Chip lifecycle / Power and compound lifecycle / Customer & Automotive Qualification

Customer & Automotive Qualification

Qualifying the part with each customer once the design-in is agreed: customer qualification support, customer-specific requirements, audits of the fab and assembly sites, the production part approval process with its control plan and part submission warrant for automotive customers working to IATF 16949, and the production release with a long-term supply commitment.

Where this stage sits

This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.

Stage

^A08 Reliability & Ruggedness Qualification

^D09 Customer & Automotive QualificationYou are here

^A10 Production Ramp

Business and customers milestones

DICustomer design-in agreed PRProduction part approval and release VRVolume ramp TAWafer size transition approved

Device and process milestones

AVApplication validated QSTQualification start DQTR3Device qualified MQModule qualified RCRamp complete

Power product management and business^O

0.8

1.0

Applications and system engineering^A

1.0

Substrate and epitaxy supply^D

Freeze

Device design and TCAD^A

Freeze

Process development and integration^A

Freeze

Wafer fab manufacturing and yield^A

0.8

1.0

Device characterisation^D

1.0

Device models and simulation support^A

1.0

Reliability and ruggedness qualification^A

1.0^AA

Package and module engineering^A

Freeze

Production test and screening^A

0.8

1.0

Freeze^A

Quality and automotive compliance^D

0.8

1.0^D

Supply chain, capacity and cost^A

0.8

1.0

Key0.0Planned0.3Concept drafted0.5Learning0.8Near target1.0CompleteFreezeFrozenFaded block: still at the step shown before it, Held below Complete or Maintained under change control once complete or frozenFreeze or sign-off pointMilestone for one item; the rest of the work carries onMilestone gateTRTechnical readiness review (TR): a gate that checks the technology is ready before the next commitment.You are here: Customer & Automotive QualificationAI impactDisruption (red)Augmentation (blue)Opportunity (green)How AI is changing the workWhat the steps mean What the codes mean

Show this chart as a list

Stages

Reliability & Ruggedness Qualification^A
Customer & Automotive Qualification (this stage)^D
Production Ramp^A

Business and customers milestones

Device and process milestones

Application validated (AV)
Qualification start (QST)
Device qualified (DQ) (technical readiness review TR3)
Module qualified (MQ)
Ramp complete (RC)

Disciplines

Power product management and business^O
- Reliability & Ruggedness Qualification: maturity 0.8, Near target. Customer design-ins agreed, with launch, pricing and the supply commitment prepared while qualification runs.
- Customer & Automotive Qualification: maturity 1.0, Complete. Part released for volume orders with its datasheet and a long-term supply commitment; pricing, lifecycle reviews and discontinuance managed to the end.
- Production Ramp: maturity 1.0, Complete. Part released for volume orders with its datasheet and a long-term supply commitment; pricing, lifecycle reviews and discontinuance managed to the end.
Applications and system engineering^A
- Reliability & Ruggedness Qualification: maturity 1.0, Complete. Reference designs measured in the converter, gate drive guidance set and customers supported through design-in, qualification and launch.
- Customer & Automotive Qualification: maturity 1.0, Complete. Reference designs measured in the converter, gate drive guidance set and customers supported through design-in, qualification and launch.^A
- Production Ramp: maturity 1.0, Complete. Reference designs measured in the converter, gate drive guidance set and customers supported through design-in, qualification and launch.
Substrate and epitaxy supply^D
- Reliability & Ruggedness Qualification: maturity Freeze, Frozen. Specification and sources under change control; larger substrates and second sources come in as qualified changes.
- Customer & Automotive Qualification: maturity Freeze, Frozen. Specification and sources under change control; larger substrates and second sources come in as qualified changes.
- Production Ramp: maturity Freeze, Frozen. Specification and sources under change control; larger substrates and second sources come in as qualified changes.
Device design and TCAD^A
- Reliability & Ruggedness Qualification: maturity Freeze, Frozen. Design under change control; ruggedness and failure findings from qualification reviewed against it.
Process development and integration^A
- Reliability & Ruggedness Qualification: maturity Freeze, Frozen. Baseline under change control; transfers to larger wafers and process changes are qualified before use.
- Customer & Automotive Qualification: maturity Freeze, Frozen. Baseline under change control; transfers to larger wafers and process changes are qualified before use.
- Production Ramp: maturity Freeze, Frozen. Baseline under change control; transfers to larger wafers and process changes are qualified before use.
Wafer fab manufacturing and yield^A
- Reliability & Ruggedness Qualification: maturity 0.8, Near target. Process control plan updated for the qualification lots, with statistical process control on the critical steps.
- Customer & Automotive Qualification: maturity 1.0, Complete. Control plan final for production part approval; yield ramped to its mature level and improved in volume.
- Production Ramp: maturity 1.0, Complete. Control plan final for production part approval; yield ramped to its mature level and improved in volume.^A
Device characterisation^D
- Reliability & Ruggedness Qualification: maturity 1.0, Complete. Static, dynamic and ruggedness behaviour measured across temperature and compared with the design; repeated in the converter, on qualification lots and on larger wafers.
- Customer & Automotive Qualification: maturity 1.0, Complete. Static, dynamic and ruggedness behaviour measured across temperature and compared with the design; repeated in the converter, on qualification lots and on larger wafers.
- Production Ramp: maturity 1.0, Complete. Static, dynamic and ruggedness behaviour measured across temperature and compared with the design; repeated in the converter, on qualification lots and on larger wafers.
Device models and simulation support^A
- Reliability & Ruggedness Qualification: maturity 1.0, Complete. Compact, thermal and loss models released to customers and correlated with measurements in the converter and in module qualification.
Reliability and ruggedness qualification^A
- Reliability & Ruggedness Qualification: maturity 1.0, Complete. Device and module qualification passed, with failures analysed and a lifetime model; later changes requalified.^AA; Device and module qualification passed
- Customer & Automotive Qualification: maturity 1.0, Complete. Device and module qualification passed, with failures analysed and a lifetime model; later changes requalified.
- Production Ramp: maturity 1.0, Complete
Package and module engineering^A
- Reliability & Ruggedness Qualification: maturity Freeze, Frozen. Assembly process frozen with module qualification; package changes and cost-downs are qualified before use.; Assembly process frozen
- Customer & Automotive Qualification: maturity Freeze, Frozen. Assembly process frozen with module qualification; package changes and cost-downs are qualified before use.
- Production Ramp: maturity Freeze, Frozen. Assembly process frozen with module qualification; package changes and cost-downs are qualified before use.^D
Production test and screening^A
- Reliability & Ruggedness Qualification: maturity 0.8, Near target. Qualification test program released and the screening plan drafted, with production test being prepared.
- Customer & Automotive Qualification: maturity 1.0, Complete. Production test program and screening plan released with the production release.; Production test program released
- Production Ramp: maturity Freeze, Frozen. Test program under change control; test time and screens reviewed in volume.^A
Quality and automotive compliance^D
- Reliability & Ruggedness Qualification: maturity 0.8, Near target. Customer-specific requirements accepted at design-in and the production part approval package being assembled.
- Customer & Automotive Qualification: maturity 1.0, Complete. Production part approval achieved; field monitoring, change notices and records run to the end of supply.^D
- Production Ramp: maturity 1.0, Complete. Production part approval achieved; field monitoring, change notices and records run to the end of supply.^A
Supply chain, capacity and cost^A
- Reliability & Ruggedness Qualification: maturity 0.8, Near target. Capacity allocated for qualification and launch volumes against design-in forecasts.
- Customer & Automotive Qualification: maturity 0.8, Near target. Capacity allocated for qualification and launch volumes against design-in forecasts.
- Production Ramp: maturity 1.0, Complete. Capacity plan final for the volume ramp; allocation, cost-downs, wafer size moves and final builds run to the end of supply.

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