Chip lifecycle / Checklists / Power and compound lifecycle / Device design to process integration: hand-off checklist

Device design to process integration: hand-off checklist

Hands the frozen design and masks to process integration. The device design lead runs it with the process integration lead.

1. Hand-off package

MustDevice structure targets are handed over with their tolerances.
Evidence
Device structure targets
Owner
GaN and SiC Power Device Engineer
MustMask data and the mask order are handed over.
Evidence
Mask layout
Owner
High-Voltage and Power Discrete Design Engineer
MustThe test structure map and measurement intent are handed over.
Evidence
Mask layout
Owner
Process Integration Engineer

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