Process · Fab Ops, Yield & Metrology
Run-to-run control
An APC technique that adjusts the next run's recipe settings based on metrology from previous runs, compensating for drift such as etch rate decline or lens heating without waiting for an SPC alarm.
- Also known as
- R2R control, Lot-to-lot control
- Type
- Process
- Domain
- Fab Ops, Yield & Metrology, Process control
Notes
Exponentially weighted moving average controllers are the standard implementation in litho and etch.
Related terms
Part of the Fab Ops, Yield & Metrology glossary, with every term in the topic and the lifecycles, tools and standards that use them.
Where it appears on the Hub
Used on 3 pages of the Hub. In each group, the pages that mention it most come first.
Skills
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