Also known as: Bumping Process Engineer; WLCSP Process Engineer; Solder Bump Engineer; Wafer Bump Module Engineer
See this role on the Chiplet lifecycle or on the MEMS and sensors lifecycle or on the Package technology lifecycle or on the SoC lifecycle
Owns the wafer-level interconnect formation step — under-bump metallisation, copper pillar and solder bump plating, reflow and wafer-level chip-scale package build — that every flip-chip and 2.5D assembly depends on. Controls bump height, coplanarity and metallurgy at wafer scale.
Work in progressNo day-in-the-life description has been written for this role yet. If you do this work, we would welcome yours. Suggest a source or a correction
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