Acronym · Packaging & Assembly
TMV (Through Mold Via)
A conductive via passing vertically through the moulding compound of a package, formed by laser drilling and filling or by pre-placed copper posts. It carries signals from the substrate up to a package stacked on top.
- Also known as
- Through mould via, TMV PoP
- Type
- Acronym
- Domain
- Packaging & Assembly, Through-silicon via
Notes
TMV replaced perimeter interposer rings in package on package and let mobile PoP stacks get thinner and finer pitch.
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Part of the Packaging & Assembly glossary, with every term in the topic and the lifecycles, tools and standards that use them.
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