Chip lifecycle / Checklists / MEMS and sensors lifecycle / Packaging That Admits the Environment: stage exit checklist

Packaging That Admits the Environment: stage exit checklist

Exit check for Packaging That Admits the Environment before its gate: exit criteria, work products, quality checks, decisions and hand-offs. Owned by the package Architect.

1. Exit criteria

MustThe package design is final, with port, seal or window details.
Owner
Package Architect
MustPackage stress sensitivity is shown to be within the error budget across temperature and board mounting.
Owner
Package Architect
MustThe stress isolation design is final.
Owner
Package Architect
MustThe assembly process flow is released for qualification builds.
Owner
Package Architect
MustEarly reliability results on prototypes show no unexplained failure mechanisms.
Owner
Package Architect

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