Also known as: Wafer Probe Test Engineer; Sort Engineer; E-Sort Engineer
See this role on the Chiplet lifecycle or on the Automotive lifecycle or on the Test program lifecycle or on the Memory lifecycle or on the Power and compound lifecycle or on the MEMS and sensors lifecycle or on the RF lifecycle or on the SoC lifecycle
Owns the first electrical test insertion at wafer level, ensuring only good die are packaged and that sort data reliably reflects die quality rather than probing artefacts.
Work in progressNo day-in-the-life description has been written for this role yet. If you do this work, we would welcome yours. Suggest a source or a correction
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