News / Markets & Policy / Three-Dimensional Chess Anyone? The Challenges of Power Integrity for Multi-Die Designs
Three-Dimensional Chess Anyone? The Challenges of Power Integrity for Multi-Die Designs
By The Semiconductor Hub news desk ·
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Power integrity has been a substantial design challenge for a long time. In the multi-die era, the problems associated with EMIR analysis must now move beyond the chip to consider interactions across the entire stack. The effects to be analyzed span a multi-dimensional, multi-material space. The graphic at the top of this post… Read More The post Three-Dimensional Chess Anyone? The Challenges of Power Integrity for Multi-Die Designs appeared first on SemiWiki.
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