News / Packaging & Test / CEA-Leti Launches SubFAB Labs with ISRL to Speed Adoption of Lower-Impact Chip Manufacturing Technologies
CEA-Leti Launches SubFAB Labs with ISRL to Speed Adoption of Lower-Impact Chip Manufacturing Technologies
By The Semiconductor Hub news desk ·
Link post
CEA-Leti today launched SubFAB Labs, a joint program with International SubFAB Research Labs (ISRL) that gives the semiconductor industry a pre-industrial environment to test, validate and qualify technologies that reduce the environmental impact of chip manufacturing. The post CEA-Leti Launches SubFAB Labs with ISRL to Speed Adoption of Lower-Impact Chip Manufacturing Technologies appeared first on Semiconductor Digest.
Read at Semiconductor DigestSource: Semiconductor Digest, published . The summary is the Hub's own; the full story is at the source. Report a rights or accuracy concern