Component · Packaging & Assembly
RDL interposer
A carrier made only of redistribution layers, formed on a temporary carrier and then released, with no silicon body or through-silicon vias. It provides interposer-class wiring density without the cost and thickness of a silicon slab.
- Also known as
- Fan-out interposer, Coreless RDL interposer
- Type
- Component
- Domain
- Packaging & Assembly, Advanced packaging
Notes
TSMC's CoWoS-R and similar offerings use this construction to relax reticle and cost limits on very large modules.
Related terms
Part of the Packaging & Assembly glossary, with every term in the topic and the lifecycles, tools and standards that use them.
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