What the target market and customers need from the product, gathered before the chip is defined.
Requirements Work product in the SoC and full-chip lifecycle, the Hard IP lifecycle, the Analog and mixed-signal lifecycle, the Chiplet and advanced packaging lifecycle, the FPGA-based product development lifecycle, the Automotive and safety-critical lifecycle, the AI accelerator lifecycle, the Process technology (node) lifecycle, the Process design kit (PDK) development lifecycle, the Firmware and software stack lifecycle, the Test program and ATE development lifecycle, the Fabless startup chip lifecycle, the Memory product lifecycle (DRAM, NAND and HBM), the Space and radiation-hardened parts lifecycle, the Silicon photonics and optical interconnect lifecycle, the Power and compound semiconductor lifecycle, the Fab build and equipment qualification lifecycle, the MEMS and sensors lifecycle, the RF and mmWave product lifecycle, the Package technology development lifecycle, the Chip and product security lifecycle, the Semiconductor equipment lifecycle, the Medical electronics and medical device chips lifecycle, the Avionics and airborne electronics lifecycle, the Industrial and energy electronics lifecycle, the Automotive SPICE process and assessment lifecycle, the Vehicle cybersecurity and software update lifecycle, the APQP and PPAP lifecycle, the Quality management system lifecycle (ISO 9001 and IATF 16949), the System development lifecycle, the Platform and derivative products lifecycle, the FPGA chip development lifecycle, the Structured ASIC lifecycle and the Product lifecycle
They capture what customers and the market need before the chip is defined, so engineering builds a product people will buy. Features chosen by engineering preference miss key standards or interfaces, and the product misses its market window.
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