Chip lifecycle / MEMS and sensors lifecycle / Packaging That Admits the Environment

Packaging That Admits the Environment

Designing a package that protects the MEMS and ASIC while letting the quantity being sensed reach the transducer: acoustic or pressure ports, protective membranes and gels, optical windows for image and light sensors, open cavities for gas and humidity, sealed cavities for inertial sensors, and stress isolation so the package does not become the signal.

Where this stage sits

This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.

Stage

^A05 Prototype Build & Model Correlation

^A06 Packaging That Admits the EnvironmentYou are here

^A07 Calibration & Trim

Business and customers milestones

ESEngineering samples

Sensor engineering milestones

ATInterface ASIC tape-out FWFirst MEMS and ASIC wafers MCModels correlated to prototypes PFPackage design freeze CMCalibration method approved

Product and business management^O

0.5

0.8

Sensor systems and applications^A

0.5

0.8

MEMS transducer design^O

0.8

1.0

Freeze

Multiphysics modelling and simulation^A

0.8^A

1.0

MEMS process development and integration^A

0.8^D

1.0

Interface ASIC design^A

0.8

1.0

Sensor co-simulation and verification^A

0.8

1.0

Sensor firmware, algorithms and drivers^O

0.5

0.8

1.0^O

Packaging and environmental interface^A

0.8

1.0^A

Freeze

Calibration and trim^A

0.8

1.0^A

Test and characterisation^D

0.8

1.0

Reliability and qualification^A

0.5

0.8

Interface conformance and product compliance^D

0.5

0.8

Quality and customer quality^A

0.3

0.5

Manufacturing, supply and ramp^A

0.5

0.8

Key0.0Planned0.3Concept drafted0.5Modelled0.8Correlated1.0CompleteFreezeFrozenFaded block: still at the step shown before it, Held below Complete or Maintained under change control once complete or frozenFreeze or sign-off pointMilestone for one item; the rest of the work carries onMilestone gateYou are here: Packaging That Admits the EnvironmentAI impactDisruption (red)Augmentation (blue)Opportunity (green)How AI is changing the workWhat the steps mean What the codes mean

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Stages

Prototype Build & Model Correlation^A
Packaging That Admits the Environment (this stage)^A
Calibration & Trim^A

Business and customers milestones

Engineering samples (ES)

Sensor engineering milestones

Disciplines

Product and business management^O
- Prototype Build & Model Correlation: maturity 0.5, Modelled. Sample plan agreed with lead customers and engineering samples out with the evaluation kit.
- Packaging That Admits the Environment: maturity 0.5, Modelled. Sample plan agreed with lead customers and engineering samples out with the evaluation kit.
- Calibration & Trim: maturity 0.8, Correlated. Lead customers designing in on calibrated samples; launch, pricing and supply commitments drafted.
Sensor systems and applications^A
- Prototype Build & Model Correlation: maturity 0.5, Modelled. Evaluation kit and preliminary datasheet planned around the register map, then released with the engineering samples.

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