Flip-Chip Process Engineer

Project

Work done for a product or program.

• Develop mass reflow and thermocompression bonding processes, tuning bond head profile, force, ramp rate and non-conductive paste behaviour.
• Optimise flux type, application method (dip, spray, jet) and residue cleaning to achieve full wetting without corrosion risk.
• Control capillary underfill dispense patterns, flow time, fillet geometry and cure to eliminate voids and incomplete fill.
• Qualify non-conductive film and non-conductive paste flows for fine-pitch and stacked applications where capillary underfill cannot flow.
• Establish inspection strategy for joint quality with 3D X-ray, CT, acoustic microscopy and electrical open/short continuity screens.
• Root-cause and eliminate non-wet opens, head-in-pillow, solder bridging, cold joints, underfill voids and die tilt.
• Manage bump-to-pad co-planarity interaction with package warpage, defining pre-bake and warpage-compensated bonding approaches.
• Qualify and sustain flip-chip bonders and reflow ovens for capability, and define preventive maintenance and calibration requirements.
• Support lid attach, stiffener attach and TIM application as part of the post-flip-chip module flow.
• Drive throughput and cost improvement through gang bonding, reduced bonding time and higher underfill dispense speed.

Function

Work that keeps the discipline running: methods, tools, suppliers and people.

• Maintain process specifications, control plans and work instructions.General
• Work with equipment and material suppliers on performance and quality.General
• Improve cost, cycle time and yield across the operation.General

Project

1. Produce and hand over the role's key deliverables
   • Flip-chip attach process specification and recipe set
   • Underfill dispense pattern and cure profile definition
   • Joint quality inspection plan and acceptance criteria
   • Bonder and reflow oven capability qualification reports
   • Defect Pareto and corrective action reports
   • PFMEA and control plan for flip-chip operations
2. Introduce new productsGeneral
   • Set up and qualify the process
   • Transfer it to production
   • Support the ramp
3. Keep production in controlGeneral
   • Monitor statistical process control charts
   • Contain excursions
   • Close corrective actions

Function

1. Maintain the process baselineGeneral
   • Keep specifications and control plans current
   • Manage changes through change control
2. Improve the operationGeneral
   • Reduce cost and cycle time
   • Work with suppliers on quality