Acronym · Packaging & Assembly
InFO (Integrated Fan-Out)
TSMC's fan-out wafer level packaging family, which builds redistribution layers directly over moulded dice without a laminate substrate. Variants add through-mould vias for package stacking or wider routing for multi-die modules.
- Also known as
- InFO-PoP, InFO_oS
- Type
- Acronym
- Domain
- Packaging & Assembly, Advanced packaging
Notes
Adopted for Apple application processors from the A10 generation, which made fan-out a mainstream high volume technology.
Related terms
Part of the Packaging & Assembly glossary, with every term in the topic and the lifecycles, tools and standards that use them.
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