News from October 2026

AI Infra Summit 2026 brought together data center architects, system designers, and infrastructure leaders in Santa Clara, CA, from September 15 – 17. At the event, the CXL Consortium demonstrated how the latest developments in CXL technology help the industry break through the memory wall facing AI workloads.

At the CXL Pavilion, Consortium member […] The post CXL Consortium Recap: Scaling AI Infrastructure at AI Infra Summit 2026 first appeared on Compute Express Link.

▪ Reports revenues of 104.6155 trillion won, operating profit of 83.3338 trillion won, net profit of 39.7756 trillion won; Quarterly sales surpass 100 trillion won for the first time ▪ Sales of HBM4 and high-value-added server products expanded; HBM4 expected

Seco S.p.A. has launched the Clea 2.0 Agentic Framework, a software platform that simplifies deploying and managing AI models and applications across edge computing devices.

The new release introduces one-click deployment and agentic fleet orchestration through a hardware-agnostic environment that supports both Seco and third-party hardware. The Clea platform targets developers, business users, original equipment [...] The post Seco Unveils Clea 2.0 Agentic Framework for Edge AI Applications ap…

6th-gen M-series silicon promises more cores, faster memory, a fatter NPU, and better connectivity, now in more form factors

Oracle plans to add those chips alongside new Nvidia hardware and OpenAI services as businesses await AI payoffs

Amazon Aurora serverless now supports database capacity of up to 384 Aurora Capacity Units (ACUs) for Aurora PostgreSQL-Compatible Edition, a 50% increase from the previous maximum of 256 ACUs.

Each ACU provides approximately 2 gibibytes (GiB) of memory with corresponding CPU and networking, so a single Aurora serverless database can now scale up to 768 GiB of memory. When the workload completes, Aurora serverless automatically scales down to zero.

This makes Aurora serverless especially well-s…

The MOU outlines a global strategic collaboration spanning advanced AI computing systems, high-performance GPU clusters and next-generation data center infrastructure. SAN JOSE, Calif., Oct. 27, 2026 /PRNewswire/ -- Compal Electronics, Inc. (TWSE: 2324) ("Compal") and ARC Cloud today...

Many organizations with workloads on VMware are looking for ways to expedite their data center exits, migrate and modernize their mission-critical workloads, or simply leverage the cloud as a secondary disaster recovery site. But they want to do so without altering existing operational playbooks.

Today, we are announcing the general availability of the VMware solution on Google Cloud, part of the Google Cloud Modernize portfolio, giving you full administrative authority for VMware Cloud Foundat…

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has announced the availability of the EPC91124 and EPC91125, two new 100V three-phase brushless DC (BLDC) motor drive evaluation boards designed to simplify the development of next-generation high-performance motion-control systems...

SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures custom silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications — has announced the availability of its fourth-generation QSiC silicon carbide power devices, launching a family of 1200V and 750V SiC bare dies and MOSFETs...

Researchers at IBM Research Europe published “Superposed analog memory for vector storage in neural networks.” Summary: Researchers demonstrated an analog phase-change memory architecture that stores multiple AI vectors in superposition, increasing effective storage density with a tunable accuracy tradeoff.

Tests on prototype PCM hardware showed inference accuracy close to full-precision software. Find the technical paper here.... » read more The post Analog Superposition Increases Effective PC…

6th Gen AMD EPYC processors will power OCI Compute E7 instances, while AMD Pensando technology provides the foundation for Oracle Acceleron converged NICs for AMD compute and accelerator instances on OCI.

For decades, core enterprise operations — from global supply chains and financial ledgers to billing engines — have relied on the performance and transactional integrity of Oracle databases.

Today at Oracle AI World in Las Vegas, Google Cloud and Oracle are expanding our partnership across the AI stack — spanning AI compute and infrastructure (including making Google TPUs available through Oracle Cloud Infrastructure), enterprise data, and agentic AI — by deepening the integration between Oracl…

Microsoft Foundry now brings Claude models into Azure Cost Management alongside the rest of your Foundry spend, generally available. Until now, Claude charges appeared under SaaS rather than under the Foundry resource used to deploy them, and Claude deplo

I am a masters computer engineering student. Apple reached out to me for an interview for the role of HWT Cellular Technology intern.

Does anyone know what kind of role this is? I don't remember applying for any such roles.

I mainly applied for Design and Verification roles only. But this particular role at Apple wasn't specific, it had all kinds of roles like Design, Verification, SW/GPU etc you name it.

Is the interview more to get to know me and my interests? It seems like I have to do the i…

The defense contractor aims to fully bring back laptop manufacturing on U.S. shores, with its first BlueChip laptop prototypes having 90% procurement cost coming from suppliers in the U.S. and other allied countries.

Microchip's latest 6A POL converter comes with power MOSFETs, PWM controller, inductors, and capacitors.

ChipAgents is expanding its agentic AI platform across digital and analog semiconductor engineering, aiming to connect fragmented design workflows through a common system that can plan tasks, operate engineering tools and evaluate results.

The Santa Clara company says its IC-Star engine combines organizational design … Read More The post ChipAgents Expands AI Across Chip Design. The Test Is Faster, Verified Results appeared first on SemiWiki.

As AI workloads scale across every industry, organizations need compute options that optimize throughput, latency, and unit economics across the AI lifecycle.

To meet this demand, Oracle and Google Cloud are partnering to bring Google Tensor Processing Units (TPUs) to Oracle Cloud Infrastructure (OCI), making OCI the first hyperscaler outside Google to offer TPUs. Together, we will deploy TPU capacity on OCI starting in the calendar year 2027.

TPUs: Co-designed from silicon to software Google b…

SAN JOSE, Calif. (Oct. 27, 2026) – Global Semiconductor Alliance (GSA) proudly announces it will honor Sanjay Mehrotra, Chairman and CEO at Micron Technology with its prestigious Dr. Morris Chang Exemplary Leadership Award at this year’s Annual Awards Celebration on Dec. 10, 2026.

Established in 1999, the Dr. Morris Chang Exemplary Leadership Award stands as Read More.. The post Sanjay Mehrotra, Chairman and CEO at Micron Technology to Receive Global Semiconductor Alliance’s Highest Honor, the …

Hi everyone! I recently got an interview opportunity with Hudson River Trading (HRT) for a Design Verification Engineer role, and I have an upcoming technical phone screening with a member of their DV team.

I have an M.S. in Electrical Engineering, with a focus on computer architecture and digital design. I wanted to ask those who have interviewed with HRT or work in hardware verification/trading firms: What does the technical phone screening typically look like?

What topics should I prioritize…

NVIDIA and Oracle today announced plans to expand Oracle Cloud Infrastructure (OCI) Superclusters with NVIDIA Vera Rubin NVL72 systems to multi-gigawatt scale, supporting growing customer demand for AI training, inference and agentic applications.

Earlier this year, we introduced Gemini Robotics 2 — our next-generation intelligence layer enabling robots to think, act, and adapt in the physical world. At the core of this breakthrough is Gemini Robotics Embodied Reasoning 2 (ER 2), a specialized Gemini model that serves as a robot’s high-level brain.

Working across any robot embodiment — from stationary arms to full humanoids — Gemini Robotics ER 2 combines advanced spatial and temporal video understanding with long-horizon planning and bu…

Synopsys’ collaboration with AMD on the Instinct MI455X GPU highlights a shift in how advanced AI processors are developed. Increasing performance depends on coordinating compute dies, memory interfaces, packaging, power delivery, and software.

According to Synopsys’ announcement, AMD used its design, verification, … Read More The post Why Synopsys’ Role in AMD’s Instinct MI455X Matters for AI Infrastructure appeared first on SemiWiki.

Power Integrations is expanding its CAPZero family of X-capacitor discharge ICs with the fourth-gen CAPZero-4 device, for industrial and consumer applications. The latest member of the CAPZero family reduces system […] The post X-capacitor discharge IC for stringent standby, no-load requirements appeared first on Electronics Weekly.

Unprecedented demand for bandwidth calls for bringing optics closer to silicon through a fundamental rethinking of the optical interconnect roadmap. The post The imec Report: Scaling Optical Interconnects For The AI Era appeared first on Semiconductor Engineering.

Unlike front-end lithography, packaging lithography typically works at feature sizes around 1 µm, so overlay accuracy, throughput and thermal stability matter more than ever-smaller CDs, and those demands grow as substrates move from 300mm wafers to panels as large as 600 x 600mm.

The post From Wafers to Panels: Overcoming Lithography Challenges in Advanced Packaging appeared first on Semiconductor Digest.

According to Yole Group’s Status of the Back-End Equipment Industry 2026 report, equipment revenue will grow from $8.1 billion in 2025 to $9.5 billion in 2026 and $10.6 billion in 2027. The post Back-End Equipment: From Volume Assembly to a Strategic Advanced Packaging Ecosystem appeared first on Semiconductor Digest.

Wafer fab equipment revenue reached $129 billion in 2025 and is forecast to approach $220 billion by 2031, a 9% CAGR, according to Yole Group’s Status of the Wafer Fab Equipment Industry 2026 report. The post Wafer Fab Equipment: A Booming Market Built on a Fragmenting Supply Chain appeared first on Semiconductor Digest.

Automated material handling systems are usually treated as the fab’s logistics layer, moving lots between tools as quickly as possible. Dr. Moh Kolbehdari of Socionext America argues that view is becoming incomplete, because every wafer carrier holds material with a continuously developing manufacturing history.

The post AMHS Is Not Just Factory Logistics appeared first on Semiconductor Digest.

Samsung’s Portable SSD P9 is the new USB4 external drive to beat. It feels premium and performed very well in our testing.

But you’ll have to pay a lot for it, or any similarly performing drive, these days.

TSMC is reportedly weighing a price increase of up to 20% for its CoWoS advanced packaging technology as Nvidia’s Blackwell and upcoming Rubin chips intensify pressure on capacity.

Equipment deliveries now reportedly take up to eight months, while separate wafer-price increases of 5% to 10% are expected in 2027, with some customers potentially facing total cost increases of up to 25%.

Every major AI buildout has multiple moving parts, but many operators are running into the same constraint. Demand for high-bandwidth memory (HBM) has outpaced what manufacturers can produce.

That supply crunch is now spilling over into the conventional dynamic random access memory (DRAM) chip that every server depends on, and the numbers show how tight [...] The post Building More with Less: How to Navigate the Memory Chip Shortage appeared first on Embedded.

A stolen Nvidia GeForce RTX 5090 graphics card has been traced to an online seller in Brazil following the disappearance of a shipment valued at R$2.5 million (approximately US$470,000) from São Paulo/Guarulhos International Airport.

Police recovered the card after identifying its serial number in an online advertisement, while investigations into the missing consignment continue. The […] The post Stolen RTX 5090 traced to online seller in Brazil appeared first on eeNews Europe.

Industry-leading product line card grew by more than half a million products THIEF RIVER FALLS, Minn., Oct. 27, 2026 /PRNewswire/ -- ­DigiKey, the global distribution leader of electronic components and automation products, announced that in Q3 2026 it expanded its portfolio by...

Fabs apply enormous engineering discipline to their tools and recipes, but manual operations such as wafer lot packaging, reticle transport, preventive maintenance and parts cleaning get far less structured scrutiny, even though valuable material passes through human hands hundreds of times a day.

Craig Walters of Kelly calls this the risk that hides in plain sight on the fab floor. The post How to Tackle Hidden Production Risks in Semiconductor Operations appeared first on Semiconductor Digest.

Silicon carbide and gallium nitride power devices have moved quickly into EV inverters, onboard chargers, solar inverters and data center power supplies.

But Dr. Pradyumna Gupta of Infinita Lab argues the qualification standards used to vouch for them, including JEDEC JESD47, AEC-Q101 and the JESD22 stress tests, were built around silicon failure modes. The post Why SiC and GaN Need Their Own Qualification Standards appeared first on Semiconductor Digest.

Wafer fab equipment spending is heading toward about $162 billion in 2026, up roughly 25%, and metrology and inspection now account for about 14% of it.

Clara Grcevic of Yole Group explains why Yole has raised its 2031 forecast for the segment from $24.7 billion to $31.4 billion, a revision driven mostly by memory, which in turn is being driven by AI.

The post The Measurement Gap: Why Metrology and Inspection Is Outgrowing the Industry’s Ability to Supply It appeared first on Semiconductor Dige…

Fabs never bought the pitch of a single, fab-wide AI platform, writes Mahima Sambre of Acumen Research and Consulting. What they are funding instead are narrow, deterministic tools, such as a defect classifier on one inspection tool or a virtual metrology model on one deposition step, deployed wherever yield loss is most expensive.

The post Why Is AI Finally Sticking Inside the Fab? appeared first on Semiconductor Digest.

For decades, semiconductor sustainability was treated largely as a chip design problem: better performance per watt, specialized accelerators and smarter power management. With the AI build-out driving a wave of new fabs, John Blyler argues the burden is now shifting onto manufacturing.

The post Has AI Shifted the Sustainability Balance from Chip Design to Manufacturing? appeared first on Semiconductor Digest.

Apple updated its 14-inch MacBook Pro and iMac lineup with the M6 chip.

The modular Keybytes project combines a Keyword hub that is magnetically connected to Keybit keys, with each key having its own microcontroller.

A massive $750 discount at Walmart brings the price of MSI's Crosshair gaming laptop crashing down. RTX 5060 graphics and a bright 240Hz IPS display are just two of the standout features of this laptop.

EMD Electronics, the North America electronics business of Merck KGaA, Darmstadt, Germany, today announced the opening of a new 38,000-square-foot research and development facility at its Sheboygan Falls, Wisconsin site, expanding the company’s ability to develop and scale advanced materials for next-generation semiconductor manufacturing.

As the semiconductor industry advances toward increasingly complex architectures, materials innovation […] The post EMD Electronics Opens New R&D Facility in…

The theme of iMAPS’ 59th International Symposium on Microelectronics, “Intelligent Packaging for the AI Era”, captured the direction of today’s semiconductor packaging industry.

Held September 28 through October 1 at the Encore Boston Harbor Resort, industry leaders explored the technologies enabling next-generation AI and high-performance computing systems, including heterogeneous integration, chiplets, hybrid bonding, advanced interconnects, […] The post View Micro’s experience at IMAPS Sympo…

S2C showcased FPGA prototyping and AI-assisted debugging at the sixth RISC-V Summit China, outlining how developers can validate complex processor designs and begin software development before first silicon.

Its demonstrations connected three stages of that effort: running substantial RISC-V systems on FPGA hardware,… Read More The post S2C Targets Faster RISC-V Bring-Up With Prototyping and AI appeared first on SemiWiki.

AI is improving fast and many startups as well as the big EDA providers are building systems for AI-based analog IC design and layout. What is the current state of those systems?

What do they currently not quite succeed to do? Can any of these take an English spec for a block and build schematic, layout and routing with associated test benches and verification all the way to a design ready for tapeout?

(Not just finding parameters to a pre-existing layout generator for a specific block type.) I…

What will be the salary that can be asked for a 5 YOE RTL design engineer with a current package of 22LPA, who got an offer in Intel ? Is it good to move to Intel ?

(As layoffs are happening ) Work - Life balance in Intel ? submitted by /u/Ill_Change9633 [link] [comments]

CopperPilot’s CEO said the startup has built its AI design agent so that “no hardware team is ever blocked because a board is too hard to design.” The post CopperPilot Raises Pre-seed to Develop AI Agent for PCB Design appeared first on EE Times.

AMD and Meta Advance Strategic Partnership to Power Meta’s Superintelligence Infrastructure