Acronym · Packaging & Assembly
PoP (Package on Package)
A vertical assembly in which one finished package, typically a memory stack, is soldered on top of another, typically an application processor. The two packages are tested separately before being joined, which protects yield.
- Also known as
- Package-on-package
- Type
- Acronym
- Domain
- Packaging & Assembly, Package families
Notes
Standard construction for smartphone application processors with LPDDR on top, and a classic case where warpage control determines assembly yield.
Related terms
Part of the Packaging & Assembly glossary, with every term in the topic and the lifecycles, tools and standards that use them.
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