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Tri-Stack-PIM: A Heterogeneous Multi-Die 3D-Integrated Processing-in-Memory Architecture for Efficient LLM Inference
By The Semiconductor Hub news desk ·
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Large language model (LLM) inference during autoregressive decoding is fundamentally memory-bandwidth-bound. Existing three-dimensional (3D) stacked processing-in-memory (PIM) architectures alleviate the off-chip bandwidth wall, yet remain constrained by several limitations: physical layer (PHY), controllers, and direct memory access (DMA) engines compete with arithmetic units for advanced-node base-die area; hybrid-bonding keep-out zones fragment the base-die floorplan and impede physical desi…
Read at arXiv cs.AR (Hardware Architecture)Source: arXiv cs.AR (Hardware Architecture), published . The summary is the Hub's own; the full story is at the source. Report a rights or accuracy concern