Chip lifecycle / Power and compound lifecycle / Production Ramp

Production Ramp

Ramping wafer starts, epitaxy and assembly capacity to meet demand while holding yield and quality: statistical process control, production test and screening such as gate stress and burn-in where the plan requires it, outlier detection, field monitoring and allocation of scarce substrate and capacity across customers.

Where this stage sits

This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.

Stage

^D09 Customer & Automotive Qualification

^A10 Production RampYou are here

^A11 Wafer Size Transition

Business and customers milestones

PRProduction part approval and release VRVolume ramp TAWafer size transition approved

Device and process milestones

DQTR3Device qualified MQModule qualified RCRamp complete WELarger wafer equivalence shown

Power product management and business^O

1.0

Applications and system engineering^A

1.0^A

Substrate and epitaxy supply^D

Freeze

Process development and integration^A

Freeze

Wafer fab manufacturing and yield^A

1.0

Device characterisation^D

1.0

Reliability and ruggedness qualification^A

1.0

Package and module engineering^A

Freeze

Production test and screening^A

1.0

Freeze^A

Quality and automotive compliance^D

1.0^D

Supply chain, capacity and cost^A

0.8

1.0

Key0.0Planned0.3Concept drafted0.5Learning0.8Near target1.0CompleteFreezeFrozenFaded block: still at the step shown before it, Held below Complete or Maintained under change control once complete or frozenFreeze or sign-off pointMilestone for one item; the rest of the work carries onMilestone gateTRTechnical readiness review (TR): a gate that checks the technology is ready before the next commitment.You are here: Production RampAI impactDisruption (red)Augmentation (blue)Opportunity (green)How AI is changing the workWhat the steps mean What the codes mean

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Stages

Business and customers milestones

Device and process milestones

Device qualified (DQ) (technical readiness review TR3)
Module qualified (MQ)
Ramp complete (RC)
Larger wafer equivalence shown (WE)

Disciplines

Power product management and business^O
- Customer & Automotive Qualification: maturity 1.0, Complete. Part released for volume orders with its datasheet and a long-term supply commitment; pricing, lifecycle reviews and discontinuance managed to the end.
- Production Ramp: maturity 1.0, Complete. Part released for volume orders with its datasheet and a long-term supply commitment; pricing, lifecycle reviews and discontinuance managed to the end.
- Wafer Size Transition: maturity 1.0, Complete. Part released for volume orders with its datasheet and a long-term supply commitment; pricing, lifecycle reviews and discontinuance managed to the end.
Applications and system engineering^A
- Customer & Automotive Qualification: maturity 1.0, Complete. Reference designs measured in the converter, gate drive guidance set and customers supported through design-in, qualification and launch.^A
- Production Ramp: maturity 1.0, Complete. Reference designs measured in the converter, gate drive guidance set and customers supported through design-in, qualification and launch.
Substrate and epitaxy supply^D
- Customer & Automotive Qualification: maturity Freeze, Frozen. Specification and sources under change control; larger substrates and second sources come in as qualified changes.
- Production Ramp: maturity Freeze, Frozen. Specification and sources under change control; larger substrates and second sources come in as qualified changes.
- Wafer Size Transition: maturity Freeze, Frozen. Specification and sources under change control; larger substrates and second sources come in as qualified changes.^A
Process development and integration^A
- Customer & Automotive Qualification: maturity Freeze, Frozen. Baseline under change control; transfers to larger wafers and process changes are qualified before use.
- Production Ramp: maturity Freeze, Frozen. Baseline under change control; transfers to larger wafers and process changes are qualified before use.
- Wafer Size Transition: maturity Freeze, Frozen. Baseline under change control; transfers to larger wafers and process changes are qualified before use.^A
Wafer fab manufacturing and yield^A
- Customer & Automotive Qualification: maturity 1.0, Complete. Control plan final for production part approval; yield ramped to its mature level and improved in volume.
- Production Ramp: maturity 1.0, Complete. Control plan final for production part approval; yield ramped to its mature level and improved in volume.^A
- Wafer Size Transition: maturity 1.0, Complete. Control plan final for production part approval; yield ramped to its mature level and improved in volume.
Device characterisation^D
- Customer & Automotive Qualification: maturity 1.0, Complete. Static, dynamic and ruggedness behaviour measured across temperature and compared with the design; repeated in the converter, on qualification lots and on larger wafers.
- Production Ramp: maturity 1.0, Complete. Static, dynamic and ruggedness behaviour measured across temperature and compared with the design; repeated in the converter, on qualification lots and on larger wafers.
- Wafer Size Transition: maturity 1.0, Complete. Static, dynamic and ruggedness behaviour measured across temperature and compared with the design; repeated in the converter, on qualification lots and on larger wafers.
Reliability and ruggedness qualification^A
- Customer & Automotive Qualification: maturity 1.0, Complete. Device and module qualification passed, with failures analysed and a lifetime model; later changes requalified.
- Production Ramp: maturity 1.0, Complete. Device and module qualification passed, with failures analysed and a lifetime model; later changes requalified.
- Wafer Size Transition: maturity 1.0, Complete. Device and module qualification passed, with failures analysed and a lifetime model; later changes requalified.
Package and module engineering^A
- Customer & Automotive Qualification: maturity Freeze, Frozen. Assembly process frozen with module qualification; package changes and cost-downs are qualified before use.
- Production Ramp: maturity Freeze, Frozen. Assembly process frozen with module qualification; package changes and cost-downs are qualified before use.^D
- Wafer Size Transition: maturity Freeze, Frozen. Assembly process frozen with module qualification; package changes and cost-downs are qualified before use.
Production test and screening^A
- Customer & Automotive Qualification: maturity 1.0, Complete. Production test program and screening plan released with the production release.; Production test program released
- Production Ramp: maturity Freeze, Frozen. Test program under change control; test time and screens reviewed in volume.^A
- Wafer Size Transition: maturity Freeze, Frozen. Test program under change control; test time and screens reviewed in volume.
Quality and automotive compliance^D
- Customer & Automotive Qualification: maturity 1.0, Complete. Production part approval achieved; field monitoring, change notices and records run to the end of supply.^D
- Production Ramp: maturity 1.0, Complete. Production part approval achieved; field monitoring, change notices and records run to the end of supply.^A
- Wafer Size Transition: maturity 1.0, Complete. Production part approval achieved; field monitoring, change notices and records run to the end of supply.
Supply chain, capacity and cost^A
- Customer & Automotive Qualification: maturity 0.8, Near target. Capacity allocated for qualification and launch volumes against design-in forecasts.
- Production Ramp: maturity 1.0, Complete. Capacity plan final for the volume ramp; allocation, cost-downs, wafer size moves and final builds run to the end of supply.
- Wafer Size Transition: maturity 1.0, Complete. Capacity plan final for the volume ramp; allocation, cost-downs, wafer size moves and final builds run to the end of supply.

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