Reading spatial patterns in wafer sort and inline defect maps — edge, ring, radial, scratch, reticle-field and cluster signatures — and mapping each to a process step, tool, chamber or handling cause, increasingly with automated classification models.
No statement on what tools can do has been recorded for this skill yet.
The Hub knows of no registered course, programme or certification for this skill yet.
Note from the research register: Yield engineering role with access to wafer maps and tool commonality data; learned by pattern exposure over many excursions plus the tool owners' feedback.
Register version 1.