Packaging & Test
As AI becomes capable of understanding long documents, answering complex questions, and performing multiple tasks, the demands on the semiconductors behind...
According to Yole Group’s Status of the Back-End Equipment Industry 2026 report, equipment revenue will grow from $8.1 billion in 2025 to $9.5 billion in 2026 and $10.6 billion in 2027. The post Back-…
Samsung’s Portable SSD P9 is the new USB4 external drive to beat. It feels premium and performed very well in our testing. But you’ll have to pay a lot for it, or any similarly performing drive, these…
TSMC is reportedly weighing a price increase of up to 20% for its CoWoS advanced packaging technology as Nvidia’s Blackwell and upcoming Rubin chips intensify pressure on capacity. Equipment deliverie…
Microsoft has begun testing the option to enable Intel's Advanced Performance Extensions, or APX, which will bring a performance boost to some apps — although no chips with APX support are available a…
Semianalysis identifies ASML as the biggest threat to Besi’s largest growth market, hybrid bonding. Most strikingly, the Duiven-based company felt compelled to respond to the analysis with a statement…
Nvidia is committing billions to expand substrate, co-packaged optics, advanced packaging, and chip-testing capacity through 2028, reserving capacity at nearly every stage of its AI accelerator supply…
