Delayed, as of 16:35 UTC. Source: delayed quotes from a public quote service, refreshed at most every two minutes. Prices in each listing's own currency. Market data, not investment advice.
The practices that keep a product supplied and supported for as long as customers need it, applied on top of every lifecycle: lifecycle monitoring of components and processes, change and discontinuance notices, last-time buys, die banking, bridge buys, second sources, redesign and requalification, and long-term supply agreements.
Mapped onto 36 of 36 lifecycles: 432 of 432 stages and 683 of 683 gates have practices from this overlay.
Where obsolescence practices apply, lifecycle by stage
Each row is a lifecycle and each cell one of its stages, in order. A cell counts the practices whose phase matches the stage. Select a cell to open the stage, where the practices and the gate questions are listed.
2. Concept & Business Case: Obsolescence management plan and supply life targets; Component and technology selection for supply life; Long-term supply agreements
3. Definition & Planning: Component and technology selection for supply life; Second sources and approved alternates
4. Development: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates; Archiving for long-term support
8. Launch: Lifecycle monitoring of components, processes, IP and tools; Long-term supply agreements; Product change and discontinuance notices; Die banking and wafer storage
9. Ramp & Growth: Lifecycle monitoring of components, processes, IP and tools; Long-term supply agreements; Product change and discontinuance notices; Die banking and wafer storage
10. Maturity & Sustaining: Lifecycle monitoring of components, processes, IP and tools; Product change and discontinuance notices; Bridge buys; Redesign, migration and requalification; Authorised sources and counterfeit avoidance at end of life
11. Decline: Lifecycle monitoring of components, processes, IP and tools; Product change and discontinuance notices; Last-time buys; Die banking and wafer storage; Bridge buys; Redesign, migration and requalification; Archiving for long-term support; Authorised sources and counterfeit avoidance at end of life
12. End of Life: Product change and discontinuance notices; Last-time buys; Die banking and wafer storage; Bridge buys; Redesign, migration and requalification; Archiving for long-term support; Authorised sources and counterfeit avoidance at end of life
13. Post-EOL Support: Product change and discontinuance notices; Last-time buys; Die banking and wafer storage; Bridge buys; Redesign, migration and requalification; Archiving for long-term support; Authorised sources and counterfeit avoidance at end of life
1. Concept & Feasibility: Obsolescence management plan and supply life targets; Component and technology selection for supply life; Long-term supply agreements
3. IP Integration: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates
4. SoC RTL Design: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates
6. Full-Chip DFT: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates
7. Physical Design & Sign-off: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates
13. Production Ramp & Yield: Lifecycle monitoring of components, processes, IP and tools; Long-term supply agreements; Product change and discontinuance notices; Die banking and wafer storage
14. Volume Production & Sustaining: Lifecycle monitoring of components, processes, IP and tools; Long-term supply agreements; Product change and discontinuance notices; Die banking and wafer storage; Bridge buys; Redesign, migration and requalification; Authorised sources and counterfeit avoidance at end of life
15. End of Life: Product change and discontinuance notices; Last-time buys; Die banking and wafer storage; Bridge buys; Redesign, migration and requalification; Archiving for long-term support; Authorised sources and counterfeit avoidance at end of life
1. IP Specification & Architecture: Obsolescence management plan and supply life targets; Component and technology selection for supply life; Second sources and approved alternates; Long-term supply agreements
2. Micro-architecture: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates
3. RTL to Early Access: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates
4. RTL Completion: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates
5. IP Verification: Lifecycle monitoring of components, processes, IP and tools
6. IP DFT & Implementation Views: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates
7. IP Quality Checks: Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates; Redesign, migration and requalification
8. IP Release & Hand-off: Lifecycle monitoring of components, processes, IP and tools; Product change and discontinuance notices; Bridge buys; Redesign, migration and requalification; Archiving for long-term support; Authorised sources and counterfeit avoidance at end of life
1. Specification & Process Selection: Obsolescence management plan and supply life targets; Component and technology selection for supply life; Second sources and approved alternates; Long-term supply agreements
2. Circuit & Block Design: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates
3. Design Verification & Early Views: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates
4. Physical Implementation: Component and technology selection for supply life; Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates
7. Silicon Validation & Reliability: Lifecycle monitoring of components, processes, IP and tools; Second sources and approved alternates; Redesign, migration and requalification
8. Quality Checks & Release: Second sources and approved alternates; Redesign, migration and requalification; Archiving for long-term support
9. Support, Porting & End of Support: Lifecycle monitoring of components, processes, IP and tools; Product change and discontinuance notices; Last-time buys; Die banking and wafer storage; Bridge buys; Redesign, migration and requalification; Archiving for long-term support; Authorised sources and counterfeit avoidance at end of life
32 more lifecycles for registered members.
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