News from November 2026
808 stories of semiconductor news published on the Hub in November 2026, newest first and grouped by day (UTC). Each headline opens the story's page on the Hub, with a summary and a link to the original report.
Showing 751 to 800 of 808 stories.
Monday 2 November 202670 stories
Nordic Semi celebrates with micro:bit class kit programmeMarkets & Policy · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) Nordic Semiconductor is celebrating its 10 years of involvement in the BBC micro:bit with its “micro:bit class kit” programme. Nordic is offering BBC micro:bit Club kits to classrooms around the […] The post Nordic Semi celebrates with micro:bit class kit programme appeared first on Electronics Weekly.
Marvell to buy Lumentum in all-stock deal, a massive bet on AI connectivityMarkets & Policy · CNBC Technology · Summary

Image: CNBC Technology (opens in a new tab) The AI infrastructure deal is expected to close during the first half of 2028.
NVIDIA Brev security breach may have exposed SSH keys used to access customer VMs — investigation finds unauthorized activity spanning 16 days, but no evidence of misuseMarkets & Policy · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) NVIDIA is investigating a security incident involving its Brev cloud development platform after detecting unauthorized activity between October 4 and October 20. The incident may have exposed SSH keys used to access customer virtual machines.
NVIDIA has rotated the affected keys and updated customer instances, but says it is unaware of any improper use
Demcon targets photonics assembly bottleneck with laser-written connectionsMarkets & Policy · Bits&Chips · Summary

Image: Bits&Chips (opens in a new tab) Demcon Photonics is developing a manufacturing approach that uses laser-written optical waveguides to connect fiber arrays to photonic chips.
New NOC Ties Together FPGA SoCDesign & IP · Electronic Design · Summary

Image: Electronic Design (opens in a new tab) Altera’s Agilex 2x family delivers improved performance with a new network-on-chip
Qualcomm Validates HBC Stacked Memory Ahead of 2027 Dragonfly AI250 SamplingDesign & IP · ServeTheHome · Summary

Image: ServeTheHome (opens in a new tab) Qualcomm today is announcing that they have completed initial validation on their High Bandwidth Compute technology.
The DRAM-stacked-upon-compute architecture moves on to commercialization, with Dragonfly AI250 set to sample in the first half of 2027 The post Qualcomm Validates HBC Stacked Memory Ahead of 2027 Dragonfly AI250 Sampling appeared first on ServeTheHome.
Anthropic's S-1 Opens the Books, Oracle Goes Heterogeneous, and the Real AI Capital RaceMarkets & Policy · The Six Five · Summary
Anthropic's S-1 puts frontier AI economics on the public record, Oracle adds TPUs and Cerebras to a compute stack that was mostly NVIDIA, and hyperscaler earnings show cloud growth is exceeding free cash flow. Together they make capital structure, more than demand, the constraint on who can scale.
Patrick Moorhead and Daniel Newman work through what the filings, the earnings, and a neocloud financing debate say about who can afford the build-out. The handpicked topics for this week are: 🔹 Anth…
Sir Arthur C. Clarke Deserves a Nobel PrizeMarkets & Policy · EE Times · Summary

Image: EE Times (opens in a new tab) Ever since the Silicon Catalyst 2023 Semiconductor Industry Forum (“Welcome to our AI Wonderland”), I’ve been convinced that the Nobel Prize committee needs to consider a posthumous award for Sir Arthur. As a reminder, Sir Arthur’s movie “2001: A Space Odyssey” was released in 1968.
At that time, the smallest commercially available transistor geometry was […] The post Sir Arthur C. Clarke Deserves a Nobel Prize appeared first on EE Times.
Applied Brain Research Announces General Availability of Its Speech AI SDK for Zephyr RTOS on the Alif Ensemble Family of ProcessorsDesign & IP · PR Newswire · Summary

Image: PR Newswire (opens in a new tab) On-device streaming speech recognition and text-to-speech for low-power edge devices; Niagara ASR to be demonstrated in the Alif Semiconductor booth at electronica 2026 in Munich WATERLOO, ON, Nov. 2, 2026 /PRNewswire/ -- Applied Brain Research (ABR) today announced the general...
China’s EDA champion buys start-up to address weak link, support Huawei’s Tau Scaling LawEDA & Tools · South China Morning Post - Tech · Summary
Empyrean Technology, China’s top provider of electronic design automation (EDA) tools, plans to acquire a majority stake in a domestic start-up, reinforcing Beijing’s drive for tech self-sufficiency and bolstering support for Huawei Technologies’ semiconductor ambitions.
The Beijing-based firm said in a Shenzhen Stock Exchange filing on Sunday that it would acquire a 50.38 per cent stake in Easy-Logic Technology for 218.8 million yuan (US$33 million). Once completed, the start-up would be...
AI model gets a 32-bit RISC-V CPU compiled directly into its weights, then runs DOOM on it — experimental AI model can run Doom and C code using its own weights as RAMDesign & IP · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) Qwenputer is an experimental blend of the stock Qwen 3.5 4B LLM with a 32-bit RISC-V CPU compiled and inserted directly into its weights.
Shutting the Door on the XCPE BotnetEquipment & Materials · Google Cloud pricing (GPU / TPU) · Summary

Image: Google Cloud pricing (GPU / TPU) (opens in a new tab) Introduction Last week, Google and industry partners dismantled the XCPE backdoor which enrolled more than 1.3 million set-top boxes into a botnet.
We assess with high confidence that the backdoor and botnet were intentionally developed, deployed, and operated for financial gain by Videostrong Technology Co., an Android Original Equipment Manufacturer (OEM) and Original Device Manufacturer (ODM).
Videostrong monetized the backdoor by selling access to criminal affiliates and loading those affil…
Agentic AI accelerates 3D IC engineering for the AI factory eraEDA & Tools · SemiWiki Forums · Summary
What if you could completely rethink what an EDA workflow looks like for the increasingly complex 3D ICs powering the next generation of AI factories? Siemens’ expanded agentic AI portfolio is automating the hardest parts of 3D IC engineering.
At NVIDIA GTC Berlin 2026, Siemens announced an expansion of its EDA agentic AI portfolio,… Read More The post Agentic AI accelerates 3D IC engineering for the AI factory era appeared first on SemiWiki.
BIWIN to Show Storage Solutions for AI and the Edge at electronica 2026Markets & Policy · EE Times · Summary

Image: EE Times (opens in a new tab) Gear up for the AI era. From 122.88 TB enterprise SSDs to integrated embedded memory and Mini SSDs, BIWIN will showcase storage solutions built specifically for a new generation of electronic systems.
BIWIN, a leading provider of memory and storage solutions, will exhibit at electronica 2026, November 10-13 at Trade Fair Center Messe München in […] The post BIWIN to Show Storage Solutions for AI and the Edge at electronica 2026 appeared first on EE Times.
Axcelis Technologies and Veeco Instruments Provide Update on Expected Timing of Merger ClosingEquipment & Materials · PR Newswire · Summary
Merger now expected to close by the end of the first quarter of 2027 BEVERLY, Mass., and PLAINVIEW, N.Y., Nov. 2, 2026 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS) ("Axcelis") and Veeco Instruments Inc. (NASDAQ: VECO) ("Veeco") today provided an update on the expected timing...
Save the Date: Nova to Host Investor Day on March 9, 2027Equipment & Materials · PR Newswire · Summary
REHOVOT, Israel, Nov. 2, 2026 /PRNewswire/ -- Nova (Nasdaq: NVMI), a leading innovator and a key provider of advanced metrology and process control solutions used in semiconductor manufacturing, today announced that it will host an Investor Day on March 9, 2027, at the Nasdaq MarketSite...
Olaf van der Sluis takes helm of TUE’s Casimir InstituteMarkets & Policy · Bits&Chips · Summary

Image: Bits&Chips (opens in a new tab) Olaf van der Sluis has succeeded Bart Smolders as scientific director of the Casimir Institute, Eindhoven University of Technology’s research institute for chips and high-tech systems.
FormalOS adds structure to RTL verification and sign-offEDA & Tools · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) Lubis EDA has released FormalOs, a verification infrastructure platform which is designed to be a tool-agnostic orchestration layer for verification for SoC, asic and IP sign-off projects. According to the […] The post FormalOS adds structure to RTL verification and sign-off appeared first on Electronics Weekly.
Marvell to buy data centre component maker Lumentum in $115bn AI betMarkets & Policy · Financial Times - Semiconductors · Summary
Silicon Valley companies said all-stock deal would create a ‘leader in AI connectivity’
China’s CXMT defends bet on risky new DRAM architecture to circumvent US chip curbsDesign & IP · South China Morning Post - Tech · Summary
Chinese memory chip giant ChangXin Memory Technologies (CXMT) is pressing ahead with an alternative chip architecture that US rival Micron Technology has chosen to bypass, highlighting an industry divide over how best to pack more data onto silicon under cost and geopolitical constraints.
The Hefei-based company planned to send customers samples of its first server-grade dynamic random-access memory (DRAM) product built on the 4F² architecture by the end of this year, according to a summary of.…
Grab a $450 saving on this 4K-ready gaming PC with an RTX 5070 Ti and 32GB DDR5 right nowDesign & IP · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) This ABS Stratos II Aqua gaming PC has dropped to $2,549.99 at Newegg right now, giving you a rig with a 24-core Intel Core i9-14900KF CPU, an Nvidia GeForce RTX 5070 Ti GPU, a 2TB SSD, and 32GB of DDR5 RAM.
STMicroelectronics introduces integrated angular rate sensors for ADASMarkets & Policy · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) STMicroelectronics is introducing its first automotive safety combination sensors aimed at mass-market applications, following the integration of NXP’s sensors division.
They enable advanced safety and driver-assistance features across categories from […] The post STMicroelectronics introduces integrated angular rate sensors for ADAS appeared first on Electronics Weekly.
Andes Waits For Market Momentum For Cuzco CPUDesign & IP · EE Times · Summary

Image: EE Times (opens in a new tab) Andes CTO Charlie Su said the company put its high-end RISC-V CPU on the back burner for commercial reasons. The post Andes Waits For Market Momentum For Cuzco CPU appeared first on EE Times.
Thin Dielectric Substrates for WBG Module PackagingPackaging & Test · Power Electronics News · Summary
Substrate selection tradeoffs in thermal conductance, isolation, and CTE matching shape WBG power module reliability and density. The post Thin Dielectric Substrates for WBG Module Packaging appeared first on Power Electronics News.
Smartphone shipments fall 20% year-on-year in Q3, the lowest third-quarter total since 2013Markets & Policy · Semiconductor Today · Summary
Global smartphone shipments fell 20% year-on-year (YoY) to 254.7 million units in Q3/2026, according to Omdia, marking the lowest third-quarter shipment volume since 2013. Rising smartphone prices continued to weigh on consumer demand, particularly in emerging markets.
Distributors and retailers also remained cautious about replenishing inventory ahead of the holiday season, as higher device costs increased working capital requirements and limited stocking volumes...
Weekly Radar 008: DRAM Tightness Splits by CapacityDesign & IP · TrendForce Insights · Summary

Image: TrendForce Insights (opens in a new tab) GPU supply tightens as the Rubin transition begins, while MLCC lead times extend.
Taiwan shares end down but off lows amid U.S. volatilityMarkets & Policy · Focus Taiwan (CNA) · Summary

Image: Focus Taiwan (CNA) (opens in a new tab) Taipei, Nov. 2 (CNA) Shares in Taiwan closed down Monday but recovered from the day's low as the market remained concerned about volatility in the United States amid questions over massive spending on AI infrastructure, dealers said.
Avnet Silica signs Teltonika Networks for industrial connectivityMarkets & Policy · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) Avnet Silica is expanding its support for industrial connectivity following a distribution agreement with Teltonika Networks. It covers, for example, modems, routers, gateways and switches.
And also Teltonika’s remote management […] The post Avnet Silica signs Teltonika Networks for industrial connectivity appeared first on Electronics Weekly.
Putting AI To The TestPackaging & Test · Semiconductor Engineering · Summary

Image: Semiconductor Engineering (opens in a new tab) Who verifies the verifier? This is the age-old question for anyone involved in the verification of semiconductor systems.
Who verifies AI? The post Putting AI To The Test appeared first on Semiconductor Engineering.
Shift Left Is Becoming A System-Level ProblemMarkets & Policy · Semiconductor Engineering · Summary

Image: Semiconductor Engineering (opens in a new tab) Rise in complexity is pushing engineers to validate hardware, software, and physical constraints earlier in the design flow, but fragmented workflows make that difficult. The post Shift Left Is Becoming A System-Level Problem appeared first on Semiconductor Engineering.
Intel’s Tiny Bridges Could Lead to Very Big PaychecksPackaging & Test · SemiWiki Forums · Summary
Intel’s next big opportunity could come from something that sounds spectacularly unglamorous: connecting tiny pieces of silicon. Advanced packaging rarely attracts the attention lavished on powerful processors or artificial intelligence models.
Yet it increasingly determines how effectively those technologies perform.… Read More The post Intel’s Tiny Bridges Could Lead to Very Big Paychecks appeared first on SemiWiki.
Jevons’ Paradox and the Silicon RoadmapMarkets & Policy · EE Times · Summary

Image: EE Times (opens in a new tab) Jevons’ paradox may fuel AI demand, but the silicon roadmap could determine which chips retain their value and which become stranded assets. The post Jevons’ Paradox and the Silicon Roadmap appeared first on EE Times.
South Korea targets 'world's highest performance' sovereign AI model in record new budgetMarkets & Policy · CNBC Technology · Summary

Image: CNBC Technology (opens in a new tab) The 2027 budget will rise 12.8% to 820.9 trillion won, and will include a 21.3 trillion won investment into semiconductors, physical AI and AI data centers.
Group 14 expands into SpainEquipment & Materials · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) Group14 Technologies, the manufacturer and supplier of advanced silicon battery materials, has closed a €150 million (~$169 million USD) Series D equity extension. As part of the funding, Group14 has […] The post Group 14 expands into Spain appeared first on Electronics Weekly.
ASML links exec pay to employee moraleEquipment & Materials · Electronics Weekly · Summary

Image: Electronics Weekly (opens in a new tab) ASML CEO Christophe Fouquet (pictured) is linking executive compensation to employee morale. The company selected six key questions from its staff survey designed to assess employee morale to form a […] The post ASML links exec pay to employee morale appeared first on Electronics Weekly.
Ceva and Mobilint Advance Physical AI with REGULUS Edge AI SoCDesign & IP · PR Newswire · Summary

Image: PR Newswire (opens in a new tab) First production deployment of Ceva's NeuPro NPU family combines NeuPro-Nano with SensPro AI DSP to deliver advanced sensing and inference capabilities for Physical AI devices ROCKVILLE, Md. and SEOUL, South Korea, Nov. 2, 2026 /PRNewswire/ -- As AI becomes embedded across the physical...
Ceva Extends Wireless Connectivity IP Leadership as AI Moves to Connected DevicesDesign & IP · PR Newswire · Summary

Image: PR Newswire (opens in a new tab) IPnest ranks Ceva #1 in wireless interface IP with approximately 68% market share, 12 times that of the next-largest vendor, as the category grows approximately 14% HSINCHU COUNTY, Taiwan, Nov. 2, 2026 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software...
Idle Cycles Are Not Wasted CyclesPackaging & Test · arXiv cs.AR (Hardware Architecture) · Summary
Idle network service cores are treated as wasted compute. This assumption motivates increasingly sophisticated mechanisms that reclaim idle cores at microsecond timescales.
We argue that this view no longer matches modern server hardware. On contemporary multicore processors, active cores compete for a shared package-level power and thermal budget.
Once that budget becomes the limiting resource, an idle core that waits efficiently returns compute capacity that hardware can redistribute to produ…
AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention ServingDesign & IP · arXiv cs.AR (Hardware Architecture) · Summary
All current LLM serving systems place the GPU at the center, from production-level attention-FFN disaggregation to NVIDIA's Rubin GPU-LPU heterogeneous platform. Even academic PIM/PNM proposals still treat the GPU as the central hub for cross-device communication.
Yet the GPU's compute-rich architecture is fundamentally mismatched with the memory-bound nature of decode-phase attention, inflating serving latency while wasting power and die area on idle compute units. The problem is compounded as…
Matching Workloads to Blackwell: Power-Resolved Benchmarking of NVIDIA B200 and B300 across HPC and AI WorkloadsDesign & IP · arXiv cs.AR (Hardware Architecture) · Summary
We evaluate NVIDIA B200 and B300 (Blackwell Ultra) GPUs on two independent eight-GPU clusters, spanning computer-vision inference and training, LLM inference with Llama-3-8B and 70B~\cite{llama3}, and six production HPC codes.
The B300 is not a uniform successor to the B200: it trails by up to 5.6$\times$ on convolutional inference, 8$\times$ on 3D vision transformer training, 24--27\% on 70B LLM throughput, and 16$\times$ on double-precision Quantum ESPRESSO. We resolve the convolutional defic…
HippocamFLEX: FPGA Prototyping of Hippocampus-Inspired Architecture for Context-Aware Sequence PredictionDesign & IP · arXiv cs.AR (Hardware Architecture) · Summary
Unlike conventional architectures that treat memory as static pattern storage, the hippocampus organizes experience as ordered sequences and retrieves them through temporally compressed replay spanning prior, current, and anticipated states.
This capacity of context-appropriate sequence prediction remains absent from conventional deep learning accelerators and existing neuromorphic fabrics. We present HippocamFLEX, a fully synthesizable digital implementation of these hippocampal computational …
Liquid-Cooled NVIDIA Servers at the ASRock Rack OCP 2026 BoothMarkets & Policy · ServeTheHome · Summary

Image: ServeTheHome (opens in a new tab) We checked out the ASRock Rack booth at OCP 2026 and saw servers ranging from fully integrated NVIDIA NVL72 racks to liquid-cooled switches The post Liquid-Cooled NVIDIA Servers at the ASRock Rack OCP 2026 Booth appeared first on ServeTheHome.
Google says Asian advertisers spending less off due to Europe's customs changesMarkets & Policy · The Register · Summary
Image: The Register (opens in a new tab) PLUS: Brake pedals break on Huawei-made cars; North Korea named as source of Binance hack; and more!
Ground penetrating radar: How RF waves map the unseen worldMarkets & Policy · EDN (Electronics Design News) · Summary
Ground penetrating radar (GPR) turns invisible transitions beneath our feet into readable signals. The post Ground penetrating radar: How RF waves map the unseen world appeared first on EDN.
Sam Altman makes surprise South Korea visit as OpenAI builds on chip partnershipsMarkets & Policy · CNBC Technology · Summary

Image: CNBC Technology (opens in a new tab) OpenAI CEO Sam Altman made an unannounced visit to South Korea over the weekend, meeting with Samsung executives and reportedly SK Group executives.
Sunday 1 November 202613 stories
CEO Interview with Vera Yang of FlexcomputeMarkets & Policy · SemiWiki Forums · Summary

Image: SemiWiki Forums (opens in a new tab) Vera Yang is President and Co-Founder of Flexcompute, a frontier AI lab building a Physics World Model that bridges data-driven AI and the laws of physics.
She focuses on the problems where the stakes are highest and the physics hardest, including photonic chips for AI data centers, advanced semiconductor packaging and spacecraft… Read More The post CEO Interview with Vera Yang of Flexcompute appeared first on SemiWiki.
High-NA’s Obituary Was PrematureEquipment & Materials · SemiWiki Forums · Summary

Image: SemiWiki Forums (opens in a new tab) High numerical aperture EUV lithography was supposed to be the next step in semiconductor manufacturing. Then came the doubts: expensive scanners, smaller exposure fields, difficult economics and big customers finding ways to stretch existing equipment.
It became tempting to confuse a delayed adoption curve with a technology… Read More The post High-NA’s Obituary Was Premature appeared first on SemiWiki.
CEO Interview with Andrew Seddon of CircuitHubMarkets & Policy · SemiWiki Forums · Summary

Image: SemiWiki Forums (opens in a new tab) Andrew Seddon is a British engineer and the co-founder and CEO of CircuitHub. His product design background spans industrial equipment, medical devices and special effects equipment, including work on a motion-capture headset for A Christmas Carol.
His experience of working with electronics manufacturers led him to establish… Read More The post CEO Interview with Andrew Seddon of CircuitHub appeared first on SemiWiki.
Biwin M560 2TB SSD Review: The DRAM-less drive to beatMarkets & Policy · Tom's Hardware · Summary

Image: Tom's Hardware (opens in a new tab) The Biwin M560 brings SMI’s SM2504XT to retail with top-tier responsiveness and excellent efficiency, though not the fastest post-cache writes.
CEO Interview with Peter Jenkins of InfinitesimaMarkets & Policy · SemiWiki Forums · Summary

Image: SemiWiki Forums (opens in a new tab) As CEO, Peter Jenkins, leads the development and commercialisation of angstrom-scale process control technology, helping semiconductor manufacturers gain deeper process insights, improve yields and enable the next generation of advanced devices.
His international career has also included roles in the Netherlands, South… Read More The post CEO Interview with Peter Jenkins of Infinitesima appeared first on SemiWiki.