Technology · Packaging & Assembly
Memory-on-logic
Stacking a memory die, typically SRAM or DRAM, directly above or below a logic die so that data moves vertically over very short connections instead of across a package.
It attacks the bandwidth and energy cost of off-chip memory access.
- Also known as
- Memory on logic stacking, 3D cache
- Type
- Technology
- Domain
- Packaging & Assembly, Memory stacking
Notes
AMD's 3D V-Cache is the highest volume commercial example, adding stacked SRAM over the compute die's cache.
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