI ReportsEquipment & Materials · PR Newswire · Summary

Image: PR Newswire (opens in a new tab) Acceleration of Growth Supported by Broad-Based Recovery, Broadening AI and Advanced Packaging Demand MILPITAS, Calif., Nov. 4, 2026 /PRNewswire/ -- The SEMI Silicon Manufacturers Group (SMG) reported today, in its quarterly analysis of the silicon wafer industry, that worldwide silicon...
Intel Joins Semiconductor Pathways Fund to Strengthen The U.S. Engineering Talent PipelineEquipment & Materials · PR Newswire · Summary
Industry giant joins Applied Materials, Lam Research, KLA, AMD, and Cadence investing in student engineers and technicians nearing completion of semiconductor related degrees and credentials LAFAYETTE, Colo., Nov. 4, 2026 /PRNewswire/ -- Last Mile Education Fund today announced that Intel...
HP Inc hires former GSK boss as CEOMarkets & Policy · The Register · Summary
Image: The Register (opens in a new tab) Brit Emma Walsley swaps big pharma for big printer: Prep for PCs, ink, and lots of DRAM-induced headaches
Micron details ambitious DRAM and NAND roadmap — 3D NAND, High-NA EUV, new materials, and custom silicon makes a comebackEquipment & Materials · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) As DRAM and 3D NAND are about to adopt all-new technologies, custom types of memory are about to become mainstream as AI developers face limitations with current solutions.
Thermal Grizzly launches PhaseSheet PTM Pro with improved thermal conductivity — new thermal pad promises easier installation and better cooling performanceDesign & IP · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) Designed for CPUs, GPUs, and other components without an integrated heat spreader, the PhaseSheet PTM Pro is reusable, electrically non-conductive, and less susceptible to the pump-out effect associated with traditional thermal paste.
NIST Sets a Clearer Course for the Post-Quantum Security TransitionMarkets & Policy · SemiWiki Forums · Summary
NIST’s report, Transition to Post-Quantum Cryptography Standards, gives government agencies and technology suppliers a clearer framework for replacing cryptography vulnerable to future quantum computers.
Its significance extends beyond selecting algorithms: it connects security priorities, application requirements… Read More The post NIST Sets a Clearer Course for the Post-Quantum Security Transition appeared first on SemiWiki.
STMicroelectronics Expands STM32 Roadmap for Cloud AI and Physical AIDesign & IP · EE Times · Summary

Image: EE Times (opens in a new tab) Unified STM32 platform adds automotive-grade STM32A and power-focused STM32G5 MCUs. The post STMicroelectronics Expands STM32 Roadmap for Cloud AI and Physical AI appeared first on EE Times.
Ceva Welcomes Introduction of Bluetooth High Data Throughput, Accelerating Next-Generation Wireless ConnectivityDesign & IP · PR Newswire · Summary

Image: PR Newswire (opens in a new tab) Early investment in Bluetooth HDT, integrated RF capabilities and proven interoperability drive strong commercial momentum, with more than ten customers already licensing Ceva's technology ROCKVILLE, Md., Nov. 4, 2026 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of...
Credo and Oracle Advance Optical Transceiver Telemetry Standardization with OCP CommunityMarkets & Policy · Credo Technology · Summary
// // OCP Approves Two New Specifications Developed by Credo- and Oracle-Led Optics Reliability Workstream Formed to Bring Consistent Telemetry Across Vendors and Form Factors SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing connectivity at scale th…
Allegro Expands Power and Cooling Portfolio for AI Data CentersEquipment & Materials · Power Electronics News · Summary
Allegro's new current sensors, SiC gate driver and 48V motor controller target efficient power delivery and cooling in AI data centers. The post Allegro Expands Power and Cooling Portfolio for AI Data Centers appeared first on Power Electronics News.
AI data centers comprehensively defeated at US midterm elections — 45 measures put on the ballot as Americans overwhelmingly vote against developmentsMarkets & Policy · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) Several counties put data center issues on the ballot during the midterm elections, with most Americans voting against data center development in their county.
SpaceX signs deal with Qualcomm to provide network technology for U.S. mobile serviceMarkets & Policy · CNBC Technology · Summary

Image: CNBC Technology (opens in a new tab) SpaceX struck a multiyear deal with Qualcomm to build out base stations for its Starlink Mobile cellular network.
Guerrilla RF appoints Lauren Winslow as executive VP, salesMarkets & Policy · Semiconductor Today · Summary
Guerrilla RF Inc (GRF) of Greensboro, NC, USA — which provides radio-frequency integrated circuits (RFICs) and monolithic microwave integrated circuits (MMICs) for wireless applications — has appointed Lauren Winslow as executive VP, sales, reporting directly to founder & CEO Ryan Pratt.
In addition, following a two-week transition period, chief business officer Kellie Chong will leave the firm, effective 13 November, to pursue other opportunities...
Vertiv and Infineon Deepen Strategic Partnership for Critical Power InfrastructureEquipment & Materials · PR Newswire · Summary
Three-year agreement strengthens long-term collaboration and supply of silicon and silicon carbide power semiconductors across Vertiv's global power product portfolio, including 800 VDC power systems COLUMBUS, Ohio, Nov. 4, 2026 /PRNewswire/ -- Vertiv Holdings Co. (NYSE: VRT), a global...
Significantly simpler square wave circuits for frequency division by even numbersMarkets & Policy · EDN (Electronics Design News) · Summary
A simple AND gate replaces multiple comparators to significantly cut down a frequency divider’s chip count. The post Significantly simpler square wave circuits for frequency division by even numbers appeared first on EDN.
Open source project renders your Windows 11 desktop using the NPU rather than the GPU — ‘npu-driver’ can only run at 2 to 3 Hz, targets 30 Hz performanceDesign & IP · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) Open source developers have released a prototype driver for Windows 11 that renders the desktop using an NPU instead of the system’s (i)GPU.
Nvidia can only fulfill 1% of China’s massive $70 billion GPU order for AI chips, report claims — supply constraints choke export-friendly RTX Pro 5500 deliveries despite huge demandDesign & IP · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) Just 1% of chips promised to major Chinese companies to power their AI ambitions will be delivered, according to reports.
Aircraft demand higher-voltage powerMarkets & Policy · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) Developed by Airbus, Daher and Safran, the EcoPulse hybrid-electric demonstrator used an 800VDC system delivering up to 350kW to support six wing-mounted electric propellers (source: Airbus) Silicon carbide power electronics, […] The post Aircraft demand higher-voltage power appeared first on Electronics Weekly.
Meet QuickLogic at Space Tech Expo Europe to Discuss Rad-Hard eFPGA IP for Space MissionsDesign & IP · PR Newswire · Summary
Silicon-proven eFPGA IP brings post-launch flexibility to mission-critical SoCs. Visit Stand R19, Hall 6 SAN JOSE, Calif., Nov. 4, 2026 /PRNewswire/ -- QuickLogic® Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Radiation Hardened and Antifuse FPGAs, and...
AMD expects to outsell Intel in Q4 for the first time in historyDesign & IP · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) AMD's data center business surges as strong demand for Epyc processors and Instinct accelerators continues and sales of client hardware declines only slightly.
Save $300 on this 1440p gaming PC with a 9800X3D and RTX 5070 right nowMarkets & Policy · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) Grab a CyberPowerPC machine wtih an RTX 5070, 9800X3D, 32GB DDR5 and a 2TB SSD for $2,199.
CSconnected sponsors event in Cardiff focusing on semiconductor startupsMarkets & Policy · Semiconductor Today · Summary
CSconnected Ltd, the not-for-profit organization driving the world’s first compound semiconductor cluster in South Wales, sponsored Silicon Catalyst’s ‘Forming, Storming, Norming & Performing for Semiconductor Startups’ event at Cardiff University on 28 October, as it sets out South Wales as the place for semiconductor businesses to start, scale and stay...
Valens Semiconductor Introduces the VS6310 Chipset, Bringing Power-Efficient USB3 Extension Directly into Video Conferencing DevicesDesign & IP · PR Newswire · Summary

Image: PR Newswire (opens in a new tab) Low-power chipset enables manufacturers to integrate USB3 extension into a variety of conference room peripherals, reducing the need for external extender boxes HOD HASHARON, Israel, Nov. 4, 2026 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN), a leading provider of high-performance...
Power Electronics Course with QSPICE (Episode 20): SiC MOSFETs and TemperatureEquipment & Materials · Power Electronics News · Summary
Thermal modeling in QSPICE demonstrates how junction temperature rise affects SiC MOSFET conduction losses and overall circuit efficiency. The post Power Electronics Course with QSPICE (Episode 20): SiC MOSFETs and Temperature appeared first on Power Electronics News.
TUE researchers secure €950K for greener atomic layer etchingEquipment & Materials · Bits&Chips · Summary

Image: Bits&Chips (opens in a new tab) The Dutch Research Council (NWO) has awarded approximately 950,000 euros to an Eindhoven University of Technology project investigating more sustainable ways to etch chips with atomic-scale precision.
HMGCC Challenge seeks technology to identify hostile RF emittersMarkets & Policy · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) The HMGCC (His Majesty’s Government Communications Centre) is launching a challenge – via the Satellite Applications Catapult – to create technology that can identify hostile RF emitters in battlefield situations. […] The post HMGCC Challenge seeks technology to identify hostile RF emitters appeared first on Electronics Weekly.
Quantum Roadmaps Are Finally Meeting RealityMarkets & Policy · EE Times · Summary

Image: EE Times (opens in a new tab) Quantum computing revenue surpassed $1 billion in 2025, but missed forecasts highlight the gap between commercial expectations and delivery. The post Quantum Roadmaps Are Finally Meeting Reality appeared first on EE Times.
Wingtech rejects Nexperia restructuring, cites ‘discrimination’ towards Chinese investorsMarkets & Policy · South China Morning Post - Tech · Summary
Shanghai-listed Wingtech Technology has rejected a restructuring proposal under which it would lose control of Dutch chipmaker Nexperia’s assets outside China, condemning the plan as an “expropriation” driven by discrimination.
The stand-off deepens a year-long dispute between Wingtech and Dutch authorities, as the company faces an impending delisting deadline at home, while Dutch Prime Minister Rob Jetten prepares for an official visit to Beijing in the spring. In a statement on Tuesday,...
Neural Super ResolutionMarkets & Policy · Semiconductor Engineering · Summary

Image: Semiconductor Engineering (opens in a new tab) Insight into how neural graphics can improve image quality and performance while simplifying deployment on power- and bandwidth-constrained devices. The post Neural Super Resolution appeared first on Semiconductor Engineering.
Choosing The Right Power Transistor: Why Application Fit Matters More Than TechnologyEquipment & Materials · Semiconductor Engineering · Summary
Silicon MOSFETs, IGBTs, SiC MOSFETs, and GaN HEMTs each offer meaningful advantages, but those advantages do not carry the same value across every converter, motor drive, or power stage. The post Choosing The Right Power Transistor: Why Application Fit Matters More Than Technology appeared first on Semiconductor Engineering.
3D-IC Signal Integrity: From Silicon Interposers To System SignoffEDA & Tools · Semiconductor Engineering · Summary

Image: Semiconductor Engineering (opens in a new tab) A unified, system-level environment that aggregates several proven technologies into a seamless workflow spanning architecture exploration, electromagnetic extraction, channel simulation, protocol compliance verification, and final system-level signoff.
The post 3D-IC Signal Integrity: From Silicon Interposers To System Signoff appeared first on Semiconductor Engineering.
Validate Sovereign AI Sites Before You Commit Capital: eBookMarkets & Policy · Semiconductor Engineering · Summary

Image: Semiconductor Engineering (opens in a new tab) How to validate sites before commitment, protect capacity after deployment, and plan for long-term performance. The post Validate Sovereign AI Sites Before You Commit Capital: eBook appeared first on Semiconductor Engineering.
Built to Last: Why Automotive-Grade PQC Can’t WaitDesign & IP · Semiconductor Engineering · Summary
Why automotive-grade PQC IP matters, what sets it apart from general-purpose PQC, and what SoC design teams should look for when choosing a PQC accelerator. The post Built to Last: Why Automotive-Grade PQC Can’t Wait appeared first on Semiconductor Engineering.
Adding Network Security to AI, HPC and Data CentersMarkets & Policy · Semiconductor Engineering · Summary
How data center operators can protect critical data and communications without compromising the performance demanded by distributed AI and HPC workloads. The post Adding Network Security to AI, HPC and Data Centers appeared first on Semiconductor Engineering.
Accelerating Plug-And-Play Prototyping In Chiplet-Based DesignsPackaging & Test · Semiconductor Engineering · Summary

Image: Semiconductor Engineering (opens in a new tab) Shared resources, a mix of tools running at different speeds, and multiple dies are adding new challenges for design teams. The post Accelerating Plug-And-Play Prototyping In Chiplet-Based Designs appeared first on Semiconductor Engineering.
Trumpf plasma generator business redirects to semiconductor productionEquipment & Materials · Bits&Chips · Summary

Image: Bits&Chips (opens in a new tab) Trumpf is betting on the growing demand for advanced plasma generators in semiconductor manufacturing. The German company is moving series production to Poland to cut costs, while concentrating R&D and new product development in Freiburg.
Its EUV customer ASML will also benefit from the move.
Antenna for railway applicationsMarkets & Policy · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) Taoglas, the RF and antenna specialist, has announced the MA8020 Raptor X, a railway-certified, multi-function antenna platform designed to support cellular, GNSS and Wi‑Fi® connectivity for rail applications. Built on […] The post Antenna for railway applications appeared first on Electronics Weekly.