“Hybrid bonding requires more than a highly accurate machine”

Even silicon starts behaving like rubber on a microscopic level. As hybrid bonding moves toward pitches of 1 micrometer and below, tiny deformations become a major obstacle. Research by Besi and Imec shows why mastering the process is just as important as building a highly accurate bonding machine.

Source: Bits&Chips, published 2026-11-03. The summary is the Hub's own; the full story is at the source. Report a rights or accuracy concern