News from November 2026
678 stories of semiconductor news published on the Hub in November 2026, newest first and grouped by day (UTC). Each headline opens the story's page on the Hub, with a summary and a link to the original report.
Showing 301 to 350 of 678 stories.
Friday 6 November 202673 stories
China’s AI chipmakers report first profits, but will the trend continue?Design & IP · South China Morning Post - Tech · Summary
China’s pure-play artificial intelligence chipmakers crossed an important milestone in the third quarter as several firms swung into profit, but severe supply chain hurdles and soaring memory costs cloud their long-term growth prospects.
Domestic graphics processing unit (GPU) developers including Moore Threads, MetaX and Iluvatar CoreX are racing to fill the market void left by Nvidia, whose high-end processors face strict US export controls. These home-grown firms are competing fiercely to wi…
Gelsinger-backed Nagare Labs’ Z2RAM promises SRAM speed at DRAM densityDesign & IP · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) Georgia Tech spinout Nagare Labs, backed by Playground Global, unveils Z2RAM, a capacitorless memory to stack on AI accelerators.
Design optimization of strain distribution and polarization-induced 2DEG formation in III-Nitride/GaN heterostructuresEquipment & Materials · Semiconductor Science and Technology (IOP) · Summary
Gallium Nitride (GaN)-based high electron mobility transistors (HEMTs) employ polarization-induced two-dimensional electron gas (2DEG) formation to achieve high carrier mobility and excellent high-frequency performance.
While ferroelectric barriers such as Aluminium Scandium Nitride (AlScN) have demonstrated superior performance compared to conventional AlGaN barriers, limitations including the high cost of scandium, limited availability, structural instability above 30% Sc composition, and cha…
Low-loss superjunction SiC MOSFET with improved breakdown voltage and reverse-recovery performanceEquipment & Materials · Semiconductor Science and Technology (IOP) · Summary
Conventional silicon carbide (SiC) trench metal-oxide-semiconductor field-effect transistors (MOSFETs) still face challenges such as high body diode forward voltage, and difficulty in balancing static and dynamic performance.
To address these issues, a novel split-gate multi-channel superjunction SiC MOSFET with an integrated metal-oxide-semiconductor-channel diode, named as MSM-MOS, is proposed. The electrical characteristics of the proposed device are investigated using technology computer-ai…
What to look out for at electronica 2026Equipment & Materials · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) At next week’s electronica 2026 in Munich (10-13 November) attendees will focus on key industries that are at the forefront of technology advances, writes Anthony Coia. Semiconductor and electronics materials […] The post What to look out for at electronica 2026 appeared first on Electronics Weekly.
Most Read – ASML exec pay, Toyota robotaxis, In-car computingEquipment & Materials · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) Looking at the news stories written within the last week, the most popular articles on the site cover Greece unveiling its semiconductor strategy, ASML links exec pay to employee morale, and Toyota and Waymo planning to launch robotaxis in Japan.
The post Most Read – ASML exec pay, Toyota robotaxis, In-car computing appeared first on Electronics Weekly.
Europe’s Chip Industry: Perfect Storm or Perfect Timing?Markets & Policy · EE Times · Summary

Image: EE Times (opens in a new tab) At SEMICON Europa 2026, Europe’s chip industry will confront a “perfect storm” of geopolitical, technological, and competitive pressures. The post Europe’s Chip Industry: Perfect Storm or Perfect Timing? appeared first on EE Times.
Investigation on thermal stability of Epi-GeSn directly on Si (001)Equipment & Materials · Semiconductor Science and Technology (IOP) · Summary
In this paper we investigate the structural properties and thermal stability of metastable Ge Sn epilayers ( 4.5 at.% Sn) grown directly on Si(001) substrates by high-resolution x-ray diffraction and Raman spectroscopy.
Our results demonstrate that both 70 and 140 nm films are fully relaxed ( and ), with no detectable residual strain in the 70 nm film ( ) and a small tensile strain (+0.09%) in the thicker film. The thermal stability of the heterostructures was evaluated up to 813 K using temper…
Deputy foreign minister pitches Europe on 'Made with Taiwan'Markets & Policy · Focus Taiwan (CNA) · Summary

Image: Focus Taiwan (CNA) (opens in a new tab) Berlin, Nov. 6 (CNA) Taiwan's Deputy Foreign Minister François Wu (吳志中) urged Europe on Wednesday to deepen industrial cooperation under a "Made with Taiwan" approach, saying Taiwan's semiconductor and manufacturing strengths could boost European competitiveness and benefit both sides' economic and security interests.
Chip Industry Week In ReviewPackaging & Test · Semiconductor Engineering · Summary
HBM smuggling routes into China; Nvidia H200s held in Hong Kong; Micron pauses Taiwan fab work; Samsung expands HBM base-die capacity; Oracle-Tencent AI chip deal collapses; Bosch builds out semiconductors; S. Korea boosts AI and chip spending; Marvell-Lumentum deal draws scrutiny; more acquisitions, market reports and earnings.
The post Chip Industry Week In Review appeared first on Semiconductor Engineering.
Q3 DRAM revenue up 369% YoYMarkets & Policy · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) Q3 saw DRAM revenue grow 369%YoY, says Counterpoint Research. Samsung led the market with a 38% market share.
SK hynix had stronger Q3,growth – over 40% – for a 29% […] The post Q3 DRAM revenue up 369% YoY appeared first on Electronics Weekly.
European Fabless Semiconductor Association foundedDesign & IP · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) The European Fabless Semiconductor Association was formally launched yesterday in Brussels. It is the first pan-European body for companies that design semiconductor chips without owning a fab.
The European Fabless […] The post European Fabless Semiconductor Association founded appeared first on Electronics Weekly.
Tenspresso bets on longer context windowsDesign & IP · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) Tenspresso, a startup founded a few months ago by ex-Google AI chip engineers, is in talks to raise $50 million at a $500 million valuation, reports Bloomberg. A few weeks ago, […] The post Tenspresso bets on longer context windows appeared first on Electronics Weekly.
Arm Q2 revenue up 27% YoYDesign & IP · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) Arm’s Q2 revenue increased 27% YoY to $1.44 billion, representing Arm’s highest ever second quarter. The record Q2 was driven by strong licensing and other revenue of $773 million, reflecting […] The post Arm Q2 revenue up 27% YoY appeared first on Electronics Weekly.
Does the Democratic midterm victory spell the end of US AI data centre boom?Markets & Policy · South China Morning Post - Tech · Summary
The sweeping midterm election victory by US Democrats has triggered warnings from analysts that an impending regulatory clampdown could derail the nation’s multi-trillion-dollar artificial intelligence data centre buildout.
Wall Street forecasters slashed their projections for Big Tech infrastructure spending hours after the vote, cautioning that a wave of proposed project moratoria and tighter oversight could stall up to 30 per cent of planned US facilities and force developers to downscale...
Micron says Taiwan operations normal amid reported Taoyuan project haltMarkets & Policy · Focus Taiwan (CNA) · Summary

Image: Focus Taiwan (CNA) (opens in a new tab) Taipei, Nov. 6 (CNA) U.S. memory chipmaker Micron Technology Inc. said Thursday its Taiwan operations were continuing as normal, following a report that it had suspended plans to build a plant in Taoyuan amid an ongoing labor dispute with a local union.
Zirah: A Post-Quantum True Random Number Generator Hardware Signer With an Avalanche NoiseDesign & IP · arXiv cs.AR (Hardware Architecture) · Summary
Zirah is a hardware signer built around an STM32F407 microcontroller, and its purpose is to find out, on inexpensive hardware, where a post-quantum signing key is exposed and what actually protects it.
The device draws every random bit from a reverse-biased 2N3904 junction in avalanche breakdown, amplified by an LM358 and screened by SP 800-90B health tests, computes ML-DSA-65 (FIPS 204, hedged) on the STM32 with two-share arithmetic masking of the secret-key multiplications, and adds ECDSA P-2…
MCUFlowNet: Hardware-Aware Neural Architecture Search for Optical Flow on MicrocontrollersDesign & IP · arXiv cs.AR (Hardware Architecture) · Summary
Dense optical flow allows small drones to avoid obstacles. However, few dense optical flow networks are designed for microcontrollers (MCUs) with neural accelerators, whose on-chip SRAM limits the input resolution.
We present PACE-NAS, a macro-to-micro neural architecture search framework that decouples memory from latency: a macro design fixes the backbone and its peak SRAM, and a micro design searches operators and depths to trade accuracy against compiler-estimated latency. We apply it to Ed…
Memory Fit: Architectural Support for Page Placement by Learning Models of Good BehaviorMarkets & Policy · arXiv cs.AR (Hardware Architecture) · Summary
Server main memory is increasingly heterogeneous, incorporating technologies such as zswap, CXL memory expanders, and emerging phase-change memories (PCM). To decide where to place pages, operating systems have to choose between efficient but coarse-grained access bits, out-of-band profiling, or costly runtime instrumentation.
This paper proposes memory fit, a hardware abstraction that provides precise and accurate page placement information to an operating system. Memory fit measures how well …
Energy Measurement and Optimization of TinyML in Resource-Constrained Embedded Systems: A Systematic Mapping StudyDesign & IP · arXiv cs.AR (Hardware Architecture) · Summary
The rapid expansion of the Internet of Things (IoT) has increased the volume of data generated at the network edge, where many devices operate under severe memory, processing, and energy constraints.
In this context, Tiny Machine Learning (TinyML) enables machine learning (ML) tasks to be executed on microcontrollers, smart sensors, and other resource-constrained platforms. However, the literature remains heterogeneous regarding the algorithms evaluated, energy-measurement methods, reported met…
Scaling Up Analog CIM: A Simulation Framework for Topology-Aware MappingEDA & Tools · arXiv cs.AR (Hardware Architecture) · Summary
Analog compute-in-memory (CIM) enables energy-efficient AI inference by performing in-situ matrix multiplication. The growing demand for deploying larger models motivates chiplet integration to expand CIM capacity.
However, simulation abstractions based on local operator costs and aggregate communication metrics obscure the impact of weight-mapping topology when CIM system scales up. We develop a phase analysis that quantifies how strongly mapping topology affects system performance across hard…
CAMP: Context-Aware Mapping and Placement for LLMs on 3D-IMC ArraysMarkets & Policy · arXiv cs.AR (Hardware Architecture) · Summary
Large Language Models (LLMs) incur severe memory-access overheads due to the cost of loading large weight matrices and key-value (KV) caches. Analog In-Memory Computing (AIMC) is an emerging solution that enables computation directly on static weights stored in memory, substantially reducing energy and latency.
3D-IMC further stacks memory arrays into vertical tiers, increasing capacity but revealing a new challenge: how weights are placed in memory determines which matrix-vector multiplication…
OpenRDMA: A GPU-Native Multi-Path Reliable RDMA Transport ArchitectureDesign & IP · arXiv cs.AR (Hardware Architecture) · Summary
As the computing power density of large-scale AI clusters rises, network communication increasingly limits system performance. GPU-initiated communication requires low-overhead request submission to overlap communication with computation.
However, GPUDirect RDMA (GDR) still relies on CPU involvement in its control path, while InfiniBand GPUDirect Async (IBGDA) requires GPUs to assemble Work Queue Entries (WQEs), consuming additional SM resources and memory bandwidth. We propose OpenRDMA, an ope…
Taiex plunges over 3,700 points in early trading as TSMC hits limit downFoundry & Manufacturing · Focus Taiwan (CNA) · Summary

Image: Focus Taiwan (CNA) (opens in a new tab) Taipei, Nov. 6 (CNA) Taiwan's stock market plunged in early trading Friday, following heavy losses on Wall Street and sharp declines in Japanese and South Korean markets amid uncertainty over artificial intelligence (AI) data center policies after the U.S. midterm elections.
Amazon FSx for Lustre delivers 16x higher metadata IOPS on Intelligent-Tiering file systemsMarkets & Policy · AWS pricing (EC2 / capacity blocks) · Summary
Amazon FSx for Lustre now supports up to 192,000 metadata I/O operations per second (IOPS) on file systems that use the Intelligent-Tiering storage class, 16x higher than the previous maximum of 12,000 IOPS.
The FSx for Lustre Intelligent-Tiering storage class delivers the lowest-cost and only fully elastic Lustre file storage in the cloud. It is optimized for workloads that mix hot and cold data and do not require consistent SSD-level performance.
A file system's metadata IOPS determine how ma…
Historic rivalry could be upended this quarterMarkets & Policy · Electronics Weekly · Summary
Q4 could be an historic quarter for the semiconductor industry in respect of one of the most intense rivalries the industry has ever seen. Although AMD founder Jerry Sanders had […] The post Historic rivalry could be upended this quarter appeared first on Electronics Weekly.
Nasdaq sell-off batters Asian chip stocks as SK Hynix, Samsung, Softbank tumbleMarkets & Policy · CNBC Technology · Summary

Image: CNBC Technology (opens in a new tab) Asian technology stocks tumbled Friday, tracking a sharp sell-off on Wall Street overnight that sent the tech-heavy Nasdaq Composite into correction territory.
US lawmakers summon Jensen Huang over Chinese spying concernsMarkets & Policy · Financial Times - Semiconductors · Summary
Top Republicans ask Nvidia boss to brief congressional committees after reports he was targeted by China
HiSilicon CS5250: Huawei's First Self-Developed CMOS Image SensorMarkets & Policy · TechInsights · Summary
HiSilicon CS5250: Huawei's First Self-Developed CMOS Image Sensor JWinters Fri, 11/06/2026 - 00:40
Thursday 5 November 2026106 stories
Marvell and Lumentum Announce CombinationMarkets & Policy · Semiconductor Digest · Summary
Marvell Technology, Inc. and Lumentum today announced that they have entered into a definitive agreement for Marvell to acquire Lumentum in an all-stock transaction. The post Marvell and Lumentum Announce Combination appeared first on Semiconductor Digest.
SpaceX Picks Qualcomm Dragonwing for Its Starlink Mobile 5G NetworkPackaging & Test · Moor Insights & Strategy · Summary

Image: Moor Insights & Strategy (opens in a new tab) On November 4, Qualcomm announced that SpaceX had selected Qualcomm’s Dragonwing platform to power the U.S. terrestrial 5G network for Starlink Mobile. The package includes the Dragonwing QRU100 for radio units, the QDU100 for distributed units, and Layer 1 software, which handles the lowest level of radio signal processing.
The multiyear agreement covers tens of […] The post SpaceX Picks Qualcomm Dragonwing for Its Starlink Mobile 5G Network appeared first on Moor Insights & Strategy.
AOI agrees new credit facility providing $30m in revolving commitments and $170m in initial term loan commitmentsMarkets & Policy · Semiconductor Today · Summary
On 30 October, Applied Optoelectronics Inc (AOI) of Sugar Land, TX, USA (a designer and manufacturer of optical and hybrid fibre-coaxial networking products for AI data centers, cable TV and broadband fiber access networks) entered into a credit agreement with lenders as well as East West Bank as administrative agent for the secured parties...
EE Times Magazine – November 2026Packaging & Test · EE Times · Summary

Image: EE Times (opens in a new tab) This edition of EE Times Magazine explores advances in semiconductor manufacturing and packaging, farm autonomy, and Canada’s efforts to commercialize emerging technologies. The post EE Times Magazine – November 2026 appeared first on EE Times.
Seco, Peridio Simplify Robotics Deployment with Avocado OSMarkets & Policy · Embedded.com · Summary
Seco S.p.A. and Peridio have announced a collaboration to make Avocado OS, Peridio's production-ready Linux distribution, available across Seco's portfolio of systems based on Qualcomm Dragonwing platforms.
The partnership targets robotics and physical AI applications, providing developers with a commercially supported operating system validated on Seco hardware and intended to simplify the transition from prototype [...] The post Seco, Peridio Simplify Robotics Deployment with Avocado OS appea…
Why SUNK Redefines the AI Research Cluster for Production-Grade TrainingDesign & IP · CoreWeave · Summary
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Image: CoreWeave (opens in a new tab) Built for long-running, thousand-GPU jobs, SUNK (Slurm on Kubernetes) delivers predictable and performant AI training through topology-aware scheduling and continuous health management.
Weebit Nano launches Weebit Matrix™ In-Memory Compute Research ProgramPackaging & Test · GSA (Global Semiconductor Alliance) · Summary
HOD HASHARON, Israel, 11/05/2026 - The Weebit Matrix™ In-Memory Compute (IMC) Research Program is designed to accelerate exploration of next-generation computing architectures. The program provides industry and academic researchers with a ReRAM-based hardware development kit for exploring and prototyping IMC algorithms and systems.
Researchers can use the platform to develop and test AI algorithms, investigate Read More.. The post Weebit Nano launches Weebit Matrix™ In-Memory Compute Research P…
Supermicro Super AI Station Review: The AI Server That Doubles as a WorkstationMarkets & Policy · ServeTheHome · Summary

Image: ServeTheHome (opens in a new tab) Today we are looking at Supermicro's Super AI Station, the company's neat take on a DGX Station System with a design that can stand as a tower or be rackmounted as a 5U server The post Supermicro Super AI Station Review: The AI Server That Doubles as a Workstation appeared first on ServeTheHome.
Synopsys Announces Earnings Release Date For Fourth Quarter and Fiscal Year 2026EDA & Tools · PR Newswire · Summary

Image: PR Newswire (opens in a new tab) SUNNYVALE, Calif., Nov. 5, 2026 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced it will report results for the fourth quarter and fiscal year 2026 on Tuesday, Dec. 8, 2026, after market close. The company will host a conference call at 2:00 p.m. Pacific Time / 5:00 p.m....
Lam Research Corporation Announces $25 Billion Share Repurchase Authorization and Declares Quarterly DividendEquipment & Materials · PR Newswire · Summary
FREMONT, Calif., Nov. 5, 2026 /PRNewswire/ -- Lam Research Corporation (Nasdaq: LRCX) today announced that its Board of Directors approved a $25 billion share repurchase authorization and a quarterly dividend of $0.33 per share of common stock. "The share repurchase authorization...
KLA Declares Regular Cash DividendEquipment & Materials · PR Newswire · Summary
MILPITAS, Calif., Nov. 5, 2026 /PRNewswire/ -- The KLA Corporation (NASDAQ: KLAC) Board of Directors today declared a quarterly cash dividend of $0.23 per share on its common stock, payable on Dec. 1, 2026 to KLA shareholders of record as of the close of business on Nov. 16, 2026. About...
900-V Bidirectional GaN Powers Solid-State Transformers Key to AIEquipment & Materials · Electronic Design · Summary

Image: Electronic Design (opens in a new tab) Infineon will supply the first 900-V bidirectional GaN switch for Enphase's SST technology.
Interview with David Tester VP of Engineering Mach42Packaging & Test · SemiWiki Forums · Summary
David Tester is the VP of Engineering at Mach42, with 30 years of experience in semiconductor development, engineering leadership, and business growth.
As Chief Engineer at EnSilica, he helped transform the company from a design consultancy into a publicly listed fabless semiconductor business, scaling the organisation … Read More The post Interview with David Tester VP of Engineering Mach42 appeared first on SemiWiki.
GaNrich providing 40–1200V GaN power device portfolioEquipment & Materials · Semiconductor Today · Summary
Gallium nitride (GaN) technology firm GaNrich Semiconductor Corp of Zhubei City, Taiwan says that it has established a portfolio of 40V–250V low-mid voltage and 650V–1200V high-voltage GaN power devices on both GaN-on-silicon and GaN-on-sapphire wafer platforms, serving applications including AI data centers, battery backup units (BBUs), robotics, drones, electric vehicles (EVs), and on-board chargers (OBCs)...
Vera Delivers the Best of Both Worlds: Highest Throughput and Fastest AgentsDesign & IP · NVIDIA · Summary

Image: NVIDIA (opens in a new tab) AI agents do more than generate answers. They search for information, query databases, write and test code and take action.
Each of those steps relies on a CPU, with agents moving between GPU reasoning and CPU execution throughout a task. As businesses put more agents to work, AI factories need CPUs that can execute those […]
Patrick Moorhead Discusses Qualcomm Earnings on Schwab Network, November 5, 2026 — Broadcast AnalysisMarkets & Policy · Moor Insights & Strategy · Summary

Image: Moor Insights & Strategy (opens in a new tab) Earlier today I appeared on the Schwab Network to discuss the specifics from Qualcomm’s new earnings report. You can watch the video via the link below, or read on for an AI-generated, human-edited overview and summary of the full conversation.
Link to video of broadcast. Overview Qualcomm experienced an 11% stock decline despite beating revenue […] The post Patrick Moorhead Discusses Qualcomm Earnings on Schwab Network, November 5, 2026 — Broadcast Analysis appeared first on Moor Insights & St…
Infineon’s Johannes Schoiswohl on the GaN Market at OktoberTechEquipment & Materials · EE Times · Summary

Image: EE Times (opens in a new tab) Sponsored: PEN’s Aalyia Shaukat talks to Infineon’s Johannes Schoiswohl about the GaN market at OktoberTech Silicon Valley 2026, the event’s 10th anniversary. The post Infineon’s Johannes Schoiswohl on the GaN Market at OktoberTech appeared first on EE Times.
Infineon Leaders Andreas Urschitz and Maher Matta on a Decade of OktoberTechMarkets & Policy · EE Times · Summary

Image: EE Times (opens in a new tab) Sponsored: Infineon’s Andreas Urschitz and Maher Matta talk to EE Times at OktoberTech Silicon Valley 2026, looking back on a decade of innovation and growth. The post Infineon Leaders Andreas Urschitz and Maher Matta on a Decade of OktoberTech appeared first on EE Times.
India targets creating homegrown GPUs within 2 years and plans to commercialize indigenous SHAKTI and VEGA processorsDesign & IP · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) MeitY Secretary S. Krishnan says India plans to develop its own GPU under Semiconductor Mission 2.0, with a target of approximately two years. The country is also looking to commercialize its SHAKTI and VEGA RISC-V processors, expand domestic server production, and attract more semiconductor investment.
Krishnan sees the AI boom as a potential repeat of the Y2K-era opportunity that helped India's IT services industry grow
Glass Is Becoming an AI Infrastructure PlatformPackaging & Test · SemiWiki Forums · Summary
The value of glass will be determined not by its material properties alone, but by whether it can expand the package architecture window and be realized repeatedly at manufacturing scale. AI infrastructure is pushing advanced packaging into a regime where the substrate itself increasingly determines what can be built.
As packages… Read More The post Glass Is Becoming an AI Infrastructure Platform appeared first on SemiWiki.
From PyTorch to Product: Accelerating Edge AI Through Open EcosystemsMarkets & Policy · EE Times · Summary

Image: EE Times (opens in a new tab) In this 30-Minute BitCast, discover how open-source technologies are helping developers accelerate AI deployment on resource-constrained embedded devices. The post From PyTorch to Product: Accelerating Edge AI Through Open Ecosystems appeared first on EE Times.