Process · Packaging & Assembly
Temporary bonding and debonding
Attaching a device wafer to a rigid carrier with a releasable adhesive so it can be thinned to tens of micrometres and processed, then separating it afterwards by laser, thermal slide or mechanical release without cracking the fragile wafer.
- Also known as
- TBDB, Carrier bonding
- Type
- Process
- Domain
- Packaging & Assembly, Through-silicon via
Notes
An unglamorous but critical enabler; debond yield often dominates the cost of any thin-wafer 3D or fan-out flow.
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