Localizing and identifying the physical cause of a silicon failure: electrical fault isolation, emission microscopy, OBIRCH and laser techniques, FIB cross section, SEM and TEM imaging, and decap and deprocessing, ending in a defect mechanism rather than a suspicion.
No statement on what tools can do has been recorded for this skill yet.
The Hub knows of no registered course, programme or certification for this skill yet.
Note from the research register: Learned in an FA lab alongside experienced analysts across many cases; the equipment skill is taught, the hypothesis discipline is earned through wrong calls.
Register version 1.