News from November 2026

Intel’s next big opportunity could come from something that sounds spectacularly unglamorous: connecting tiny pieces of silicon. Advanced packaging rarely attracts the attention lavished on powerful processors or artificial intelligence models.

Yet it increasingly determines how effectively those technologies perform.… Read More The post Intel’s Tiny Bridges Could Lead to Very Big Paychecks appeared first on SemiWiki.

Jevons’ paradox may fuel AI demand, but the silicon roadmap could determine which chips retain their value and which become stranded assets. The post Jevons’ Paradox and the Silicon Roadmap appeared first on EE Times.

The 2027 budget will rise 12.8% to 820.9 trillion won, and will include a 21.3 trillion won investment into semiconductors, physical AI and AI data centers.

Group14 Technologies, the manufacturer and supplier of advanced silicon battery materials, has closed a €150 million (~$169 million USD) Series D equity extension. As part of the funding, Group14 has […] The post Group 14 expands into Spain appeared first on Electronics Weekly.

ASML CEO Christophe Fouquet (pictured) is linking executive compensation to employee morale. The company selected six key questions from its staff survey designed to assess employee morale to form a […] The post ASML links exec pay to employee morale appeared first on Electronics Weekly.

First production deployment of Ceva's NeuPro NPU family combines NeuPro-Nano with SensPro AI DSP to deliver advanced sensing and inference capabilities for Physical AI devices ROCKVILLE, Md. and SEOUL, South Korea, Nov. 2, 2026 /PRNewswire/ -- As AI becomes embedded across the physical...

IPnest ranks Ceva #1 in wireless interface IP with approximately 68% market share, 12 times that of the next-largest vendor, as the category grows approximately 14% HSINCHU COUNTY, Taiwan, Nov. 2, 2026 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software...

Idle network service cores are treated as wasted compute. This assumption motivates increasingly sophisticated mechanisms that reclaim idle cores at microsecond timescales.

We argue that this view no longer matches modern server hardware. On contemporary multicore processors, active cores compete for a shared package-level power and thermal budget.

Once that budget becomes the limiting resource, an idle core that waits efficiently returns compute capacity that hardware can redistribute to produ…

All current LLM serving systems place the GPU at the center, from production-level attention-FFN disaggregation to NVIDIA's Rubin GPU-LPU heterogeneous platform. Even academic PIM/PNM proposals still treat the GPU as the central hub for cross-device communication.

Yet the GPU's compute-rich architecture is fundamentally mismatched with the memory-bound nature of decode-phase attention, inflating serving latency while wasting power and die area on idle compute units. The problem is compounded as…

We evaluate NVIDIA B200 and B300 (Blackwell Ultra) GPUs on two independent eight-GPU clusters, spanning computer-vision inference and training, LLM inference with Llama-3-8B and 70B~\cite{llama3}, and six production HPC codes.

The B300 is not a uniform successor to the B200: it trails by up to 5.6$\times$ on convolutional inference, 8$\times$ on 3D vision transformer training, 24--27\% on 70B LLM throughput, and 16$\times$ on double-precision Quantum ESPRESSO. We resolve the convolutional defic…

Unlike conventional architectures that treat memory as static pattern storage, the hippocampus organizes experience as ordered sequences and retrieves them through temporally compressed replay spanning prior, current, and anticipated states.

This capacity of context-appropriate sequence prediction remains absent from conventional deep learning accelerators and existing neuromorphic fabrics. We present HippocamFLEX, a fully synthesizable digital implementation of these hippocampal computational …

We checked out the ASRock Rack booth at OCP 2026 and saw servers ranging from fully integrated NVIDIA NVL72 racks to liquid-cooled switches The post Liquid-Cooled NVIDIA Servers at the ASRock Rack OCP 2026 Booth appeared first on ServeTheHome.

PLUS: Brake pedals break on Huawei-made cars; North Korea named as source of Binance hack; and more!

Ground penetrating radar (GPR) turns invisible transitions beneath our feet into readable signals. The post Ground penetrating radar: How RF waves map the unseen world appeared first on EDN.

OpenAI CEO Sam Altman made an unannounced visit to South Korea over the weekend, meeting with Samsung executives and reportedly SK Group executives.

Vera Yang is President and Co-Founder of Flexcompute, a frontier AI lab building a Physics World Model that bridges data-driven AI and the laws of physics.

She focuses on the problems where the stakes are highest and the physics hardest, including photonic chips for AI data centers, advanced semiconductor packaging and spacecraft… Read More The post CEO Interview with Vera Yang of Flexcompute appeared first on SemiWiki.

High numerical aperture EUV lithography was supposed to be the next step in semiconductor manufacturing. Then came the doubts: expensive scanners, smaller exposure fields, difficult economics and big customers finding ways to stretch existing equipment.

It became tempting to confuse a delayed adoption curve with a technology… Read More The post High-NA’s Obituary Was Premature appeared first on SemiWiki.

Andrew Seddon is a British engineer and the co-founder and CEO of CircuitHub. His product design background spans industrial equipment, medical devices and special effects equipment, including work on a motion-capture headset for A Christmas Carol.

His experience of working with electronics manufacturers led him to establish… Read More The post CEO Interview with Andrew Seddon of CircuitHub appeared first on SemiWiki.

The Biwin M560 brings SMI’s SM2504XT to retail with top-tier responsiveness and excellent efficiency, though not the fastest post-cache writes.

As CEO, Peter Jenkins, leads the development and commercialisation of angstrom-scale process control technology, helping semiconductor manufacturers gain deeper process insights, improve yields and enable the next generation of advanced devices.

His international career has also included roles in the Netherlands, South… Read More The post CEO Interview with Peter Jenkins of Infinitesima appeared first on SemiWiki.

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month...

An open-source UEFI tool, nv-uefi-unlocker, lifts Nvidia’s tensor rate cap on RTX 20, 30, and 40-series GPUs under Windows.

OpenAI CEO Sam Altman met with around 50 Samsung executives in South Korea on October 31 to discuss AI's future, business opportunities and the technology's impact on corporate operations. The meeting comes as demand for memory chips grows alongside AI infrastructure spending, putting pressure on global DRAM supplies.

Samsung and SK hynix together accounted for approximately 83% of global high-bandwidth memory revenue in the second quarter of 2026, highlighting South Korea's central role in sup…

On October 28 and 29, I attended Qualcomm’s Dragonwing IoT Day in San Diego, along with more than 400 customers, partners, and developers from 200+ companies. (Qualcomm covered my travel costs.)

Dragonwing, launched as a brand in February 2025, is the company’s physical AI business, offering processors, software, and developer tools for edge applications including […] The post Qualcomm’s Dragonwing IoT Day: Physical AI At Scale appeared first on Moor Insights & Strategy.

Ram Machness is the Chief Executive Officer at Arbe, a global leader in high-definition radar solutions for autonomous vehicles. He has three decades of experience in the semiconductor and automotive industries.

In his previous role at Arbe as Chief Business Officer, he led product strategy and management, forged partnerships … Read More The post CEO Interview with Ram Machness of Arbe appeared first on SemiWiki.

Semiconductor obsolescence is a design issue. Engineers protect long-life systems with critical-parts planning, authorized sourcing, and early dialogue.

The post Designing for the Long Haul: Building Obsolescence-Resilient Product Lifecycles appeared first on EE Times.

Discover how electronics manufacturers can reduce material shortages by improving inventory accuracy, connecting purchasing to production, and using BOMs. The post How Small Electronics Manufacturers Prevent Component Shortages appeared first on EE Times.

As production hardware starts shipping, NVIDIA has updated some of the specifications for its Rubin GPU platforms The post NVIDIA Updates Rubin GPU Specs as First Production Hardware Arrives appeared first on ServeTheHome.