Explaining and improving yield: separating random from systematic and parametric loss, bin and Pareto analysis, wafer-level spatial signature and edge or zonal patterns, commonality analysis across equipment and lots, and linking sort and final test loss to a process or design cause.
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Note from the research register: Learned in a yield engineering role working lots with process integration and FA, on top of SPC and statistics and a working knowledge of the process flow.
Register version 1.