Chip lifecycle / Package technology lifecycle / Lead Customer Joint Development & Qualification

Lead Customer Joint Development & Qualification

Building and qualifying lead customers' real products on the new technology under the joint development agreement: co-design reviews against the design kit, sample builds on the pilot line, the customer's product-level qualification and system evaluation, failure analysis and corrective actions, and the customer's approval for volume.

Where this stage sits

This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.

Stage

^A09 Pilot Line & Yield Learning

^A10 Lead Customer Joint Development & QualificationYou are here

^A11 Capacity Ramp & Volume Manufacturing

Business and customers milestones

LCSLead customer samples CQCustomer product qualified TRTechnology refresh review DNTechnology discontinuance notice

Technology milestones

DKRPackage design kit release PLRPilot line ready YRTR3Yield readiness HVMVolume production release RCRamp complete

Technology business and roadmap^O

Kit released

Production

Customer engagement and joint development^A

Kit released

Production

Package architecture and co-design^A

Kit released

Production^A

Materials and substrate engineering^A

Kit released

Production

Wafer-level processes: bumping, RDL and fan-out^A

Kit released

Interposer, TSV and hybrid bonding^D

Kit released^D

Assembly: die attach, flip chip, underfill and moulding^A

Kit released^A

Production

Process integration^A

Kit released

Production

Equipment engineering^A

Kit released

Production

Reliability and board-level qualification^A

Kit released

Production^A

Test and known good die^A

Kit released^A

Production

Package design kit and assembly design rules^A

Kit released

Production

Pilot line, yield and manufacturing operations^A

Kit released^A

Production

Quality systems and change control^D

Kit released

Production^D

Supply chain and capacity^A

Kit released

Production

KeyPlannedTechnology plannedConceptConcept selectedBaselineBaseline frozenQualifiedQualified on test vehiclesKit releasedDesign kit releasedProductionProduction readyFaded block: Held, the status shown before it still standsFreeze or sign-off pointMilestone for one item; the rest of the work carries onMilestone gateTRTechnical readiness review (TR): a gate that checks the technology is ready before the next commitment.You are here: Lead Customer Joint Development & QualificationAI impactDisruption (red)Augmentation (blue)Opportunity (green)How AI is changing the workWhat the steps mean What the codes mean

Show this chart as a list

Stages

Pilot Line & Yield Learning^A
Lead Customer Joint Development & Qualification (this stage)^A
Capacity Ramp & Volume Manufacturing^A

Business and customers milestones

Technology milestones

Package design kit release (DKR)
Pilot line ready (PLR)
Yield readiness (YR) (technical readiness review TR3)
Volume production release (HVM)
Ramp complete (RC)

Disciplines

Technology business and roadmap^O
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Volume terms prepared as the kit opens to customers.
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Volume terms agreed, the technology reviewed in production, then discontinuance and last-time buys planned and announced.
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Volume terms agreed, the technology reviewed in production, then discontinuance and last-time buys planned and announced.
Customer engagement and joint development^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Customer design starts recorded on the released kit and customer samples planned.
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Lead customer product qualified and approved, then the customer supported through the ramp.
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Lead customer product qualified and approved, then the customer supported through the ramp.
Package architecture and co-design^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Reference package designs released with the kit and customer co-design reviews held.
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Co-design reviews closed as the customer product is qualified.^A
Materials and substrate engineering^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Materials held to their qualified specifications as the kit is released and the pilot line runs.
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Second sources planned for volume.
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Second sources planned for volume.
Wafer-level processes: bumping, RDL and fan-out^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Modules running on the pilot line under the frozen baseline.
Interposer, TSV and hybrid bonding^D
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Bonding defect learning run on the pilot line towards yield readiness.^D
Assembly: die attach, flip chip, underfill and moulding^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Assembly work instructions released for the pilot line.^A
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Assembly running on the qualified flow for customer products and volume.
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Assembly running on the qualified flow for customer products and volume.^A
Process integration^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Baseline controlled on the pilot line, with a process change log.
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Volume process control plan released.
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Volume process control plan released.
Equipment engineering^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Pilot line equipment released.
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Capacity tools installed for volume.
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Capacity tools installed for volume.
Reliability and board-level qualification^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Qualification results supporting the kit rules, with customer product qualification planned.
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Customer product reliability results final, then reliability monitored in volume.^A
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Customer product reliability results final, then reliability monitored in volume.
Test and known good die^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Known good die and incoming test requirements final for the pilot line.^A
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Customer product test data final and production test released.
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Customer product test data final and production test released.
Package design kit and assembly design rules^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Package design kit released with final assembly design rules, then customers supported in design.
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Kit updates and production rules released under change control.
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Kit updates and production rules released under change control.; Production rules under change control
Pilot line, yield and manufacturing operations^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Pilot line ready and yield learned towards yield readiness.^A
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Customer samples built, volume released and ramped, then final builds and the process archive at end of life.
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Customer samples built, volume released and ramped, then final builds and the process archive at end of life.
Quality systems and change control^D
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Quality agreements prepared for the lead customer.
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Customer quality agreement and compliance file released, then change control, change notices and discontinuance notices run.^D
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Customer quality agreement and compliance file released, then change control, change notices and discontinuance notices run.^A
Supply chain and capacity^A
- Pilot Line & Yield Learning: maturity Kit released, Design kit released. Capacity plan built from the yield model on the pilot line.
- Lead Customer Joint Development & Qualification: maturity Production, Production ready. Supply agreements signed and ramp supply delivered, then material run-out planned at end of life.
- Capacity Ramp & Volume Manufacturing: maturity Production, Production ready. Supply agreements signed and ramp supply delivered, then material run-out planned at end of life.^A

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