Delayed, as of 20:00 UTC. Source: delayed quotes from a public quote service, refreshed at most every two minutes. Prices in each listing's own currency. Market data, not investment advice.
Closing the design for manufacture: physical verification, reliability checks such as electromigration and ESD on RF pins, a sign-off review of post-layout performance across corners, release of the layout database to the foundry, and preparation of the evaluation boards, fixtures, calibration standards and test plans that will be needed when wafers return.
Where this stage sits
This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.
Key0.0Specified0.3Sketched0.5Simulated0.8Feature complete1.0CompleteFreezeFrozenFaded block: still at the step shown before it, Held below Complete or Maintained under change control once complete or frozenFreeze or sign-off pointMilestone for one item; the rest of the work carries onMilestone gateTRTechnical readiness review (TR): a gate that checks the technology is ready before the next commitment.You are here: Sign-off & Tape-outAI impactDDisruption (red)AAugmentation (blue)OOpportunity (green)How AI is changing the workWhat the steps meanWhat the codes mean
Layout & EM Extraction: maturity 0.5, Simulated. Product plan agreed and development committed: cost, schedule, bands and certification scope are set.
Sign-off & Tape-out: maturity 0.5, Simulated. Product plan agreed and development committed: cost, schedule, bands and certification scope are set.
RF Characterisation & S-parameter Measurement: maturity 0.8, Feature complete. Samples with lead customers, first as parts and then as modules, while certification and qualification run.
Layout & EM Extraction: maturity 1.0, Complete. Budget closed on post-layout results: each block's extracted gain, noise, linearity and loss fits with margin.
Sign-off & Tape-out: maturity Freeze, Frozen. Architecture and budget fixed in the taped-out design; measured results update the budget under change control.
RF Characterisation & S-parameter Measurement: maturity Freeze, Frozen. Architecture and budget fixed in the taped-out design; measured results update the budget under change control.A
Layout & EM Extraction: maturity 0.8, Feature complete. Device models validated at frequency and the kit version recorded for design; correlation with silicon is still to come.
Sign-off & Tape-out: maturity 0.8, Feature complete. Device models validated at frequency and the kit version recorded for design; correlation with silicon is still to come.
RF Characterisation & S-parameter Measurement: maturity 1.0, Complete. Models correlated with de-embedded silicon measurements, with differences explained and fed back to the foundry.A
Layout & EM Extraction: maturity 1.0, Complete. Post-layout performance meets the specification across corners on the extracted layout with its electromagnetic models.
Sign-off & Tape-out: maturity Freeze, Frozen. Design fixed in the tape-out database; silicon debug feeds the issue log and the next revision.A
Layout & EM Extraction: maturity 1.0, Complete. Full electromagnetic extraction of the layout complete, with coupling and isolation within budget; package models and silicon correlation build on it.A
Sign-off & Tape-out: maturity 1.0, Complete. Full electromagnetic extraction of the layout complete, with coupling and isolation within budget; package models and silicon correlation build on it.
RF Characterisation & S-parameter Measurement: maturity 1.0, Complete. Full electromagnetic extraction of the layout complete, with coupling and isolation within budget; package models and silicon correlation build on it.
Layout & EM Extraction: maturity 0.8, Feature complete. Control interface map and calibration specification final with the schematics; the algorithms wait for silicon.
Sign-off & Tape-out: maturity 0.8, Feature complete. Control interface map and calibration specification final with the schematics; the algorithms wait for silicon.
RF Characterisation & S-parameter Measurement: maturity 0.8, Feature complete. Control interface map and calibration specification final with the schematics; the algorithms wait for silicon.
Layout & EM Extraction: maturity 0.5, Simulated. Substrate, die to package to board transitions and antenna designed and simulated at first pass.
Sign-off & Tape-out: maturity 0.8, Feature complete. Substrate and antenna layout drawn around the taped-out die, with package-aware electromagnetic models in progress.
RF Characterisation & S-parameter Measurement: maturity 1.0, Complete. Module and antenna design complete, with package-aware electromagnetic models, thermal and mechanical checks and the bill of materials, ready to freeze.
Layout & EM Extraction: maturity 0.5, Simulated. Measurement plan drafted, de-embedding structures in the layout and evaluation boards and fixtures designed.
Sign-off & Tape-out: maturity 0.8, Feature complete. Characterisation plan final, boards and fixtures ordered and the bench being calibrated for first silicon.
RF Characterisation & S-parameter Measurement: maturity 1.0, Complete. Silicon measured with fixture effects removed and correlated with simulation; module and datasheet values follow from it.DA
Layout & EM Extraction: maturity 0.5, Simulated. Certification scope and budget agreed with the product plan; testing waits for hardware.
Sign-off & Tape-out: maturity 0.5, Simulated. Certification scope and budget agreed with the product plan; testing waits for hardware.
RF Characterisation & S-parameter Measurement: maturity 0.8, Feature complete. Pre-compliance scans running on evaluation boards and then module samples, with the pre-compliance plan final.
Layout & EM Extraction: maturity 0.3, Sketched. RF stresses chosen, such as mismatch ruggedness and high-power life tests, and reliability checks run on the layout.
Sign-off & Tape-out: maturity 0.3, Sketched. RF stresses chosen, such as mismatch ruggedness and high-power life tests, and reliability checks run on the layout.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.