News / Markets & Policy / Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D

Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D

By The Semiconductor Hub news desk · 2026-11-10

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Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington state. The post Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D appeared first on Semiconductor Digest.

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Source: Semiconductor Digest, published 2026-11-10. The summary is the Hub's own; the full story is at the source. Report a rights or accuracy concern

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