Lifecycle
DesignDDisruption:55AAugmentation:138OOpportunity:29 End of lifeDDisruption:1AAugmentation:43OOpportunity:10 2Planning and concept: Opportunity & Market Sensing, Concept & Business Case
2Requirements and specification: Concept & Business Case, Definition & Planning
1Architecture: Definition & Planning
1Design: Development
1Verification: Development
1Tape-out, build and release: Development
2Validation and characterisation: Validation & Characterisation, Customer Sampling & Design-in
1Qualification: Qualification & Production Readiness
2Production and ramp: Launch, Ramp & Growth
2Sustaining and field support: Maturity & Sustaining, Decline
3End of life: Decline, End of Life, Post-EOL Support
1Planning and concept: Concept & Feasibility
2Requirements and specification: Concept & Feasibility, SoC Specification & Architecture
1Architecture: SoC Specification & Architecture
4Design: IP Integration, SoC RTL Design, Full-Chip DFT, Physical Design & Sign-off
3Verification: Full-Chip Verification, Full-Chip DFT, Physical Design & Sign-off
2Tape-out, build and release: Tape-out, Foundry & Mask
2Validation and characterisation: Packaging & Test, Bring-up & Silicon Validation
1Qualification: Qualification & Reliability
2Production and ramp: Production Ramp & Yield, Volume Production & Sustaining
1Sustaining and field support: Volume Production & Sustaining
1End of life: End of Life
1Planning and concept: IP Specification & Architecture
1Requirements and specification: IP Specification & Architecture
2Architecture: IP Specification & Architecture, Micro-architecture
4Design: Micro-architecture, RTL to Early Access, RTL Completion, IP DFT & Implementation Views
4Verification: RTL Completion, IP Verification, IP DFT & Implementation Views, IP Quality Checks
1Tape-out, build and release: IP Release & Hand-off
Validation and characterisation: no stage
1Qualification: IP Quality Checks
Production and ramp: no stage
1Sustaining and field support: IP Release & Hand-off
End of life: no stage
1Planning and concept: Specification & Process Selection
1Requirements and specification: Specification & Process Selection
2Architecture: Specification & Process Selection, Circuit & Block Design
3Design: Circuit & Block Design, Design Verification & Early Views, Physical Implementation
2Verification: Design Verification & Early Views, Physical Sign-off & Characterisation
3Tape-out, build and release: Physical Sign-off & Characterisation, Test Chip Tape-out, Quality Checks & Release
1Validation and characterisation: Silicon Validation & Reliability
2Qualification: Silicon Validation & Reliability, Quality Checks & Release
Production and ramp: no stage
1Sustaining and field support: Support, Porting & End of Support
1End of life: Support, Porting & End of Support
1Planning and concept: AMS Specification & Architecture
1Requirements and specification: AMS Specification & Architecture
1Architecture: AMS Specification & Architecture
2Design: Schematic & Circuit Design, Custom Layout
2Verification: AMS Verification, Post-Layout Verification & Sign-off
1Tape-out, build and release: Tape-out or SoC Hand-off
1Validation and characterisation: Silicon Characterisation
1Qualification: Production Test & Qualification
1Production and ramp: Production Test & Qualification
1Sustaining and field support: Production Test & Qualification
End of life: no stage
1Planning and concept: System Partitioning & Package Architecture
1Requirements and specification: System Partitioning & Package Architecture
2Architecture: System Partitioning & Package Architecture, Die-to-Die Interface Design
3Design: Die-to-Die Interface Design, Chiplet Design & Verification, Interposer & Substrate Design
1Verification: Multi-Die Sign-off
1Tape-out, build and release: Multi-Die Sign-off
3Validation and characterisation: Tape-out, Wafer Sort & Known-Good Die, Assembly, Final & System-Level Test
1Qualification: Package Qualification & Production Release
1Production and ramp: Package Qualification & Production Release
Sustaining and field support: no stage
End of life: no stage
1Planning and concept: Requirements & Device Selection
1Requirements and specification: Requirements & Device Selection
1Architecture: System & FPGA Architecture
3Design: RTL & HLS Design, Design Code Completion, Synthesis, Place & Route & Timing Closure
1Verification: Simulation & Verification
1Tape-out, build and release: Synthesis, Place & Route & Timing Closure
2Validation and characterisation: Board Bring-up & Integration, System Validation & Compliance
1Qualification: System Validation & Compliance
1Production and ramp: Production & Field Updates
1Sustaining and field support: Production & Field Updates
1End of life: Obsolescence & End of Life
1Planning and concept: Item Definition & Safety Planning
3Requirements and specification: Item Definition & Safety Planning, Hazard Analysis & Safety Goals, Functional & Technical Safety Concept
2Architecture: Functional & Technical Safety Concept, Safety Architecture & Hardware Design
2Design: Safety Architecture & Hardware Design, Safety Analyses: FMEDA, FTA & DFA
2Verification: Safety Analyses: FMEDA, FTA & DFA, Safety Verification & Fault Injection
1Tape-out, build and release: Implementation, Reliability Sign-off & Tape-out
1Validation and characterisation: Silicon Validation & Safety Mechanism Testing
2Qualification: AEC-Q100 Qualification, Confirmation Measures & Safety Case
2Production and ramp: Production Part Approval & Launch, Volume Production, Change Notification & Field Monitoring
1Sustaining and field support: Volume Production, Change Notification & Field Monitoring
1End of life: Long-term Supply & End of Life
1Planning and concept: Workload & Model Analysis
2Requirements and specification: Workload & Model Analysis, Performance Modelling & Co-design
2Architecture: Performance Modelling & Co-design, Architecture & Microarchitecture
5Design: RTL Design & Verification, Compiler, Runtime & Library Co-development, Physical Design & Package Sign-off, System Hardware: Boards, Power & Cooling, Scale-out Networking & Cluster Design
3Verification: RTL Design & Verification, Compiler, Runtime & Library Co-development, Physical Design & Package Sign-off
3Tape-out, build and release: Tape-out, System Hardware: Boards, Power & Cooling, Scale-out Networking & Cluster Design
2Validation and characterisation: Bring-up with the Software Stack, Benchmarking & Performance Tuning
1Qualification: Customer Workload Qualification
1Production and ramp: Production, Qualification & Launch
1Sustaining and field support: Software Releases, Sustaining & End of Support
1End of life: Software Releases, Sustaining & End of Support
1Planning and concept: Pathfinding & Exploration
1Requirements and specification: Technology Definition
1Architecture: Technology Definition
3Design: Process Module Development, Process Integration & Baseline, PDK & Design Enablement Development
1Verification: Process Integration & Baseline
2Tape-out, build and release: PDK & Design Enablement Development, Customer Design Enablement
1Validation and characterisation: Test Chips & Yield Learning
1Qualification: Process Reliability Qualification
2Production and ramp: Risk Production, High-Volume Manufacturing
1Sustaining and field support: Continuous Improvement & Derivatives
1End of life: Node End of Life
1Planning and concept: PDK Planning & Scope
1Requirements and specification: PDK Planning & Scope
Architecture: no stage
7Design: Design Rules & Rule Manual, Device Modelling, Physical Verification Decks, Parasitic Extraction & Technology Files, Layout Technology, PCells & Symbols, Standard Cell & Foundation IP Libraries, DFM Rules & Fill
3Verification: Physical Verification Decks, Parasitic Extraction & Technology Files, PDK Quality Assurance & Test Cases
2Tape-out, build and release: Pre-production Release & Design Starts, Production Release
1Validation and characterisation: Pre-production Release & Design Starts
Qualification: no stage
1Production and ramp: Production Release
1Sustaining and field support: Customer Support, Errata & Updates
1End of life: PDK End of Life
1Planning and concept: Software Requirements & Platform Planning
1Requirements and specification: Software Requirements & Platform Planning
1Architecture: Software Architecture & Hardware-Software Interface
5Design: Pre-silicon Development on Models & Emulation, Boot ROM & Secure Boot Chain, Firmware, Drivers & Board Support, Security Hardening, Signing & Update Design, SDK, Toolchains & Reference Software
2Verification: Pre-silicon Development on Models & Emulation, Security Hardening, Signing & Update Design
2Tape-out, build and release: Boot ROM & Secure Boot Chain, Production Release & Customer Enablement
2Validation and characterisation: Bring-up on First Silicon, Software Validation & Compliance
1Qualification: Software Validation & Compliance
1Production and ramp: Production Release & Customer Enablement
1Sustaining and field support: Maintenance, Updates & Vulnerability Response
1End of life: Final Release & End of Software Support
1Planning and concept: Test Strategy & DFT Alignment
2Requirements and specification: Test Strategy & DFT Alignment, Test Plan & Specification
Architecture: no stage
3Design: Test Hardware Development, Pattern Generation & Conversion, Pre-silicon Test Program Build
2Verification: Pre-silicon Test Program Build, Test Time & Cost Optimisation
1Tape-out, build and release: Release to Production
2Validation and characterisation: First Silicon Debug & Correlation, Characterisation & Limit Setting
1Qualification: Characterisation & Limit Setting
3Production and ramp: Test Time & Cost Optimisation, Release to Production, Yield & Test Data Monitoring
1Sustaining and field support: Sustaining & Program Maintenance
1End of life: Test End of Life
4Planning and concept: Problem & Market Thesis, Founding Team & Company Formation, Proof of Concept (Simulation & FPGA Prototype), Seed Funding
3Requirements and specification: Proof of Concept (Simulation & FPGA Prototype), Evaluation with Design Partners, Series A & Product Definition
1Architecture: Architecture & Partner Selection
2Design: Test Chip Design & Verification, Product Silicon Design & Verification
4Verification: Test Chip Design & Verification, Test Chip Sign-off, Product Silicon Design & Verification, Product Silicon Sign-off
2Tape-out, build and release: Test Chip Tape-out, Bring-up & Evaluation, Product Silicon Tape-out, Bring-up & Sampling
3Validation and characterisation: Test Chip Tape-out, Bring-up & Evaluation, Evaluation with Design Partners, Product Silicon Tape-out, Bring-up & Sampling
1Qualification: Qualification & First Revenue
2Production and ramp: Qualification & First Revenue, Scale-up
1Sustaining and field support: Scale-up
End of life: no stage
2Planning and concept: Use Case Identification, Tool Screening & Pilot Planning
2Requirements and specification: Use Case Identification, Tool Screening & Pilot Planning
Architecture: no stage
1Design: Flow Integration
1Verification: Human Review & Sign-off Accountability
1Tape-out, build and release: Flow Integration
1Validation and characterisation: Pilot on a Bounded Design
3Qualification: Tool Qualification, Data, IP & Licence Review, Updates & Requalification
2Production and ramp: Controlled First Use, Broad Deployment
2Sustaining and field support: Monitoring, Drift & Error Management, Updates & Requalification
1End of life: Retirement or Replacement
1Planning and concept: Density & Generation Roadmap
1Requirements and specification: Density & Generation Roadmap
1Architecture: Cell & Array Architecture
4Design: Cell & Array Architecture, Memory Process Technology, Die Design & Verification, Stacking, HBM & Packaging Integration
2Verification: Die Design & Verification, Layout & Tape-out
1Tape-out, build and release: Layout & Tape-out
3Validation and characterisation: Test Chips & Array Yield Learning, First Silicon & Characterisation, Stacking, HBM & Packaging Integration
2Qualification: Component Qualification (JEDEC), Customer & Platform Qualification
3Production and ramp: Stacking, HBM & Packaging Integration, Binning, Grading & Product Mix, High-Volume Ramp
1Sustaining and field support: Cost-Down Shrinks & Derivatives
1End of life: End of Life
1Planning and concept: Mission & Environment Requirements
2Requirements and specification: Mission & Environment Requirements, Radiation Hardening Approach & Technology Selection
2Architecture: Radiation Hardening Approach & Technology Selection, Architecture & Radiation Mitigation Design
1Design: Hardened Design & Implementation
1Verification: Verification & Fault Injection
1Tape-out, build and release: Radiation-aware Sign-off & Tape-out
2Validation and characterisation: Silicon Validation & Characterisation, Radiation Testing: Total Dose, Single Events & Displacement Damage
3Qualification: Radiation Testing: Total Dose, Single Events & Displacement Damage, Screening & Lot Acceptance, Qualification to Space Standards
2Production and ramp: Screening & Lot Acceptance, Flight Production, Long-term Supply & Obsolescence
1Sustaining and field support: Flight Production, Long-term Supply & Obsolescence
1End of life: End of Life & Archive
1Planning and concept: Application & Link Budget
1Requirements and specification: Application & Link Budget
2Architecture: Photonic & Electronic Co-design, Laser Integration Design
5Design: Photonic PDK & Component Libraries, Laser Integration Design, Photonic Circuit Design & Simulation, Layout & Photonic Verification, Packaging & Fibre Attach
1Verification: Layout & Photonic Verification
1Tape-out, build and release: Photonic MPW & Tape-out
2Validation and characterisation: Wafer-Level Optical Test, System Validation
2Qualification: Reliability Qualification, System Validation
2Production and ramp: Packaging & Fibre Attach, Production Ramp & Volume
1Sustaining and field support: Production Ramp & Volume
1End of life: End of Life
2Planning and concept: Application & Mission Requirements, Substrate & Epitaxy Supply
1Requirements and specification: Application & Mission Requirements
1Architecture: Device Design & Simulation
3Design: Device Design & Simulation, Process Development & Integration, Package & Module Development
Verification: no stage
Tape-out, build and release: no stage
2Validation and characterisation: Prototype Wafers & Characterisation, Application Evaluation & Reference Designs
3Qualification: Reliability & Ruggedness Qualification, Customer & Automotive Qualification, Wafer Size Transition
3Production and ramp: Substrate & Epitaxy Supply, Production Ramp, Wafer Size Transition
1Sustaining and field support: Cost-down & Sustaining
1End of life: End of Life
2Planning and concept: Business Case & Technology Choice, Site Selection
2Requirements and specification: Site Selection, Permitting & Incentives
1Architecture: Facility Design & Engineering
4Design: Facility Design & Engineering, Construction, Cleanroom & Facility Systems, Tool Procurement & Move-in
1Verification: Cleanroom & Facility Systems
1Tape-out, build and release: Tool Procurement & Move-in
2Validation and characterisation: Tool Install & Qualification, Process Transfer & First Wafers
2Qualification: Tool Install & Qualification, Process Transfer & First Wafers
2Production and ramp: Yield & Capacity Ramp, Operations & Continuous Improvement
2Sustaining and field support: Operations & Continuous Improvement, Expansion & End of Life
1End of life: Expansion & End of Life
1Planning and concept: Application & Sensing Requirements
1Requirements and specification: Application & Sensing Requirements
1Architecture: Transducer & Process Co-design
4Design: Transducer & Process Co-design, MEMS Process Development, Interface ASIC Co-design, Packaging That Admits the Environment
1Verification: Interface ASIC Co-design
2Tape-out, build and release: Interface ASIC Co-design, Test & Characterisation
3Validation and characterisation: Prototype Build & Model Correlation, Calibration & Trim, Test & Characterisation
1Qualification: Reliability & Qualification
2Production and ramp: Calibration & Trim, Production Ramp
1Sustaining and field support: Volume Production & Sustaining
1End of life: End of Life
1Planning and concept: Standards & Band Requirements
1Requirements and specification: Standards & Band Requirements
2Architecture: Architecture & Link Budget, Technology Choice
4Design: Technology Choice, Circuit & Electromagnetic Co-design, Layout & EM Extraction, Module & Antenna-in-Package Integration
1Verification: Layout & EM Extraction
1Tape-out, build and release: Sign-off & Tape-out
2Validation and characterisation: RF Characterisation & S-parameter Measurement, Module & Antenna-in-Package Integration
2Qualification: Regulatory & Conformance Testing, Qualification & Production Test
1Production and ramp: Production Ramp & Sustaining
1Sustaining and field support: Production Ramp & Sustaining
1End of life: End of Life
1Planning and concept: Technology Roadmap & Customer Drivers
1Requirements and specification: Concept & Test Vehicle Design
1Architecture: Concept & Test Vehicle Design
4Design: Materials & Substrate Development, Process Module Development, Equipment Selection & Qualification, Process Integration & Baseline
2Verification: Equipment Selection & Qualification, Process Integration & Baseline
1Tape-out, build and release: Package Design Kit & Assembly Design Rules
1Validation and characterisation: Pilot Line & Yield Learning
2Qualification: Reliability & Board-Level Qualification, Lead Customer Joint Development & Qualification
2Production and ramp: Pilot Line & Yield Learning, Capacity Ramp & Volume Manufacturing
1Sustaining and field support: Capacity Ramp & Volume Manufacturing
1End of life: Technology End of Life
1Planning and concept: Security Objectives & Asset Identification
2Requirements and specification: Threat Modelling & Attack Surface Analysis, Security Requirements & Compliance Targets
2Architecture: Threat Modelling & Attack Surface Analysis, Security Architecture
1Design: Secure Design & Implementation
1Verification: Security Verification
1Tape-out, build and release: Security Release
1Validation and characterisation: Silicon Security Evaluation
1Qualification: Certification & Assurance
1Production and ramp: Supply Chain Integrity & Secure Manufacturing
2Sustaining and field support: Vulnerability Reporting & Response, Security Updates & Maintenance
1End of life: End of Security Support
1Planning and concept: Customer Roadmap & Technology Requirements
1Requirements and specification: Customer Roadmap & Technology Requirements
1Architecture: Concept & System Architecture
2Design: Module & Subsystem Development, Software, Controls & Factory Automation
3Verification: Module & Subsystem Development, Software, Controls & Factory Automation, Prototype Build & Integration
2Tape-out, build and release: Prototype Build & Integration, Production Release & Manufacturing Ramp
2Validation and characterisation: Alpha Tool at a Lead Customer, Beta Tools at Customer Sites
1Qualification: Process Qualification with Customers
2Production and ramp: Production Release & Manufacturing Ramp, Shipment, Installation & Acceptance
2Sustaining and field support: Installed Base Service & Spare Parts, Upgrades, Field Changes & Derivatives
1End of life: End of Support
2Planning and concept: Intended Use, User Needs & Regulatory Strategy, Design & Development Planning and Quality System Set-up
2Requirements and specification: Intended Use, User Needs & Regulatory Strategy, Design Inputs & Hazard Analysis
1Architecture: System, Chip & Software Architecture with Risk Controls
2Design: Hardware & Chip Design and Implementation, Device Software Development to IEC 62304
3Verification: Hardware & Chip Design and Implementation, Device Software Development to IEC 62304, Design Verification: Function, Electrical Safety & EMC
2Tape-out, build and release: Hardware & Chip Design and Implementation, Device Software Development to IEC 62304
2Validation and characterisation: Design Verification: Function, Electrical Safety & EMC, Usability Engineering & Design Validation
1Qualification: Regulatory Submission & Conformity Assessment
1Production and ramp: Design Transfer & Production Release
1Sustaining and field support: Post-market Surveillance, Vigilance & Change Control
1End of life: Component Obsolescence, End of Support & Archive
2Planning and concept: Aircraft and System Requirements, Certification Planning
2Requirements and specification: Aircraft and System Requirements, Hardware and Software Requirements
1Architecture: Conceptual Design and Architecture
2Design: Detailed Design, Implementation and Integration
1Verification: Verification and Structural Coverage
1Tape-out, build and release: Implementation and Integration
Validation and characterisation: no stage
2Qualification: Environmental and Equipment Qualification, Certification Liaison and Final Compliance
1Production and ramp: Production and Production Approval
1Sustaining and field support: Continued Airworthiness and End of Support
1End of life: Continued Airworthiness and End of Support
1Planning and concept: Concept & Application Scope
3Requirements and specification: Concept & Application Scope, Hazard, Risk & Threat Analysis, Safety, Security & Compliance Requirements
1Architecture: Architecture & Safety Concept
2Design: Chip & Hardware Design, Firmware & Software Development
1Verification: Verification & Safety Analysis
1Tape-out, build and release: Production Release & Manufacturing
1Validation and characterisation: Validation & Type Testing
1Qualification: Assessment & Certification
1Production and ramp: Production Release & Manufacturing
2Sustaining and field support: Customer Integration, Operation & Maintenance, Long-Life Supply, Obsolescence & End of Life
1End of life: Long-Life Supply, Obsolescence & End of Life
5Planning and concept: Scope, Target Profile & Sponsorship, Gap Assessment & Process Baseline, Process Definition & Improvement Plan, Process Deployment, Tools & Training, Project Planning, Quality & Configuration Set-up
1Requirements and specification: Stakeholder, System, Software & Hardware Requirements
1Architecture: System, Software & Hardware Architecture
1Design: Detailed Design, Units & Unit Verification
2Verification: Detailed Design, Units & Unit Verification, Integration, Software & System Verification and Validation
1Tape-out, build and release: Integration, Software & System Verification and Validation
1Validation and characterisation: Integration, Software & System Verification and Validation
2Qualification: Formal Assessment, Rating, Capability Profile & Report
Production and ramp: no stage
1Sustaining and field support: Improvement Actions & Reassessment
End of life: no stage
2Planning and concept: Cybersecurity Management System & Organisation, Item Definition, Cybersecurity Plan & Interface Agreements
3Requirements and specification: Item Definition, Cybersecurity Plan & Interface Agreements, Threat Analysis & Risk Assessment (TARA), Cybersecurity Goals & Concept
2Architecture: Cybersecurity Goals & Concept, Cybersecurity Specification & Design
2Design: Cybersecurity Specification & Design, Implementation & Integration Verification
1Verification: Implementation & Integration Verification
Tape-out, build and release: no stage
1Validation and characterisation: Cybersecurity Validation & Penetration Testing
2Qualification: Cybersecurity Case, Assessment & Type Approval, Production & Release for Post-Development
1Production and ramp: Production & Release for Post-Development
3Sustaining and field support: Software Update Management & Update Campaigns, Monitoring & Vulnerability Management, Incident Response & Remediation
1End of life: End of Cybersecurity Support & Decommissioning
1Planning and concept: Plan & Define the Program
1Requirements and specification: Plan & Define the Program
1Architecture: Product Design & Development
2Design: Product Design & Development, Process Design & Development
1Verification: Product Design & Development
2Tape-out, build and release: Process Design & Development, PPAP Submission & Approval
1Validation and characterisation: Product & Process Validation
2Qualification: Product & Process Validation, PPAP Submission & Approval
1Production and ramp: Launch & Safe Launch
2Sustaining and field support: Feedback, Assessment & Corrective Action, Change & Requalification
1End of life: End of Production & Service
2Planning and concept: Context, Scope & Leadership, Gap Assessment & QMS Planning
1Requirements and specification: Gap Assessment & QMS Planning
Architecture: no stage
1Design: Process Design & Documentation
2Verification: Internal Audits, Management Review
1Tape-out, build and release: Implementation & Records
Validation and characterisation: no stage
1Qualification: Certification Audit
2Production and ramp: Implementation & Records, Operation, Problem Solving & Improvement
3Sustaining and field support: Operation, Problem Solving & Improvement, Surveillance Audits, Recertification & Transition
End of life: no stage
1Planning and concept: System Requirements & Use Cases
2Requirements and specification: System Requirements & Use Cases, System Architecture & Partitioning
2Architecture: System Architecture & Partitioning, Virtual Prototyping & Early Software
4Design: Virtual Prototyping & Early Software, Board & Enclosure Design, Emulation & FPGA Prototyping, Software & Firmware Development
3Verification: Emulation & FPGA Prototyping, Software & Firmware Development, Prototype Build & System Integration
1Tape-out, build and release: Prototype Build & System Integration
1Validation and characterisation: Design Validation
2Qualification: Certification & Regulatory Approval, Production Validation & Release
2Production and ramp: Production Validation & Release, Field Support, Updates & Sustaining
1Sustaining and field support: Field Support, Updates & Sustaining
1End of life: End of Life & End of Support
2Planning and concept: Platform Strategy & Definition, Roadmap & Derivative Planning
2Requirements and specification: Platform Strategy & Definition, Reference Architecture & Variability
2Architecture: Reference Architecture & Variability, Virtual Platform & Pre-silicon Models
4Design: Virtual Platform & Pre-silicon Models, Reusable IP & Subsystems, Software Platform & Tools, Derivative Product Development
4Verification: Reusable IP & Subsystems, Software Platform & Tools, Emulation & FPGA Prototyping, Derivative Product Development
2Tape-out, build and release: Platform Release & Reuse Enablement, Derivative Product Development
1Validation and characterisation: Lead Product Integration & Validation
Qualification: no stage
Production and ramp: no stage
1Sustaining and field support: Long-term Support & Platform Evolution
1End of life: Platform Retirement
1Planning and concept: Device Family Definition
2Requirements and specification: Device Family Definition, Fabric Architecture & Exploration
3Architecture: Fabric Architecture & Exploration, Hard IP Selection & Integration, Configuration & Bitstream Security
4Design: Hard IP Selection & Integration, Configuration & Bitstream Security, Tile Design & RTL, Place-and-Route & Timing Software
2Verification: Device Verification, Place-and-Route & Timing Software
2Tape-out, build and release: Physical Design & Tape-out, Speed Grades & Timing Data Release
2Validation and characterisation: Silicon Bring-up & Characterisation, Speed Grades & Timing Data Release
1Qualification: Qualification & Production Release
1Production and ramp: Family Roll-out & Derivatives
1Sustaining and field support: Software Releases, Long-term Supply & End of Life
1End of life: Software Releases, Long-term Supply & End of Life
2Planning and concept: Platform Definition, Customer Design Intake & Feasibility
3Requirements and specification: Platform Definition, Base Array Architecture, Customer Design Intake & Feasibility
1Architecture: Base Array Architecture
4Design: Base Array Design, Base Array Design Completion, FPGA Prototype Conversion, Customer Design Implementation
6Verification: Base Array Design, Base Array Design Completion, Base Array Verification & Design Kit, FPGA Prototype Conversion, Customer Design Implementation, Customer Design Closure & Sign-off
3Tape-out, build and release: Base Array Verification & Design Kit, Base Layer Tape-out & Wafer Banking, Custom Layer Tape-out
2Validation and characterisation: Base Array Validation & Qualification, Samples, Qualification & Customer Approval
2Qualification: Base Array Validation & Qualification, Samples, Qualification & Customer Approval
1Production and ramp: Production & Supply
1Sustaining and field support: Platform Sustaining & End of Life
1End of life: Platform Sustaining & End of Life
Lifecycles
36
36
32
36
35
34
33
34
32
35
30
Gates held
105
85
68
118
75
71
106
103
96
56
61
Key risks arising
115
136
124
181
95
71
66
67
124
104
27
Hand-offs in
42
77
17
61
0
1
40
53
24
50
36
Hand-offs out
24
59
58
13
14
29
29
47
30
55
43