1. Purpose
This procedure turns the obsolescence management overlay into work with owners, steps and records. Every chip depends on things that will one day stop being available: a process node, a package, a substrate, an IP block, a design tool, a test platform or a paired component. The procedure makes sure the product's supply life is planned against those dependencies rather than discovered when one of them ends.
Obsolescence is managed in two modes. Proactive work, at planning, selection and monitoring, keeps options open and cheap. Reactive work, when a notice arrives, chooses between a last-time buy, a bridge buy, die banking, an alternate or a redesign. The procedure runs both, and treats every reactive case as a lesson for the next selection.
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