News / Equipment & Materials / Micron details ambitious DRAM and NAND roadmap — 3D NAND, High-NA EUV, new materials, and custom silicon makes a comeback

Micron details ambitious DRAM and NAND roadmap — 3D NAND, High-NA EUV, new materials, and custom silicon makes a comeback

By The Semiconductor Hub news desk · 2026-11-04

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Micron details ambitious DRAM and NAND roadmap — 3D NAND, High-NA EUV, new materials, and custom silicon makes a comeback — Image: Tom's Hardware (opens in a new tab)

As DRAM and 3D NAND are about to adopt all-new technologies, custom types of memory are about to become mainstream as AI developers face limitations with current solutions.

Read at Tom's Hardware

Source: Tom's Hardware, published 2026-11-04. The summary is the Hub's own; the full story is at the source. Report a rights or accuracy concern

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