Putting the die into discrete packages and power modules that can carry the current, remove the heat and keep stray inductance low: substrates, die attach by solder or sintering, top-side interconnect, encapsulation, baseplates and cooling. It runs before application evaluation and qualification, because evaluation boards and qualification lots are built in the target package; the stage releases the package or module design with a first module datasheet, and module-level qualification, such as power cycling and thermal cycling and for automotive modules guidelines such as AQG 324, follows device qualification in Reliability & Ruggedness Qualification.
This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.
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