Turning tested dies into packaged products: known good die test, through-silicon vias, thinning, die stacking and bonding for HBM and stacked DRAM or NAND packages, stack test and repair, thermal and warpage control, and the package or stack handed to system makers and to the package and chiplet teams who integrate HBM beside a processor.
This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.
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