Non-destructive inspection of packages with scanning acoustic microscopy: C-SAM and TAMI modes to detect delamination, voids and cracks at die attach, mold and underfill interfaces, including transducer selection and gate setting for the layer of interest.
No statement on what tools can do has been recorded for this skill yet.
The Hub knows of no registered course, programme or certification for this skill yet.
Note from the research register: Package reliability or FA lab role; vendor training on the SAM tool plus mentored interpretation against destructive confirmation.
Register version 1.