725 abbreviations with 1,246 meanings, from the gate and discipline codes on the lifecycle charts to the standards, bodies and industry terms the Hub uses. Where the same letters mean different things, each meaning is listed with the lifecycles that use it. The list is built from the lifecycle and compliance data, so it stays current. For definitions of terms in general, see the glossary.
The testers that run production test programs on wafers and packaged parts.
Manufacturing, test and packaging
Used in: Test program lifecycle, Test program lifecycle: ATE platform and test operations
Polishing a wafer flat between process steps.
Manufacturing, test and packaging
Lists the sensor interface, automotive, medical, environmental and materials standards the sensor must meet, plans and records interface conformance testing, and issues the materials declarations, export classification and other evidence customers ask for.
Discipline codes
Plans certification for every target market and scheme, runs pre-compliance scans, manages formal testing at accredited laboratories, and keeps the certification file and its change assessments current.
Discipline codes
In: RF lifecycle
A sudden static discharge that can damage a chip; chips carry protection circuits and are tested for it.
Manufacturing, test and packaging
Used in: AMS lifecycle: Extraction, reliability and ESD checks
Lithography with very short wavelength light, used to print the finest features of leading-edge nodes.
Manufacturing, test and packaging
Full production of a process or product, after risk production and ramp.
Manufacturing, test and packaging
The node is released for high-volume manufacturing with production recipes, a process control plan and the capacity plan in place.
Gate codes
A bare die tested well enough to be trusted before it is assembled with others in a package.
Manufacturing, test and packaging
The wafer sort program for each die meets the agreed known-good-die quality, and a bank of tested dies is ready for assembly.
Gate codes
Wafer-level optical and electrical measurements are correlated with the models, and the criteria that decide which dies go on to assembly are agreed and released.
Gate codes
The software that tracks and controls each lot and tool step in a factory.
Manufacturing, test and packaging
Used in: Fab build lifecycle: Factory automation, MES and OT security
A shared wafer run where several designs split the mask and wafer cost, often used for prototypes.
Manufacturing, test and packaging
Used in: MPW calendar, Photonics lifecycle: Photonic MPW & Tape-out
Adjusting mask shapes so the printed pattern on the wafer matches the intended layout.
Manufacturing, test and packaging
A company that packages and tests chips for others.
Manufacturing, test and packaging
Selects and manages the outsourced assembly and test suppliers and the supply of wafers and substrates, gets their lines ready and plans their capacity.
Discipline codes
Extra wiring layers that reroute a die's connections to where the package needs them.
Manufacturing, test and packaging
Used in: Package technology lifecycle: Wafer-level processes: bumping, RDL and fan-out
A vertical connection through a silicon die, used to stack dies and in interposers.
Manufacturing, test and packaging
Used in: Package technology lifecycle: Interposer, TSV and hybrid bonding
Packaging steps done on the whole wafer before it is cut into dies.
Manufacturing, test and packaging
Develops the wafer-level modules: under-bump metallurgy, solder bumps and copper pillars, redistribution layer lithography, plating and dielectrics, fan-out reconstitution and moulding, and panel-level variants where used.
Discipline codes
Gate and discipline codes are plain initials chosen for the Hub's charts, not any company's internal codes. Standard names belong to their publishers; the guides explain them in our own words. Missing an abbreviation? Suggest one.