News from November 2026

Nvidia employees described the mood as "sad" as CEO Jensen Huang returned to the office after disclosing an affair.

Global Electronics Assembly Report: One segment will drive market to nearly double by 2030 Chris Cicinelli Nov 10, 2026 Which markets drive the $4 trillion electronics assembly forecast, who builds the products and what could change it Industry Intelligence Key Summary SiC and GaN adoption is growing: Accuris recorded 1,057 new SiC parts and 141 new GaN parts in 2024.

Applications differ by voltage: GaN clusters at 650 V and below; SiC dominates higher-voltage applications. PCB requirements dif…

▪ SK hynix secures IEC 61508 SIL 3 industrial functional safety certification for LPDDR5X and ISO/SAE 21434-based Cybersecurity Management System (CSMS) certification product lifecycle process. ▪ Building on its industry-first TISAX certification early last year, the company expands its international

With Subfab NetZero, DAS Environmental Experts introduces a holistic approach to reducing emissions and operating costs. The new ALCEA waste gas abatement system for NOx treatment expands the company’s portfolio.

The first installations are already in place at semiconductor manufacturers in Taiwan. The post The Next Level of Efficiency in Chip Manufacturing Is Taking Shape Below the Cleanroom appeared first on Semiconductor Digest.

Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington state. The post Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D appeared first on Semiconductor Digest.

New capability delivers a 70% sulfuric acid recycle rate while maintaining stringent particle control; System validated across more than 50 process layers at a foundry customer. The post ACM Research Enhances Single-Wafer Hot SPM System with Sulfuric Acid Recycle Capability appeared first on Semiconductor Digest.

Nordson Electronics Solutions accepted the 2026 Global Technology Award in the Plasma Systems category for their new, MARCH ExoSPHERE plasma treatment system. The post Nordson Electronics Solutions Wins The 2026 Global Technology Award for the MARCH ExoSPHERE Plasma Treatment System appeared first on Semiconductor Digest.

CEA-Leti today launched SubFAB Labs, a joint program with International SubFAB Research Labs (ISRL) that gives the semiconductor industry a pre-industrial environment to test, validate and qualify technologies that reduce the environmental impact of chip manufacturing.

The post CEA-Leti Launches SubFAB Labs with ISRL to Speed Adoption of Lower-Impact Chip Manufacturing Technologies appeared first on Semiconductor Digest.

SAN JOSE, Calif., Nov. 10, 2026 /PRNewswire/ -- QuickLogic® Corporation (NASDAQ: QUIK) ("QuickLogic" or the "Company"), a developer of embedded FPGA ("eFPGA") Hard IP, Strategic Radiation Hardened and Antifuse FPGAs, and ruggedized programmable logic solutions, today announced its...

Renesas Electronics Corp. has expanded its Renesas 365 development platform with the introduction of the Xplore Developer Hub, a cloud-based environment designed to simplify embedded system development and accelerate the transition from concept to prototype.

The new offering integrates low-cost RA microcontroller development boards, expansion modules, application software, and development tools into a single workflow [...] The post Renesas Expands Renesas 365 with Xplore Developer Hub appeared …

Siemens has announced the HyperLynx Agentic Toolkit, a new solution that combines agentic AI with physics-based simulation to streamline electronic systems verification. Built on the HyperLynx platform, the toolkit automates complex verification workflows, simplifies result analysis, and supports faster engineering decisions.

As electronic systems evolve toward 112G and 224G data rates, design verification becomes increasingly [...] The post Siemens Launches HyperLynx Agentic Toolkit appeared f…

Dr. Solaiman Rahim is a multidisciplinary technology executive with over 25 years of experience driving innovation in the chip automation space at the intersection of systems, semiconductors, high-performance computing, and AI.

As Chief Product Officer at ChipAgents, he leads the scaling of the Agentic and Native AI platform… Read More The post CXO Interview with Solaiman Rahim of ChipAgents appeared first on SemiWiki.

Fabless firm Cambridge GaN Devices Ltd (CGD) — which was spun out of the University of Cambridge in 2016 to design, develop and commercialize power transistors and ICs that use GaN-on-silicon substrates — is working with Ricardo on their development of a high-efficiency GaN-based traction inverter...

W.H. Teh brings 20+ years of global, multi-site operations leadership across semiconductor, photonics and AI infrastructure, including previous roles at Intel, SanDisk and NVIDIA SYDNEY, Nov. 10, 2026 /PRNewswire/ -- Silicon Quantum Computing (SQC), a pioneer in quantum computing and...

On Sunday, Huang admitted to having an affair with a woman who has been connected to Chinese intelligence by reports in The New York Times and Financial Times.

In the AI era, our economic competitiveness, military capabilities, and intelligence edge can be taken down by one man. We aren't prepared.

Congress must act.

Next-generation accelerator delivers up to 10× more peak AI compute and nearly 10× more on-chip memory within the same low-power envelope as MX3 ANN ARBOR, Mich., Nov. 10, 2026 /PRNewswire/ -- MemryX AI, a fabless semiconductor company developing highly efficient and scalable AI inference...

Saskatchewan brings together AI infrastructure, quantum research, chip design talent, and advanced materials expertise to expand its role in Canada’s technology ecosystem. The post Saskatchewan’s Semiconductor Strength Is Connecting the Pieces appeared first on EE Times.

The independent members of the NVIDIA Board have retained former acting U.S. Attorney of the Southern District of New York Joon H. Kim and his firm Wachtell, Lipton, Rosen & Katz to conduct a thorough and independent investigation as was announced on Sunday.

Imec has established the baseline manufacturing process for a silicon interposer platform on Europe’s NanoIC pilot line.

European chip start-up Vertical Compute has expanded its partnership with Imec to validate a 40 nm test chip and prepare its first 16 nm preproduction chip.

Siemens has signed an agreement to acquire Lauterbach, a leading provider of debug and trace solutions for embedded software and complex system-on-chip (SoC) architectures.

Siemens has signed an agreement to acquire Lauterbach, a leading provider of debug and trace solutions for embedded software and complex system-on-chip (SoC) architectures. Lauterbach develops comprehensive, modular and extensible development […] The post Siemens to expand portfolio for semiconductor design and verification …

Why integration boundaries, assembly strategies, and manufacturing yield must be engineered together The Shift from Optical Performance to Manufacturing Scale Co-packaged optics (CPO) is moving beyond laboratory demonstrations toward commercial deployment in AI infrastructure.

As switch bandwidth continues to increase,… Read More The post CPO’s Next Challenge: Turning Optical Performance into Manufacturable Systems appeared first on SemiWiki.

AMD’s sixth-generation EPYC processor, code-named Venice, is here, and the first systems are shipping today. The timing is notable.

AMD’s datacenter business is on an incredible run, agentic AI is reshaping the CPU market, and enterprise IT organizations face infrastructure decisions they can’t put off much longer. For CIOs, the bottom line is straightforward.

AMD’s […] The post 6th Gen AMD EPYC Arrives as Agentic AI Puts the CPU Back at the Center appeared first on Moor Insights & Strategy.

Venice-X promises big speedup for EDA and HPC workloads

Chips boast up to 256 cores, clocks up to 5.3 GHz, and IPC gains of 20-31 percent, just not all on the same SKU

AMD has pulled back the curtain on its Zen 6 microarchitecture. We deep-dive into the differences between Zen 5 and 6, as well as detail our first benchmarks of AMD’s Venice CPUs.

Nvidia and Arm have new “agentic CPUs,” a title that high-ranking AMD employees are pushing back against with the launch of Zen 6 EPYC Venice CPUs.

The ITI is lobbying against the ban of these optical transceivers needed by data centers to convert electrical signals into optical signals.

The unified platform adds safety-critical and mixed-signal MCUs and new and enhanced edge AI tools. The post ST Unveils Unified STM32 MCU Platform appeared first on Embedded.

The day is finally here for the launch of AMD's EPYC 9006 "Venice" platform and the Zen 6 CPU architecture.

AMD has been hard at work over the past two years to build a better server CPU, and thanks to its performance, Venice is primed to deliver another knockout blow for AMD The post AMD EPYC 9006 Results Are Here and AMD Delivers a Knockout Part Deux appeared first on ServeTheHome.

AI infrastructure, in-memory databases, and HPC workloads continue to drive requirements for memory capacity, performance, and data resilience.

At the CXL Pavilion at SC26 in Chicago, IL, Netlist will demonstrate three CXL memory proof-of-concept (POC) designs showing complementary approaches to intelligent memory tiering, data persistence, and memory expansion and reuse.

SC26 runs November 15–20, 2026; […] The post Netlist to Demonstrate Three CXL® Memory Proof-of-Concept Designs at the SC26 C…

Nick Clegg, former British deputy prime minister and Meta’s former president of global affairs, joins Frederick Kempe for a candid conversation about his time in government. The post Nick Clegg on Trump, Silicon Valley, and Big Tech’s political shift appeared first on Atlantic Council.

AMD EPYC Embedded 9006 Series SP7 CPUs deliver leadership performance with up to 256 cores, scalable PCIe Gen 6 and CXL 3.1 connectivity, advanced security and seven-year product longevity.

AMD Showcases 6th Gen AMD EPYC Processors to Lead Next Era of AI and Enterprise Computing

Cores, clocks, memory, and interconnects all perfectly balanced for a singular mission: keeping instinct fed.

Alice Huang is reportedly connected to a web of Chinese companies, which then leveraged her closeness to Jensen Huang to gain access to billions of dollars' worth of Nvidia GPUs.

Standard Network Policies limit you to applying policies at the namespace level, but ClusterNetworkPolicy (CNP) lets you apply granular networking policies across an entire cluster. When you use CNP, you can easily scale security and governance policies.

Recently, I experimented with this functionality in Google Kubernetes Engine (GKE) and saw the benefits for myself. In this post, we'll explore using CNP to control traffic to an LLM and cluster.

If you want to jump right into a hands-on lab, c…

Discrete device designer and manufacturer Nexperia B.V. of Nijmegen, the Netherlands (which operates wafer fabs in Hamburg, Germany, and Hazel Grove Manchester, UK) has launched new ultra-low-ohmic gallium nitride (GaN) FETs, expanding its low- and medium-voltage GaN portfolio with devices spanning 18V to 200V.

Designed to address power design challenges in AI data centres, humanoid robotics, battery-powered tools, renewable energy, high-efficiency SR and DC–DC conversion, the new devices combi…

MILWAUKEE, Nov. 10, 2026 /PRNewswire/ -- TEKLYNX International, trusted globally for barcode and RFID labeling software backed by knowledgeable, responsive support, announced it has become an NXP® Semiconductors Registered Partner to help organizations simplify RAIN RFID adoption and...

Kubernetes, the open source system that manages how applications run across thousands of AI factories, has become the foundation for AI, and the demands on it are only growing.

To help meet them, NVIDIA is deepening its commitment to open source at KubeCon + CloudNativeCon, the flagship conference for the Kubernetes and cloud-native communities. NVIDIA […]

The choice among LTE Cat 1bis, LTE-M, NB-IoT, and 5G RedCap should be made as an RF system decision, not from a modem datasheet alone. The post LTE Cat 1bis or 5G RedCap?

RF design decisions behind an IoT modem refresh appeared first on EDN.

The company outlined new STM32 microcontroller families and software tools for automotive control, motor drives, edge AI, and assisted firmware development.

Staera Semiconductor of San Francisco, CA, USA has emerged from stealth with a technology that builds optical data links directly into silicon chips. It targets the problem that now limits how fast and how large AI systems can grow: moving data between chips.

Formerly New Silicon Corp (NSC), the company has raised $4.6m in pre-seed funding, led by Openspace Capital with participation from SGInnovate, Black Kite Capital, 28 Holdings, In Group, and Decimus Technologies...

A political storm sparked by US media reports alleging American intelligence agencies suspect Nvidia CEO Jensen Huang was targeted in an espionage operation – a claim Beijing has denied – threatens to intensify Washington’s tech blockade on China following a Democratic midterm victory.

Analysts said the twin developments could give the US Congress the political momentum needed to plug loopholes in existing semiconductor restrictions, accelerating efforts to curb third-country chip smuggling and…

Power integrity has been a substantial design challenge for a long time. In the multi-die era, the problems associated with EMIR analysis must now move beyond the chip to consider interactions across the entire stack.

The effects to be analyzed span a multi-dimensional, multi-material space. The graphic at the top of this post… Read More The post Three-Dimensional Chess Anyone?

The Challenges of Power Integrity for Multi-Die Designs appeared first on SemiWiki.

According to tech Taiwan, reported by Wcctech, MediaTek people who are using Intel’s EMIB-T packaging technology have had a complaint from Intel engineers about their demands for quick answers to […] The post Tardy appeared first on Electronics Weekly.

SINGAPORE, Nov. 10, 2026 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) ("Kulicke & Soffa", "K&S" or the "Company"), a global leader in semiconductor assembly technology, today announced that a conference call is scheduled to discuss the Company's third fiscal quarter...

The new Hall sensors and IntelliFET switches address EV current measurement, efficient power distribution and protected 12 V automotive loads. The post Diodes Adds Hall Sensors and IntelliFET Switches for Automotive appeared first on Power Electronics News.

Tesla and SpaceX’s Terafab reportedly plans 1 million wafers per month after 2032, with about 700,000 for memory.