News from October 2026

The highest result attributed to a 24-core Nova Lake-S processor reaches 5,210 points in the single-thread test, followed by another submission scoring 5,191 points. For comparison, we selected baselines from existing processors with overall CPU Mark scores close to their published PassMark Averages.

The Core Ultra 9 285K scores 5,059 points and Core i9-14900KF at 4,635 points. This puts the fastest unnamed Intel sample around 3% ahead of Arrow Lake and 12% ahead of Raptor Lake Refresh in this …

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A PROPERTY of many semiconductors which so far has not been exploited is that of piezoelectricity. So, 65 years ago, started a story in the ‘Tomorrow’s Thinking’ column of […] The post Exploiting Piezoelectricity appeared first on Electronics Weekly.

DALLAS, Oct. 26, 2026 /PRNewswire/ -- Texas Instruments Incorporated (TI) (Nasdaq: TXN) today announced the pricing of four series of senior unsecured notes for an aggregate principal amount of $2.0 billion. The notes consist of the following: $500 million of 5.000% senior unsecured notes...

Cadence Design Systems Inc. has introduced the Maestro AI Model Portfolio, a collection of domain-specialized artificial intelligence models designed to power agentic workflows across semiconductor and system design.

The portfolio integrates specialized models with Cadence AI Super Agents, electronic design automation (EDA) and system design automation (SDA) tools, and reinforcement learning (RL) to improve engineering [...] The post Cadence Launches Maestro AI Models for Chip and System Design…

Hi all I started my career at Synopsys doing .lib characterization, but unfortunately got laid off. I joined another company after that, but they got acquired and my role became redundant, so I'm currently without a job.

I've been giving interviews for Physical Design roles since I have past internship experience in it and feel it's a better profile, but I haven't had any luck yet. Can anyone guide me on what I should do next?

Also i will be very happy if someone has any openings for me. My exp…

With the AI trade sputtering of late and interest rates on the rise, Anthropic's IPO is taking on outsized importance.

AMD Series · Part 2 of 3 The industry conversation is moving from AI models to AI systems, and what gets measured is moving with it, from a single inference request to a complete workflow that includes reasoning, retrieval, orchestration, tool execution, memory, and security. Agentic AI, in which software agents plan and carry out tasks

AWS Key Management Service (KMS) now supports Module-Lattice-Based Key-Encapsulation Mechanism (ML-KEM), a post-quantum cryptography standard under NIST FIPS 203, which enables two parties to establish a shared secret.

NIST designed ML-KEM to replace the classical key-establishment schemes, like DH/ECDH key agreement, and RSA-based key transport, in their strategic cryptographic roadmap (see NIST IR 8547). ML-KEM addresses the "harvest now, decrypt later" threat to those classical schemes, wher…

North American PCB Orders Surge as September Shipments Fall 6.4% Year Over Year 431279_sandyge… Oct 26, 2026 Oct 26, 2026 The Global Electronics Association releases PCB industry results for September 2026 The Global Electronics Association announced today the September 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program.

The book-to-bill ratio stands at 1.77. Total North American PCB shipments in September 2026were down 6.4% compared to the same month last yea…

Infineon Technologies AG of Munich, Germany is to supply what is said to be the world’s first 900V gallium nitride (GaN) monolithic bidirectional switches (BDS) to Enphase Energy Inc of Fremont, CA, USA (which supplies microinverter-based solar and battery systems) for deployment in its solid-state transformer (SST) power modules.

By extending the operating voltage range of GaN technology to 900V while maintaining its high-frequency switching characteristics, the devices enable highly efficient…

In this episode of The Circuit, Ben Bajarin and Jay Goldberg dissect a massive week in semiconductor earnings and infrastructure developments.

The conversation opens with Micron's surprisingly transparent technology webinar, where the company outlined its high bandwidth memory (HBM) roadmap, dismissed 4F-squared memory architectures, and subtly flexed its innovation lead over Chinese competitors like CXMT.

The hosts then analyze Lam Research's inline quarter, attributing revenue caps to cleanro…

Cadence today announced the Maestro AI Model Portfolio, which powers Cadence AI Super Agents across semiconductor and system design workflows. The post Cadence Unveils Domain-Specialized Maestro AI Models for Chip Design appeared first on Semiconductor Digest.

An internal driver and a shipping manifest reveal that Intel's desktop Raptor Lake Next parts may be on the way right now.

Today we are taking a look at ASRock's high-end Radeon AI inference card for workstations, the Creator Radeon AI Pro R9700.

With 32GB of RAM and a $1700 price tag, the card is a highly affordable way to fill out a workstation for local AI inference The post ASRock Creator Radeon AI Pro R9700 Review: Workstation Inference, AMD Style appeared first on ServeTheHome.

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Apple will take 25% of the Foldable Smartphone market in 2026, according to Counterpoint Research. But how repairable will the iPhone Duo prove to be?

The post Tearing down the Apple iPhone Duo appeared first on Electronics Weekly.

Accellera Systems Initiative has approved Functional Safety Language Standard 1.0 for release, addressing a persistent challenge in semiconductor development: moving safety information reliably between tools, engineering teams, and companies.

Announced October 21, the standard establishes a common language and data… Read More The post Accellera’s FSL 1.0 Gives Functional Safety Data a Common Language appeared first on SemiWiki.

Microsoft is trying to balance a rapid AI infrastructure build-out with capital efficiency.

Asus adds an OLED screen, TMR sticks, and more comfortable grips to its AMD-powered gaming handheld.

TSMC’s CoWoS-S is critical to the artificial intelligence era because it solves the central systems problem facing modern accelerators: computing capability is growing faster than conventional packages can supply data, power, and connectivity.

CoWoS-S, meaning Chip-on-Wafer-on-Substrate with a silicon interposer, … Read More The post Inside the Package Powering Modern AI appeared first on SemiWiki.

As mentioned, looking for a mentor who could advise me regarding some important decisions I'm about to take. I'm 28, working in chip industry for 4 yrs in Bangalore, India.

Would love to discuss and practical suggestions from someone veteran or even mid career stage professionals. Please comment down or DM!

Would appreciate your help!. submitted by /u/nishvivaa [link] [comments]

SPONSORED FEATURE: The Register’s Washington dinner with HPE and NVIDIA is this Thursday. The table is nearly set.

Micron rejects 4F2, intends to use wafer bonding and High-NA EUV before going 3D NAND over the next few years.

A benchmark leak and a direct clock-matched comparison from an enthusiast seed the idea that Zen 6 may come with a decent IPC bump as well as increased clocks.

Hello, I am currently working at a WFE company as a team lead ~5 YoE. I'm interested in AMD's mechanical product engineer roles in Austin.

If anyone has insight as to what the interview process looks like or even be able to help me out with a referral I'd really appreciate it :). submitted by /u/bkftw88 [link] [comments]

I know micron is a big competitive company, but they have a ton of internships listed, so I thought I might have a shot. I think I will be rejected from all the positions I applied to there, as I have already been rejected from most.

What do your qualifications look like for someone who has gotten a mechanical engineering related internship at micron? I'm a fourth year with a 3.2 gpa and I've worked in a materials lab for over a year, I also have years of unrelated work experience.

I really wan…

Could the United States ever overtake Taiwan in semiconductor manufacturing? submitted by /u/CurrencyLow9874 [link] [comments]

hi all, will be joining micron as a process engineering intern. i’m not sure what module i’ll be working under yet. some questions for anyone who might be able to answer: - are the shifts 4x12, 3x12? do interns work night shifts? or is it a regular 9-5 - what is public transit in boise like? should i bring a personal vehicle or do you think ubers and buses would suffice - what is a typical day like? will i be working in the fab more, or is it more of a desk job + data analysis role? or is it a …

HOBOKEN, N.J., Oct. 26, 2026 /PRNewswire/ -- Quantum Computing Inc. ("QCi" or the "Company") (Nasdaq: QUBT), a vertically integrated quantum company pioneering photonics and semiconductor manufacturing, today announced that the Company will host a conference call and webcast on Monday,...

Discussions of semiconductor sustainability tend to start and stop with high-global-warming-potential fluorinated gases coming off process tools. Chris Jones, environmental sustainability manager at Edwards, argues that framing misses most of what drives a fab’s environmental performance.

The post Semiconductor Sustainability Needs a Whole-Fab View, Not a Point-of-Use Fix appeared first on Semiconductor Digest.

Advanced packaging has a bigger place at SEMICON West than ever, and SEMI is building a global home for the topic through its Advanced Packaging and Heterogeneous Integration (APHI) technology coalition. The post SEMI Builds a Global Home for Advanced Packaging appeared first on Semiconductor Digest.

The AI boom shows up on both sides of Spotfire’s business. The companies making the chips behind AI data centers are Spotfire customers, and as they run their fabs flat out, they need faster decisions from their data.

The post Spotfire Puts AI Inside the Analysis for Yield Engineers appeared first on Semiconductor Digest.

Semiconductor facilities routinely handle aggressive acids, solvents and cleaning agents, and corrosion is a persistent threat to equipment, structural steel, concrete, walls and floors. Left unchecked, it can damage assets, generate contaminants and cause costly downtime.

The post Chemical-Resistant Coatings: A Critical Defense for Semiconductor Fabs appeared first on Semiconductor Digest.

At the point where ultra-high-purity gas passes from supplier to fab, a process analyzer’s main job is to confirm the gas meets specification, which makes the data stream “intentionally and ideally kind of boring,” says Jeff Wuenschell, gas analysis applications scientist at AMETEK Process Instruments.

The post Machine Learning Could Make Gas Purity Data Do More Than Pass or Fail appeared first on Semiconductor Digest.

As AI systems scale from individual processors to large clusters of accelerators, moving data between them has become a system-level challenge. Co-packaged optics (CPO) addresses it by integrating photonic devices in the same package as the processors or switch silicon they serve.

The post Taking a Holistic Approach to Co-Packaged Optics Manufacturing appeared first on Semiconductor Digest.

In a Show Daily interview, Tamara Ellestad, founder and CEO of VELO, a woman- and minority-owned staffing firm specializing in advanced manufacturing, says staffing has grown significantly over the last two years, and candidates with specialized skills such as tool installation now field multiple calls a day.

The post The High-Tech Workforce Has Changed, and Employers Need to Change With It appeared first on Semiconductor Digest.

As device architectures shrink and move into 3D, the process windows for atomic layer processes have narrowed to the point where valve performance has become a system-level concern.

Jeff DeWitt of Swagelok traces how semiconductor fluid systems have evolved through three eras, purity, performance and precision, each driven by the industry’s most pressing process challenge at the time. The post From Fluid Handling to Dose Control: How Valve Technology Evolved from Process Component to Dose-Contr…

Compact TCKE5 eFuses provide configurable overcurrent and short-circuit protection for low-voltage electronic systems. The post Toshiba Unveils eFuse ICs for 1.8V Power Line Protection appeared first on Power Electronics News.

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on EMI Guidance for Power Converters, FinFET-Based Power Devices, Simulation-Driven Thermal Modeling for SiC and GaN Converters!

The post EMI Guidance for Power Converters, FinFET-Based Power Devices, Simulation-Driven Thermal Modeling for SiC and GaN Converters: Power Electronics Week Insights appeared first on Power Electronics News.

Cadence unveiled Maestro, domain-specialized AI models for its chip design agents, with early access for select customers in Q4 2026.

On 22 October 1981, Philips filed a European patent application for a communication system between integrated circuits that would later become known worldwide as the I²C bus. Forty-five years later, the basic principle is still going strong.

Two lines, one for data and one for the clock, continue to connect countless chips in embedded systems, consumer electronics, cars and industrial applications.

Champagne is an unusual opening act for a semiconductor conference. At SEMICON West 2026, October 13 to 15, at the Moscone Center in San Francisco, it served a purpose.

The toast marked an industry that has already crossed $1 trillion in annual revenue, almost four years ahead of earlier projections. WSTS (World Semiconductor … Read More The post SEMICON West 2026: After the Toast, the Hard Questions appeared first on SemiWiki.

In October, two technology executives offered Europe similar advice. In Turin, Alibaba Group Holding chairman Joe Tsai urged European companies to use open-source models and their proprietary industrial data to build AI capabilities.

In Berlin, Nvidia chief Jensen Huang pressed German manufacturers to apply AI to factories, robotics and other physical industries. Both see opportunity in Europe’s engineering strengths, while their companies stand to benefit from supplying the technology.

Recent.…

With SEMI projecting 300mm fab equipment spending to rise 18% to $133 billion in 2026, more advanced tools are entering production, and their optics must do more than hit an initial reflectance target.

Dr. Sabina Kuprėnaitė of OPTOMAN argues that surviving a laser pulse and staying optically stable across billions of them are different qualification questions. The post Optical Stability Is Becoming a Process-Control Issue appeared first on Semiconductor Digest.

By PETE SINGER, Editor-in-Chief, Semiconductor Digest As device architectures grow more three-dimensional, the turbomolecular pumps that clear etch byproducts from process chambers have to move faster.

Dawn Stephenson, business development manager, chamber solutions, at Edwards Vacuum, said her team has pushed turbopump speeds past 5,000 liters per second, with 7,000 next, without growing the pump’s… The post More Pumping Speed, Same Footprint: Edwards Previews Its Next-Gen Turbopumps appeared …

By PETE SINGER, Editor-in-Chief, Semiconductor Digest Edwards Vacuum’s new 250,000-square-foot facility in Genesee County, N.Y., known internally as PC Genesee, has begun low-volume production, marking a shift away from relying solely on South Korea to supply dry vacuum pumps worldwide.

“Our machine shop has begun production, so we’re going to be shipping our first parts… The post Edwards’ Genesee Facility Enters Production, Bringing Dry Pump Manufacturing to the U.S. appeared first on Semicond…

Intel CEO Lip-Bu Tan has reportedly discussed potential areas of cooperation with AMD chief Lisa Su as Intel works to rebuild its CPU business and expand its foundry operations. The companies have already collaborated on x86 standards and CPU software, including AMD’s integration of its ZenDNN optimizations into Intel’s oneDNN library.

Neither executive has publicly detailed the reported discussions or confirmed a new agreement.

Three US companies are developing accelerator-based alternatives to the tin-plasma source at the heart of ASML’s EUV scanners. They promise more usable power, cleaner and more controllable light and ultimately the freedom to move beyond today’s 13.5-nanometer wavelength.