News from October 2026

After planar transistors gave way to FinFETs and FinFETs to gate-all-around nanosheets, the next transistor architecture is coming into focus: the complementary FET, or CFET, which stacks n-type and p-type transistors on top of each other to build the same logic in roughly half the footprint.

Intel, TSMC, Samsung and IBM Research have now all put working silicon behind the concept. The post Stacking Up: Inside the Industry’s Race to Build CFET Transistors appeared first on Semiconductor Digest.

Imec President and CEO Patrick Vandenameele opens ITF USA at SEMICON West with his keynote, “Orchestrating a Scalable AI Revolution,” arguing that the next compute multiplier will come from collaboration across the whole ecosystem rather than from a single breakthrough.

The post AI Will Not Scale Without Expanding Ecosystem Collaboration appeared first on Semiconductor Digest.

The semiconductor industry has two problems to solve to keep pace with AI, Bill Wiseman, senior partner at McKinsey & Company, told the SEMI Market Symposium at SEMICON West: control the power it takes to process tokens, and build faster. “Demand’s on an exponential,” he said.

“Everything that we have built in this industry is all linear.” The post McKinsey’s Wiseman: AI Demand Is Exponential, but the Industry Still Builds Linearly appeared first on Semiconductor Digest.

Compact 48V power management and precision position sensors help humanoid robots improve integration, motion control, and functional safety. The post Allegro Introduces 48V Power and Precision Sensors for Robotics appeared first on Power Electronics News.

2300 V SiC technology targets higher efficiency and power density in AI data centers, energy storage, and grid applications. The post Navitas Launches 2300-V SiC Power Module for Grid Infrastructure appeared first on Power Electronics News.

Taipei, Oct. 22 (CNA) Eleven union officials at U.S. memory chipmaker Micron Technology Inc.'s Taoyuan operations began a 24-hour "strike" Thursday, accusing the company of failing to offer a concrete profit-sharing proposal and criticizing an agreement reached with its Taichung union a day earlier.

Taipei, Oct. 22 (CNA) Taiwanese chip design conglomerate Egis Group signed strategic partnership and investment agreements with French processor designer SiPearl on Thursday, advancing its plans for a platform that integrates specialized chips from different suppliers.

Deploying an AI model on edge hardware involves much more than generating application code. The model needs to be compressed or quantized to fit available memory, compiled for a specific processor, integrated with a runtime, and tested for latency, power consumption, and accuracy.

Developers must also make the software work with the surrounding embedded components [...] The post How Agentic AI Accelerates Edge AI Software Development appeared first on Embedded.

Socionext Inc. is expanding its use of agentic artificial intelligence (AI) across system-on-chip (SoC) development, extending AI-driven workflows from front-end design and verification to the physical design of large-scale chips manufactured using advanced process technologies.

The initiative includes a collaboration with Cadence Design Systems Inc. and the deployment of its InnoStack AI Super Agent for [...] The post Socionext, Cadence Advance AI-Driven 3-nm SoC Design appeared first on Embed…

Google’s TPUs now serve AI in production at Meta, through new open-source engines that run PyTorch models natively on the chips.

Micron believes that more advanced process technologies will present more benefits in terms of DRAM bit density than smaller memory cells.

After years with the Cezanne-based 5500, AMD has finally updated its $100 CPU to the 5500F in the Vermeer family, adding a 200 MHz boost in clock speed and a PCIe 4.0 upgrade.

TSMC is reportedly asking equipment suppliers for factory machinery that doesn't use rare-earth components, as the chipmaker seeks to reduce exposure to China’s dominance of critical minerals and permanent magnets.

According to TDK, its expanded family of multi-layer inductors provides 1.7X to 2X higher impedance than conventional components.

Intelligence at the edge can transform applications across consumer, industrial, smart home, and enterprise markets, as demand grows for devices that can interpret their environment and make context-aware decisions.

An off-the-shelf sensor and carefully done analog circuity led to a detector for sub-atomic particles.

Growth in electronics production has been accelerating in 2026. Three-month-average change versus a year ago for electronics production in the U.S. was 8.1% in August 2026, continuing an accelerating growth trend since October 2025.

Japan and the 27 countries of the European Union (EU 27) showed much stronger growth acceleration.... Read more"Strong Electronics Growth"

The growing maturity of integrated photonics creates opportunities for the wider Dutch high-tech industry.

Not only in manufacturing capabilities like specialized equipment, manufacturing, packaging and testing, but also in system integration and the next generation of products in AI infrastructure, autonomous machines and smaller optical instruments for healthcare, agrifood and defense.

It’s time to throw the ballast overboard and set a clear course in the Netherlands.

3D chip systems create formidable opportunities for Europe and the Netherlands, believes Hamed Sadeghian, CEO of Nearfield Instruments. He sees new business models emerging in the production of silicon systems and equipment.

Seizing those opportunities will require courage, however, as well as a willingness to collaborate.

Hamed Sadeghian proposes the creation by leading Dutch high-tech players of an industrial venture for semiconductor systems scaling.

Neways has entered a multi-year partnership with Melexis to package the fabless semicon company’s Triphibian pressure sensors for thermal management in electric vehicles and AI data centers.

CEO Richard Blickman seeks to allay fears of a slowdown in his firm’s primary growth market.

Nvidia has developed a prototype that places optical engines directly on the interposer alongside computing chips, bringing electrical-to-optical conversion closer to the processor.

Micron doesn’t plan to adopt 4F² DRAM, arguing that its added complexity and cost don’t offer a viable scaling path.

Nvidia CEO Jensen Huang told CNBC Thursday that demand for neocloud firms is "off the charts," but scarce capital is holding back growth.

Nvidia's Jensen Huang told CNBC that a surplus of memory supply is unlikely by 2029, as memory stocks have taken a beating in the past week.

SK Hynix has shelved plans for a potential U.S. IPO of Solidigm amid market volatility and share price concerns.

Liquid cooling enables CoreWeave to run AI hardware at peak performance with a significant reduction in water needs.

NVIDIA Vera Rubin NVL72 is now in limited availability on CoreWeave Cloud. Cognition becomes the first customer running production agentic AI workloads and benchmarking performance.

“The Great Migration” to the Edge I frequently hear the term “The Great Migration” to describe intelligence expanding from cloud to edge, from screens to machines, from human interaction to autonomous agents, and from data analysis to sensing and acting in the real world.

The tech industry is scrambling to build the foundation for physical […] The post Synaptics Astra SR200 and Coralboard SR — Bigger AI for Smaller Devices appeared first on Moor Insights & Strategy.

Global Electronics Association's ADEPT Council Deepens Taiwan Presence as First Satellite Council Holds Inaugural In-Person Meeting 431279_sandyge… Oct 22, 2026 Oct 21, 2026 Convening more than 10 companies in Taiwan to shape global technology roadmaps, with a focus on next-generation guidelines and standards critical to AI and HPC The Global Electronics Association's Advanced Electronic Packaging Technology (ADEPT) Leadership Council is deepening its presence in Taiwan.

ADEPT Taiwan, the Counc…

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This dashboard has weekly and nightly performance regressions for those interested. On nightly build, Kunminghu v3 has hit GEOMEAN(INT) of 21.706 with gcc, which keeps going up as the platform nears validation and release phase in Q1 2027.

SPECint06/GHz on xscc is 21.924. SPECint17/GHz is 2.321, which also compares favorably to the best from it's competitors. --------- Lot of ignorant comments in previous ARM vs QCOM thread, about why companies aren't abandoning ARM and going toward RISCV faste…

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Teradyne has introduced the UltraFLEXplus S series, extending its semiconductor test platform to address the manufacturing economics of edge artificial intelligence. Announced on October 12, 2026, the series begins with the UltraFLEXplus S24, a 24-slot system intended for engineering and production testing.

Its target… Read More The post Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series appeared first on SemiWiki.

By Gleb Tsipursky SEMICON West 2026’s smart-manufacturing agenda connected digital twins, agentic AI, physical AI, and increasingly autonomous factory operations. The final day included a session on automation and equipment for autonomous facilities.

At its October CONNECT conference, PDF Solutions planned demonstrations… Read More The post SEMICON West’s Autonomous Fab Vision Needs a Decision-Escalation Design appeared first on SemiWiki.

The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient.

The next wave of innovation will depend not just on what companies develop,… Read More The post From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation appeared first on SemiWiki.

The global smartphone market shrank 22.0% YoY to 255.3 million, according to IDC., Shipments marking the highest YoY decline to date of any quarter.. “The sharp downturn the industry has […] The post Q3 phone market sinks 22% YoY appeared first on Electronics Weekly.

Photon Bridge, the Dutch photonics specialist, has raised €10 million to tackle an emerging bottleneck in AI infrastructure: producing the millions of lasers that will be needed to connect increasingly […] The post Photon Bridge raises €10m appeared first on Electronics Weekly.

Industrial automation is increasingly becoming a strategic priority for manufacturers, with robotics, AI and connected production systems promising productivity, flexibility and resilience, writes Payam Pajoohi of PHYTEC.

Despite this, adopting […] The post Why embedded engineering is becoming a bottleneck for industrial automation appeared first on Electronics Weekly.

There was once a company expecting to lose $17 billion one year who bought in a new CEO. He mortgaged all the assets of the company to raise a $23.5 […] The post Fable: The CEO Who Cut The Cr*p appeared first on Electronics Weekly.

The Department of Commerce today announced the signing of four letters of intent to provide up to $389 million in federal R&D awards under the CHIPS and Science Act.

Advanced packaging growth and capacity constraints are pushing more onto OSATs. The post Foundries And OSATs Increasingly Overlap appeared first on Semiconductor Engineering.

Engineers are discovering many things they thought were process assumptions were actually wafer assumptions. The post What Breaks When Packaging Moves From Wafer To Panel? appeared first on Semiconductor Engineering.

Integrated voltage regulators reduce current density, provide higher regulation bandwidth, and reduce reliance on large decoupling capacitor networks. The post Stacked-Die Multi-Chip Architectures: The Tradeoff Between Scaling And Power Delivery appeared first on Semiconductor Engineering.

A process sequence for SRAM and logic that delivers higher performance through larger effective channel width and improved electrostatics at smaller nodes. The post How Self-Aligned CFET Technology Could Extend CMOS Scaling Beyond 10 Å appeared first on Semiconductor Engineering.

SEMICON West 2026: Advanced packaging, photonics, test, and AI are increasingly intertwined; very different conversations ahead. The post Chip Scaling Moves Beyond The Transistor appeared first on Semiconductor Engineering.

Two devices operating at exactly the same voltage, frequency, and temperature can behave differently depending on what they are being asked to do. The post PVTW: Extending Silicon Characterization From PVT To Real-World Workload appeared first on Semiconductor Engineering.