1. Purpose and scope
A package technology earns its place when a customer's product ships on it. In this stage lead customers design their real products to the released kit, the provider and the customer review each design together, samples are built on the pilot line, and the customer qualifies the product and evaluates it in its system. Problems found are analysed by both sides and corrected, sometimes in the customer's design and sometimes in the provider's process.
The joint development agreement governs the work: what data each side shares, who owns which results, who pays for builds and how decisions are escalated. Public industry analysis describes the joint development process for advanced packaging as running from feasibility through to mass production over a long period, with customers tending to stay with the provider they chose, so this stage often sets a relationship that lasts for several product generations.
In scope: joint design reviews, rule exceptions, sample build plans, sample builds, customer product test and qualification data, customer product reliability results, failure analysis, the compliance file, the customer quality agreement and the customer approval record. Out of scope: the customer's own chip development, which follows its SoC, chiplet or accelerator lifecycle.
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